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1. 发明专利

JP2004126508A Plating method 有权
公开(公告)号：JP2004126508A
公开(公告)日：2004-04-22
申请号：JP2003105231
申请日：2003-04-09
申请人： Shipley Co Llc , シップレーカンパニーエルエルシーShipley Company,L.L.C.
发明人： FORMAN ROBERT S , STEEPER JILL E , HUENGER ERIC C
IPC分类号： G03F7/00 , C25D5/02 , G03F7/027 , G03F7/16 , G03F7/40 , H01L21/027 , H01L21/288 , H01L21/60
CPC分类号： G03F7/32 , G03F7/162 , G03F7/405 , H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a photoresist composition and a method which are suitable for depositing a very thick photoresist layer in a single coating process.
SOLUTION: A volume mehtod which is generally concerned with a field of metal plating and specially for plating an electronic device with a metal bump such as a solder bump includes a process of depositing on a base a photosensitive composition which consists of a binder polymer with (met)acrylate units, a radical-polymerizable bridging agent, a light-activated component, and an organic solvent, is of ≥45% in solid concentration, and contains substantially no water and a process of rotating it at a high speed and for a long time enough to obtain a photosensitive layer with a uniform thickness of ≥50 microns.
COPYRIGHT: (C)2004,JPO

2. 发明专利

JP2004507777A Oxime sulfonates and n- oxyimide sulfonates light-sensitive acid generator and a photoresist containing it 有权
公开(公告)号：JP2004507777A
公开(公告)日：2004-03-11
申请号：JP2002521651
申请日：2001-08-24
申请人：シップレーカンパニーエルエルシーShipley Company,L.L.C.
发明人：ゲルハルト　ポーラース , ジェイムズ　エフ　キャメロン
IPC分类号： C07D487/04 , C09K3/00 , G03F7/004 , G03F7/039 , H01L21/027
CPC分类号： G03F7/0045 , Y10S430/121 , Y10S430/122
摘要： New photoacid generator compounds ("PAGs") are provided and photoresist compositions that comprise such compounds. In particular, non-ionic PAGs are provided that contain an oxime sulfonate group, and/or an N-oxyimidosulfonate group. PAGs of the invention are particularly useful as photoactive components of photoresists imaged at short wavelengths such as 248 nm, 193 nm and 157 nm.

3. 发明专利

JP2004506940A Etch resistant anti-reflective coating composition 有权
公开(公告)号：JP2004506940A
公开(公告)日：2004-03-04
申请号：JP2002520023
申请日：2001-08-17
申请人：シップレーカンパニーエルエルシーShipley Company,L.L.C.
发明人：ジビアオ　マオ , スザンネ　コレイ , ティモシー・ジー・アダムス
IPC分类号： G03F7/11 , G03F7/004 , G03F7/033 , G03F7/09 , H01L21/027
CPC分类号： G03F7/091
摘要：本発明は、上塗りされたレジスト層とともに反射防止塗布物（「ＡＲＣ」）として使用するのに適した新規な光吸収性組成物を提供する。
本発明のＡＲＣは耐エッチング性をもち、標準プラズマエッチング液において増大したエッチング速度を示す。本発明の好ましいＡＲＣは、以前の組成物に比較して顕著に増大した酸素含量を持つ。

4. 发明专利

JP2004002970A Restriction of tin loss caused by oxidation in tin or tin alloy electroplating solution 审中-公开
公开(公告)号：JP2004002970A
公开(公告)日：2004-01-08
申请号：JP2003057519
申请日：2003-03-04
申请人： Shipley Co Llc , シップレーカンパニーエルエルシーShipley Company,L.L.C.
发明人： BROWN NEIL D , CHIRAFISI ANGELO , LEVEY PETER R
IPC分类号： C25D3/32 , C25D3/56
CPC分类号： C25D3/32
摘要： PROBLEM TO BE SOLVED: To provide an antioxidant which is compatible with the other components in a plating bath since an antioxidant having non-compatibility with the other components is allowed to react to produce insoluble oil and gels, and exerts harmful effect upon plating when it is added for preventing the formation of sludge caused by oxidation from divalent tin to tetravalent tin in tin and tin alloy plating, and to provide a plating bath comprising the same.
SOLUTION: The tin and tin alloy plating bath comprises a basis solution comprising an acid, optionally a salt thereof, the acid selected from the group consisting fluoroboric acid, an organic sulfonic acid, or a combination thereof; ditin ions; and an antioxidizing compound comprising ahydroxybenzenesulfonic acid or salt thereof, in an amount effective to reduce ditin oxide.
COPYRIGHT: (C)2004,JPO

