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1. 发明专利

JP2006093250A Structure of thin chip electrolytic capacitor 审中-公开
标题翻译：薄片电解电容器的结构
公开(公告)号：JP2006093250A
公开(公告)日：2006-04-06
申请号：JP2004274316
申请日：2004-09-22
申请人： Chieh-Fu Lin , 杰夫林
发明人： LIN CHIEH-FU
IPC分类号： H01G9/004 , H01G9/06 , H01G9/08 , H01G9/10
摘要： PROBLEM TO BE SOLVED: To provide a structure of a thin chip electrolytic capacitor wherein an electronic unit can be made small in thickness.
SOLUTION: The main body 310 is provided with two concave tanks, an arrangement tanks 311 and a segregated space 312 made of dielectric substance therein, a segregation plate 313 between the two concave tanks, and a hole 314 corresponding to the lead wire terminal 331 of a dielectric 330 on a segregation plate 313. A bottom seat 320 covers and seals the segregated space 312 and is provided with a hole 321 corresponding to the hole 314. The dielectric 330 is attached to the dielectric arrangement tank 311 and is provided with two lead wire terminals 331, which is projected into the facing holes 314 and 321 of the segregation plate 313 and the bottom seat 320. A cover plate seals the main body 310 by a top cover 340.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种薄片式电解电容器的结构，其中电子单元可以制造得较小。解决方案：主体310设置有两个凹槽，排列槽311和由其中的介电物质制成的分隔空间312，两个凹槽之间的偏析板313和与引线相对应的孔314 位于偏析板313上的电介质330的端子331.底座320覆盖并密封偏析空间312，并且设置有与孔314对应的孔321.电介质330附接到电介质布置罐311，并且设置具有两个引线端子331，其被突出到偏析板313和底座320的相对孔314和321中。盖板通过顶盖340密封主体310.权利要求（C） 2006年，JPO＆NCIPI

2. 发明专利

JP3533158B2 Surface mount capacitors 有权
公开(公告)号：JP3533158B2
公开(公告)日：2004-05-31
申请号：JP2000259560
申请日：2000-08-29
申请人：杰夫林
发明人：杰夫林
IPC分类号： H01G9/08 , H01G9/004 , H01G9/10 , H01G9/12

3. 发明专利

JP2003068587A Structure of ic chip capacitor 审中-公开
标题翻译： IC芯片电容器结构
公开(公告)号：JP2003068587A
公开(公告)日：2003-03-07
申请号：JP2002001372
申请日：2002-01-08
申请人： Ri Ketsuo , 杰夫林
发明人： LIN CHIEH-FU
IPC分类号： H01G4/224 , H01G9/00 , H01G9/08 , H01G9/10
CPC分类号： H01G4/224 , H01G9/08 , H01G9/10
摘要： PROBLEM TO BE SOLVED: To provide an IC chip capacitor for enhancing hermetic sealing performance of a capacitor.
SOLUTION: The structure of an IC chip capacitor principally comprises a housing, an electric medium, an elastic body, and a cover plate. The housing forms the outer case of the capacitor and has an internal receiving chamber exhibiting open state. The electric medium is placed in the receiving chamber of the housing and provided with two leads. The elastic body is provided with two holes for passing the two leads of the electric medium and placed on the electric medium. The cover plate is provided with two holes for passing the two leads of the electric medium and placed on the elastic body. Outside diameter of the elastic body is slightly larger than the inside diameter of the inner wall of the receiving chamber and the elastic body is fitted using a jig after being compressed.
COPYRIGHT: (C)2003,JPO
摘要翻译：要解决的问题：提供一种用于提高电容器的气密密封性能的IC片式电容器。解决方案：IC芯片电容器的结构主要包括壳体，电介质，弹性体和盖板。壳体形成电容器的外壳，并且具有呈现开放状态的内部接收室。电介质被放置在壳体的接收室中并且设置有两个引线。弹性体设置有用于使电介质的两个引线通过并放置在电介质上的两个孔。盖板设置有用于使电介质的两个引线通过并放置在弹性体上的两个孔。弹性体的外径略大于接纳室的内壁的内径，弹性体在压缩后使用夹具进行装配。

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