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1. 发明申请

WO2004034759A1 部品内蔵配線板、部品内蔵配線板の製造方法审中-公开
标题翻译：接线板配套组件及其制造方法
公开(公告)号：WO2004034759A1
公开(公告)日：2004-04-22
申请号：PCT/JP2003/012749
申请日：2003-10-06
申请人：大日本印刷株式会社 , ディー・ティー・サーキットテクノロジー株式会社 , 今村達郎 , 山口雄二 , 篠崎和広 , 柴崎聡 , 福岡義孝 , 平井浩之 , 島田修 , 笹岡賢司 , 松村健一
发明人：今村達郎 , 山口雄二 , 篠崎和広 , 柴崎聡 , 福岡義孝 , 平井浩之 , 島田修 , 笹岡賢司 , 松村健一
IPC分类号： H05K3/46
CPC分类号： H05K1/184 , H05K1/023 , H05K1/186 , H05K3/3442 , H05K3/4602 , H05K2201/10636 , Y02P70/611 , Y10T29/49126 , Y10T29/4913 , Y10T29/49146 , Y10T29/49147 , Y10T29/49155 , Y10T29/49165 , Y10T29/49789 , Y10T29/49798
摘要： A wiring board incorporating components, and its producing process, in which the mounting density of components can be enhanced furthermore without sacrifice in reliability. The wiring board incorporating components comprises an electric/electronic component (33) having conductive layers (34, 35) formed in the thickness direction of the board while being buried and not to be exposed to the upper and lower surfaces of the board and a terminal buried in the board to face the buried conductive layer, members (36, 37) provided in the gap between the terminal of the buried electric/electronic component and the conductive layer and connecting the terminal with the conductive layer electrically/mechanically, and upper and lower insulating layers (11, 15) provided to adhere to the buried electric/electronic component from above and below in the thickness direction while covering the outer surface thereof except for the part being connected with the connecting.
摘要翻译：包含组件的布线板及其制造方法，其中可以进一步增强部件的安装密度，而不牺牲可靠性。配有组件的布线板包括电子/电子部件（33），其具有在板的厚度方向上形成的导电层（34,35），同时被埋设并且不暴露于电路板的上表面和下表面埋在电路板中以面对埋入的导电层，设置在埋入的电气/电子部件的端子与导电层之间的间隙中的构件（36,37），并将端子与导电层电/机械地连接，以及上和下部绝缘层（11,15），其设置成在覆盖其外表面的同时从厚度方向的上下方向附着到埋入的电子电子部件，除了与连接部分连接的部分之外。

2. 发明专利

JP2006119934A Ic card frame member, and ic card reader/writer with ic card frame member 有权
标题翻译： IC卡框架会员和IC卡读卡器/写卡与IC卡框架会员
公开(公告)号：JP2006119934A
公开(公告)日：2006-05-11
申请号：JP2004307370
申请日：2004-10-21
申请人： Dt Circuit Technology Co Ltd , ディー・ティー・サーキットテクノロジー株式会社
发明人： SHIMADA OSAMU
IPC分类号： G06K17/00 , B42D15/10
摘要： PROBLEM TO BE SOLVED: To provide an IC card frame member capable of improving the operability in inserting/removing an IC card and the visibility of the installed IC card, and an IC card reader/writer provided with the IC card frame member. SOLUTION: This sheet-like IC card frame member has a substantially U-shaped planar shape by having a recessed part. The vicinity of the end part facing the recessed part of the member has a part stepped down from the part other than the vicinity of the end part, and a part of the end part facing the recessed part which is close to the outlet of the recessed part does not at least partially have the stepped-down part. The IC card reader/writer uses this IC card frame member. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：解决问题的方案为了提供能够提高插入/取出IC卡的可操作性和所安装的IC卡的可视性的IC卡框架构件，以及设置有IC卡框架构件的IC卡读写器。解决方案：该片状IC卡框架构件通过具有凹部具有大致U形的平面形状。面向构件的凹部的端部附近具有从除了端部附近以外的部分下降的部分，并且端部的面向凹部的部分靠近凹部的出口部分不至少部分地具有降压部分。 IC卡读写器使用此IC卡框架。版权所有（C）2006，JPO＆NCIPI