5. 发明专利

JP2004126509A Solvent and photoresist composition for 193nm imaging 审中-公开
标题翻译：用于193NM成像的溶剂和光电组合物
公开(公告)号：JP2004126509A
公开(公告)日：2004-04-22
申请号：JP2003112577
申请日：2003-04-17
申请人： Shipley Co Llc , シップレーカンパニーエルエルシーShipley Company,L.L.C.
发明人： KAVANAGH ROBERT J , JAMES W THACKERAY
IPC分类号： G03F7/004 , G03F7/039 , G03F7/40 , H01L21/027
CPC分类号： G03F7/0048 , G03F7/0045 , G03F7/0392
摘要： PROBLEM TO BE SOLVED: To provide a new photoresist suitable for short-wavelength active radiation exposure imaging at ≤200 nm, in particular, including 193 nm wavelength.
SOLUTION: The photosensitive composition contains a high molecular weight compound as a binder which is a polymer having substantially no aromatic moiety and having a photoacid-labile repeating unit. Moreover, the composition contains one or more photo active components such as a photoacid generating agent compound, methyl isoamyl ketone (5-methyl-2-hexanone) as a solvent, and one or more kinds of solvents such as propylene glycol methylether acetate, cyclohexanone, or the like.
COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：提供适用于≤200nm，特别是包括193nm波长的短波长有源辐射曝光成像的新型光致抗蚀剂。光敏组合物含有作为粘合剂的高分子量化合物，其为基本上不含芳族部分并具有光致酸不稳定重复单元的聚合物。此外，组合物含有一种或多种光活性成分，如光酸产生剂化合物，甲基异戊基酮（5-甲基-2-己酮）作为溶剂，以及一种或多种溶剂如丙二醇甲醚乙酸酯，环己酮，等等。版权所有（C）2004，JPO

6. 发明专利

JP2004124249A Tin plating method 有权
标题翻译：电镀方法
公开(公告)号：JP2004124249A
公开(公告)日：2004-04-22
申请号：JP2003057560
申请日：2003-03-04
申请人： Shipley Co Llc , シップレーカンパニーエルエルシーShipley Company,L.L.C.
发明人： EGLI ANDRE
IPC分类号： C25D7/12 , C25D3/30 , C25D3/32 , C25D7/00 , H05K3/24
CPC分类号： H05K3/244 , C25D3/30 , C25D3/32 , C25D7/00 , C25D7/12 , Y10T428/12708 , Y10T428/12715 , Y10T428/12722
摘要： PROBLEM TO BE SOLVED: To provide a deposit extremely reduced in whisker formation in tin and tin alloy plating of copper lead frames etc., and to provide a method of depositing a tin layer or film reduced in the tendency to the formation of the whiskers. SOLUTION: The layer of the tin or tin alloy is electrodeposited on a substrate in such a manner that the crystal face forming an angle 5 to 22° with the crystal face adjacent to the tin or tin alloy layer or the face equivalent thereto does not substantially exist. Also, the tin or tin layer reduced in the formation of the whiskers is obtained by forming the layer in such a manner that the ratio of the peak intensity corresponding to the crystal face forming the angle 5 to 22° or the face equivalent thereto to the total peak intensity of all the peaks observed in X-ray diffraction spectra is ≤10%. The tin or tin alloy layer and an electronic device having the same are obtained by the above method. COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：为了提供在铜引线框架等的锡和锡合金电镀中晶须形成极少的沉积物，并且提供沉积锡层或膜形成方法，晶须。解决方案：将锡或锡合金层电沉积在基板上，使得晶体面与锡或锡合金层相邻的晶面或与其相当的面形成5°至22°的角度基本上不存在此外，形成晶须所减少的锡或锡层可以通过以与以下相同的方式形成该层来获得：将与晶面相对应的峰强度的比率形成为5度至22度的角度或与其相当的晶面相对于在X射线衍射光谱中观察到的所有峰的总峰强度为≤10％。锡或锡合金层及具有该锡或锡合金层的电子器件通过上述方法获得。版权所有（C）2004，JPO

