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    • 10. 发明专利
    • Optical semiconductor package equipped with a compressible adjusting means
    • 光学半导体封装具有可压缩的调整方式
    • JP2005354039A
    • 2005-12-22
    • JP2005121584
    • 2005-04-19
    • St Microelectronics Saエスティマイクロエレクトロニクス エスエー
    • VITTU JULIEN
    • G02B7/02H01L27/14H01L31/0203H01L31/0232
    • H01L31/0203H01L27/14618H01L31/02325H01L2924/0002H01L2924/00
    • PROBLEM TO BE SOLVED: To make it simple to fit a lens to an optical sensor in an optical semiconductor package. SOLUTION: Provided is the optical semiconductor package comprising a support with a passage to receive a ring holding a lens situated facing an optical sensor. The support (6) has, in the passage, at least one local release recess (9), and the ring (7) is equipped peripherally with a locally projecting, elastically deformable means (14). The local release recess and the elastically deformable means are such that, when the ring occupies an angular mounting position, the locally projecting means is engaged in the local recess of the support and, when the ring is swiveled from the angular mounting position, the locally projecting means is moved out of the recess of the support and is compressed against the wall of the passage in order to secure the ring relative to the support. COPYRIGHT: (C)2006,JPO&NCIPI
    • 要解决的问题:为了使光学半导体封装中的光学传感器安装透镜变得简单。 解决方案:提供了一种光学半导体封装,其包括具有通道的支撑件,该通道用于接收保持面向光学传感器的透镜的环。 支撑件(6)在通道中具有至少一个局部释放凹部(9),并且环(7)在外周配备有局部突出的可弹性变形的装置(14)。 局部释放凹部和可弹性变形的装置使得当环形件处于角度安装位置时,局部突出装置接合在支撑件的局部凹部中,并且当环从角度安装位置旋转时, 突出装置从支撑件的凹部移出并被压靠在通道的壁上,以便相对于支撑件固定环。 版权所有(C)2006,JPO&NCIPI