3. 发明专利

JP2006100704A Rigid-flexible substrate and manufacturing method therefor 有权
标题翻译：刚性基板及其制造方法
公开(公告)号：JP2006100704A
公开(公告)日：2006-04-13
申请号：JP2004287147
申请日：2004-09-30
申请人： Dainippon Printing Co Ltd , Dt Circuit Technology Co Ltd , ディー・ティー・サーキットテクノロジー株式会社 , 大日本印刷株式会社
发明人： KOBAYASHI ATSUSHI , UMEDA KAZUO , SAWARA TAKAHIRO , NAKAZAWA SUSUMU
IPC分类号： H05K3/46 , H05K1/14 , H05K3/36
摘要： PROBLEM TO BE SOLVED: To provide a method for manufacturing a rigid-flexible substrate in which flexibility and elasticity of a flexible part is not impaired even if wiring density is increased, which comprises a simple process, and which provides a high material yield and a high product yield.
SOLUTION: A rigid substrate having a vertical wiring formed in a joint region and a flexible substrate having a connection terminal formed at an end are separately manufactured. Positions of the rigid substrate corresponding to the edges of both surfaces of the flexible substrate are spot faced equally to or deeper than the thickness of the flexible substrate to form steps. The connection terminal of each one end of two flexible substrates is connected to the vertical wiring of the step.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：解决的问题：提供一种制造柔性基板的方法，其中柔性部件的柔性和弹性即使布线密度增加也不会受损，其包括简单的工艺，并且提供高材料产率高，产品产量高。解决方案：分别制造在接合区域中形成有垂直布线的刚性基板和在端部形成有连接端子的柔性基板。对应于柔性基板的两个表面的边缘的刚性基板的位置等同地等于或深于柔性基板的厚度以形成台阶。两个柔性基板的每一端的连接端子连接到台阶的垂直布线。版权所有（C）2006，JPO＆NCIPI

4. 发明专利

JP2005353868A Wiring board and capacitor element with built-in wiring board 有权
标题翻译：接线板和电容元件与内置接线板
公开(公告)号：JP2005353868A
公开(公告)日：2005-12-22
申请号：JP2004173555
申请日：2004-06-11
申请人： Dt Circuit Technology Co Ltd , ディー・ティー・サーキットテクノロジー株式会社
发明人： SASAOKA KENJI
IPC分类号： H05K3/46
摘要： PROBLEM TO BE SOLVED: To more increase electrostatic capacity of a capacitor in a wiring board having a capacitor as a built-in device (wiring board with a built-in capacitor) and a capacitor element with a built-in wiring board.
SOLUTION: There are provided at least three layers of electrode plates, dielectric resin layers which are provided between the electrode plates and each of which is a board base material as a wiring board, and a plurality of interlayer connectors provided through the dielectric resin layers with the electrode plates as electrically other nodes alternatively in a layer direction. Both poles of an electrode plate as a capacitor are structured to increase counter areas in accordance with the number of laminated electrode plates.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了增加具有作为内置装置的电容器（具有内置电容器的布线板）和具有内置布线板的电容器元件的布线基板中的电容器的静电容量。解决方案：提供至少三层电极板，电介质树脂层，设置在电极板之间，每个电极板是作为布线板的基板材料，以及通过电介质提供的多个层间连接器树脂层，其中电极板在层方向上交替地作为电的其他节点。电极板的两极作为电容器构成为根据叠层电极板的数量来增加计数器面积。版权所有（C）2006，JPO＆NCIPI

5. 发明专利

JP2005295402A Tv telephone module 审中-公开
标题翻译：电视电话模块
公开(公告)号：JP2005295402A
公开(公告)日：2005-10-20
申请号：JP2004110405
申请日：2004-04-02
申请人： Dainippon Printing Co Ltd , Dt Circuit Technology Co Ltd , ディー・ティー・サーキットテクノロジー株式会社 , 大日本印刷株式会社
发明人： MASUDA KENJI , MATSUMURA KENICHI , NISHIMURA TAKUYA
IPC分类号： H04N7/14 , H04M3/56
摘要： PROBLEM TO BE SOLVED: To provide a TV telephone module for easily adding a TV telephone function to an apparatus having a connection interface to a digital line. SOLUTION: The TV telephone module 1 starts an operation in response to a start command which is inputted to a main control unit 2 via a command interface 3. Bit stream data inputted to a network interface 7 is separated by a multiplex separator 8. A video signal is extended by a video signal compression extender 9 and outputted from a display interface part 5. A sound signal is extended by a sound signal compression extender 10 and outputted from an audio interface 6. The video signal inputted to a camera interface 4 and the sound signal inputted to the audio interface 6 are compressed, multiplexed, and outputted in the same way. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种电视电话模块，用于容易地将电视电话功能添加到具有与数字线路的连接接口的设备。解决方案：电视电话模块1响应于通过命令接口3输入到主控制单元2的开始命令而开始操作。输入到网络接口7的比特流数据由多路分离器8分离视频信号由视频信号压缩扩展器9扩展并从显示接口部分5输出。声音信号由声音信号压缩扩展器10扩展并从音频接口6输出。输入到摄像机接口的视频信号输入到音频接口6的声音信号以相同的方式被压缩，多路复用和输出。版权所有（C）2006，JPO＆NCIPI