7. 发明专利

JP2004509468A The manufacture of electronic devices 审中-公开
公开(公告)号：JP2004509468A
公开(公告)日：2004-03-25
申请号：JP2002527574
申请日：2001-09-08
申请人：シップレーカンパニーエルエルシーShipley Company,L.L.C.
发明人：ギャラガー，マイケル・ケー , ヨウ，ユジアン
IPC分类号： B29C67/20 , H01L21/312 , H01L21/316 , H01L21/48 , H01L21/768 , H05K1/02
CPC分类号： H01L21/02137 , B29C67/202 , H01L21/02203 , H01L21/02282 , H01L21/3122 , H01L21/31695 , H01L21/481 , H01L21/76802 , H01L21/7682 , H01L21/7684 , H01L2221/1047 , H05K1/024 , H05K2201/0116 , Y10T428/24331
摘要：電子デバイス、特に集積回路の製造方法が開示される。そのような方法は、除去可能なポロゲン材料を用いることによって調製される低誘電率材料の使用を含む。

8. 发明专利

JP2004252395A Stable concentrate with reduced residue 审中-公开
公开(公告)号：JP2004252395A
公开(公告)日：2004-09-09
申请号：JP2003128145
申请日：2003-05-06
申请人： Shipley Co Llc , シップレーカンパニーエルエルシーShipley Company,L.L.C.
发明人： LUNDY DANIEL E , BARR ROBERT K , ANZURES EDGARDO
IPC分类号： C11D7/00 , G03F7/32 , H01L21/027 , H05K3/00
CPC分类号： G03F7/322
摘要： PROBLEM TO BE SOLVED: To provide a concentrated developing solution which reduces or prevents production of residue and scum on a substrate.
SOLUTION: The concentrate comprises a base generating component selected from inorganic alkali and organic alkanolamine and another compound in a sufficient amount to reduce or prevent production of residue or scum on a substrate, for example, saccharides such as glycoside and polyglycoside or an aromatic sulfur compound such as aromatic sulfonic acid. The stable concentrate can be used in a developing process for manufacturing semiconductors, printed wiring boards or the like.
COPYRIGHT: (C)2004,JPO&NCIPI

9. 发明专利

JP2004250777A Leveler compound 审中-公开
公开(公告)号：JP2004250777A
公开(公告)日：2004-09-09
申请号：JP2003157811
申请日：2003-06-03
申请人： Shipley Co Llc , シップレーカンパニーエルエルシーShipley Company,L.L.C.
发明人： WANG DEYAN , WU CHUNYI , MIKKOLA ROBERT D
IPC分类号： C08G65/24 , C08G65/26 , C25D3/38
CPC分类号： C08G65/24 , C08G65/2609 , C08G2650/06 , C08G2650/24 , C25D3/38
摘要： PROBLEM TO BE SOLVED: To provide a compound that functions to provide level or uniform metal deposit.
SOLUTION: A reaction product of a compound comprising one or more heteroatoms chosen from sulfur, nitrogen and a combination of sulfur and nitrogen, an alkyelene oxide compound and an epichlorohydrin compound is added as a leveler to a copper plating bath. The plating by such bath can provide a planarized layer of copper on a substrate having small apertures.
COPYRIGHT: (C)2004,JPO&NCIPI

10. 发明专利

JP2004165613A Manufacture of electronic device 审中-公开
公开(公告)号：JP2004165613A
公开(公告)日：2004-06-10
申请号：JP2003157876
申请日：2003-06-03
申请人： Shipley Co Llc , シップレーカンパニーエルエルシーShipley Company,L.L.C.
发明人： GRONBECK DANA A , GALLAGHER MICHAEL K , CALVERT JEFFREY M , PROKOPWICZ GREGORY P , ADAMS TIMOTHY G
IPC分类号： H01L23/14 , C09D183/04 , C09D183/14 , H01L21/312 , H01L21/316
CPC分类号： H01L21/02126 , C09D183/04 , C09D183/14 , H01L21/02203 , H01L21/02216 , H01L21/02282 , H01L21/31695 , Y10T428/249987
摘要： PROBLEM TO BE SOLVED: To provide a deposition method of a uniform organic polysilica coating which does not contain pin-hole defects, whereby the uses of these substances as a spin-on-cap layer in the manufacturing of an integrated circuit are enabled. SOLUTION: In the deposition method, a layer, including one or more B-stage organic polysilica resins and one or more coating enhancers, is so disposed on a dielectric as to form a cap layer, by hardening at least a portion of the B-stage organic polysilica resins. COPYRIGHT: (C)2004,JPO

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