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    • 2. 发明专利
    • Semiconductor device and its manufacturing method
    • 半导体器件及其制造方法
    • JP2004071677A
    • 2004-03-04
    • JP2002225765
    • 2002-08-02
    • Fujio MasuokaMatsushita Electric Ind Co Ltd松下電器産業株式会社舛岡 富士雄
    • DOI HIROYUKIOKUDA YASUSHIMIMURO KENMATSUO ICHIROIKEDA NOBUYUKIMASUOKA FUJIO
    • H01L29/866
    • PROBLEM TO BE SOLVED: To restrain variation with time in a reverse breakdown voltage obtained by the reverse breakdown voltage of a pn junction in a semiconductor device functioning as a constant voltage element.
      SOLUTION: The reverse breakdown voltage in a diode is adjusted. The diode is formed at a portion to an n-type impurity diffusion layer 14 formed toward the inside from the surface of an active region 13 of a p-type semiconductor substrate 11. For that purpose, a p-type impurity diffusion layer 18 is provided directly below the n-type impurity diffusion layer 14. Additionally, the p-type impurity diffusion layer 18 is formed separately from a device isolation insulating film 12. As a result, the reverse junction breakdown position of the diode can be separated from the device isolation insulating film 12, the injection of a carrier being generated by a breakdown phenomenon to a device isolation oxide film is restrained, and hence the variation with time in the reverse breakdown voltage is restrained.
      COPYRIGHT: (C)2004,JPO
    • 要解决的问题:在用作恒定电压元件的半导体器件中由pn结的反向击穿电压获得的反向击穿电压中抑制随时间的变化。

      解决方案:调整二极管中的反向击穿电压。 二极管形成在从p型半导体基板11的有源区域13的表面向内侧形成的n型杂质扩散层14的一部分上。为此,p型杂质扩散层18为 设置在n型杂质扩散层14的正下方。此外,p型杂质扩散层18与器件隔离绝缘膜12分开形成。结果,二极管的反接点击穿位置可以与 器件隔离绝缘膜12,抑制通过击穿现象产生的载体向器件隔离氧化膜的注入,从而抑制反向击穿电压随时间的变化。 版权所有(C)2004,JPO