6. 发明专利

JP2004095912A Printed wiring board, method of manufacturing the same, and conductor plate with bump 审中-公开
公开(公告)号：JP2004095912A
公开(公告)日：2004-03-25
申请号：JP2002256124
申请日：2002-08-30
申请人： Dainippon Printing Co Ltd , Dt Circuit Technology Co Ltd , ディー・ティー・サーキットテクノロジー株式会社 , 大日本印刷株式会社
发明人： UMEDA KAZUO , KOBAYASHI ATSUSHI , MURATA YOSHINORI , SASAOKA KENJI , MORIOKA NAOKI
IPC分类号： H05K1/11 , H01L23/12 , H05K3/24 , H05K3/40 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a printed wiring board which is highly accurate and exhibits reliable interlayer connections. SOLUTION: First masking films 20 are formed on a metal plate 11, and then the metal plate 11 is subjected to half etching for the formation of nearly conical metal bumps 11B. Then, a prepreg 12 is superposed on the surface of the metal plate 11 where the metal bumps 11B are formed, and the metal bumps 11B are made to penetrate through the prepreg 12 by hot pressing. The other metal plate where a conductive layer 34 is formed on its surface confronted with the metal bumps 11B is superposed on tops of the metal bumps 11B, and the metal plate 11 and the other metal plate are hot-pressed. Then, second masking films 41 are formed on the wiring pattern corresponding part of the rear surface of the metal plate 11, and a etching process is performed from above the second masking films 41 so as to form a first wiring pattern 43 from the metal plate 11. COPYRIGHT: (C)2004,JPO

7. 发明专利

JP2004017640A Screen printing machine and screen printing method 有权
公开(公告)号：JP2004017640A
公开(公告)日：2004-01-22
申请号：JP2002180580
申请日：2002-06-20
申请人： Dainippon Printing Co Ltd , Dt Circuit Technology Co Ltd , ディー・ティー・サーキットテクノロジー株式会社 , 大日本印刷株式会社
发明人： KOBAYASHI ATSUSHI , SASAOKA KENJI
IPC分类号： B41F15/44 , B41F15/08 , B41F15/36 , B41F15/40 , B41F15/42
摘要： PROBLEM TO BE SOLVED: To provide a screen printing machine capable of bonding pasty matter corresponding to ink to matter to be printed in a bulky state, and a screen printing method.
SOLUTION: A first squeegee and a second squeegee, which is provided to the rear part of a direction wherein the first squeegee advances on a printing surface and is positioned so as to retreat from the first squeegee in the direction vertical to the printing surface, are provided. The discharge holes of a screen mask is filled with paste by the first squeegee and, when the screen mask is slighly separated from the matter to be printed by the movement of the first squeegee, the second squeegee is moved to additionally supply the paste to the discharge holes. When the second squeegee is moved and the screen mask is further separated from the matter to be printed, the amount of the paste sticked to the matter to be printed to be divided increases.
COPYRIGHT: (C)2004,JPO

8. 发明专利

JP2006114621A Wiring plate with built-in component and manufacturing method thereof 有权
标题翻译：具有内置组件的接线板及其制造方法
公开(公告)号：JP2006114621A
公开(公告)日：2006-04-27
申请号：JP2004299048
申请日：2004-10-13
申请人： Dt Circuit Technology Co Ltd , ディー・ティー・サーキットテクノロジー株式会社
发明人： SASAOKA KENJI
IPC分类号： H05K1/11 , H05K1/18 , H05K3/40
CPC分类号： H01L2224/16225 , H01L2224/73204
摘要： PROBLEM TO BE SOLVED: To reduce a load in production in a wiring plate with a built-in component, having an electric/electronic component embedded into an insulating layer, and to provide its manufacturing method. SOLUTION: The wiring plate with the built-in component is equipped with the insulating layer, a first conductor penetrating the insulating layer, first and second wiring layers provided on the upper and lower surfaces of the insulating layer while being conducted electrically with the first conductor, the electric/electronic component provided so that at least one part thereof is embedded into the insulating layer, and a second conductor connecting electrically and mechanically the terminal of the electric/electronic component with the first or second wiring layer and constituted of a composite material same as the material of the first conductor. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了减少具有嵌入到绝缘层中的电气/电子部件的内置部件的布线板的制造中的负载，并提供其制造方法。解决方案：具有内置部件的布线板配备有绝缘层，穿过绝缘层的第一导体，设置在绝缘层的上表面和下表面上的第一和第二布线层，同时与所述第一导体，所述电气/电子部件被设置为使得其至少一部分嵌入所述绝缘层;以及第二导体，其将所述电气/电子部件的端子与所述第一或第二布线层电连接和机械地连接，并且由与第一导体的材料相同的复合材料。版权所有（C）2006，JPO＆NCIPI

9. 发明专利

JP2005346263A Storage system and storage method 有权
标题翻译：存储系统和存储方法
公开(公告)号：JP2005346263A
公开(公告)日：2005-12-15
申请号：JP2004163398
申请日：2004-06-01
申请人： Dt Circuit Technology Co Ltd , ディー・ティー・サーキットテクノロジー株式会社
发明人： SHIMADA OSAMU
IPC分类号： G06F21/24 , G06F12/14 , G06K17/00 , G06K19/00 , G06K19/073 , G06K19/10
摘要： PROBLEM TO BE SOLVED: To improve security performance and use convenience in a storage device such as an information processor, which can be separated from a host side, for storing data, and for outputting the stored data when connected to the host device and the storage method of the device. SOLUTION: Biometrics information is entered, and the entered biometrics information is integrated into template data, and the template data-integrated biometrics information is authenticated by verifying the template data-integrated biometrics information stored in a reference information storing part with a reference. A storage part is able to perform access to the outside based on the fact that authentication is acquired by an authentication processing part. A storage operation control part makes the reference information storing part store the template data-processed biometric information, and decides the permission/non-permission of the operation according to the acquisition and examination of information owned by physically individualized articles. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了提高在与主机侧分离的信息处理器等存储装置中的安全性能和便利性，用于存储数据，并且在连接到主机装置时输出存储的数据和设备的存储方法。
解决方案：输入生物特征信息，将输入的生物特征信息整合到模板数据中，通过验证存储在参考信息存储部分中的模板数据集成生物识别信息来验证模板数据集成生物识别信息。基于由认证处理部获取认证的事实，存储部件能够执行对外部的访问。存储操作控制部分使得参考信息存储部分存储模板数据处理的生物体信息，并且根据物理个体化物品所拥有的信息的获取和检查来决定操作的许可/不允许。版权所有（C）2006，JPO＆NCIPI

10. 发明专利

JP2005322677A Wiring board with built-in capacitor and its manufacturing method 有权
标题翻译：具有内置电容器的接线板及其制造方法
公开(公告)号：JP2005322677A
公开(公告)日：2005-11-17
申请号：JP2004137494
申请日：2004-05-06
申请人： Dt Circuit Technology Co Ltd , ディー・ティー・サーキットテクノロジー株式会社
发明人： SASAOKA KENJI
IPC分类号： H05K1/16 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To suppress variations in the capacitance of a capacitor in a wiring board for a built-in capacitor and for its manufacturing method. SOLUTION: The wiring board comprises a first electrode plate a second electrode plate which is formed opposite to the first one, and has an orthogonal projection onto the first electrode plate that falls within the plane of the first electrode plate; and a dielectric resin layer which is a plate material as a wiring board installed between the first and second electrode plates. The method of manufacturing the wiring includes board includes steps where: the electrode plate is formed in a fixed state on an insulation plate; the second electrode plate whose area is smaller or larger than that of the electrode plate is formed in a fixed state on the dielectric resin layer; and then the dielectric resin layer is stacked on the electrode plate formed on the insulation plate so that the opposite side from the second electrode plate-formed side may be in contact with the electrode plate formed on the insulation plate. The laminate thus obtained is so aligned that the orthogonal projection of the electrode plate on the second electrode plate externally capsulate the surface of the second electrode plate or falls within the plane of the second electrode plate. Thereafter, an interlayer connector to the electrode plates is formed. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：抑制用于内置电容器的布线板中的电容器的电容的变化及其制造方法。解决方案：布线板包括：第一电极板，与第一电极板相反形成的第二电极板，并且具有在第一电极板上的正交突起，该第一电极板落在第一电极板的平面内; 以及介电树脂层，其是安装在第一和第二电极板之间作为布线板的板材。制造布线的方法包括板，其包括以下步骤：电极板在绝缘板上以固定状态形成; 面积比电极板的面积小或大的第二电极板在电介质树脂层上形成为固定状态; 然后在形成在绝缘板上的电极板上堆叠电介质树脂层，使得与第二电极板形侧相反的一侧可以与形成在绝缘板上的电极板接触。如此获得的层压体被排列成使得第二电极板上的电极板的正交突出部将外部封装在第二电极板的表面上或落在第二电极板的平面内。此后，形成到电极板的层间连接器。版权所有（C）2006，JPO＆NCIPI

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