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    • 6. 发明申请
    • METHOD AND APPARATUS FOR MEASURING SCATTERED LIGHT ON AN OPTICAL SYSTEM
    • 用于测量光学系统上的散射光的方法和装置
    • WO2009021670A1
    • 2009-02-19
    • PCT/EP2008/006498
    • 2008-08-07
    • CARL ZEISS SMT AGARNZ, Michael
    • ARNZ, Michael
    • G03F7/20
    • G03F7/70941
    • A method of measuring scattered light on an optical system comprises the following steps: providing a first measuring field (22a) and a second measuring field (22b), both measuring fields respectively being either of a first light manipulation type or a second light manipulation type, which first light manipulation type is configured to cause incoming light to enter the optical system and which second light manipulation type is configured to prevent incoming light from entering the optical system, and both measuring fields respectively having a second light manipulation type reference structure (30) and a respective measuring structure, which measuring structures are of the second light manipulation type in the case where the measuring fields are of the first light manipulation type, and are first light manipulation type regions of the measuring fields in the case where the measuring fields are of the second light manipulation type, wherein the measuring structures of the respective measuring fields (22a, 22b) are offset in different directions in relation to the respective reference structure, imaging the first measuring field by means of the optical system into an image plane and measuring a first light intensity produced herewith at a location in the region of the image of the reference structure of the first measuring field, and imaging the second measuring field by means of the optical system into the image plane and measuring a second light intensity produced herewith at a location in the region of the image of the reference structure of the second measuring field.
    • 测量光学系统上的散射光的方法包括以下步骤:提供第一测量场(22a)和第二测量场(22b),测量场分别是第一光操作型或第二光操作型 所述第一光操作型被配置为使得入射光进入所述光学系统,并且所述第二光操作类型被配置为防止入射光进入所述光学系统,并且两个测量场分别具有第二光操作型参考结构(30 )和各测量结构,在测量场为第一光操作型的情况下,测量结构为第二光操作型,并且在测量场的情况下为测量场的第一光操作型区域 是第二光操纵型,其中各自的测量结构 相对于各个参考结构,沿着不同的方向偏移测量场(22a,22b),通过光学系统将第一测量场成像到图像平面中,并测量在此处产生的第一光强度 第一测量场的参考结构的图像,以及通过光学系统将第二测量场成像到图像平面中,并测量在此处产生的第二光强度,该第二光强度在参考结构的图像的区域中的位置处 第二个测量领域。
    • 7. 发明申请
    • CONTROL DEVICE FOR CONTROLLING MANIPULATORS FOR A PROJECTION LENS
    • WO2022038163A1
    • 2022-02-24
    • PCT/EP2021/072876
    • 2021-08-18
    • CARL ZEISS SMT GMBH
    • SCHLEMMER, MaximilianRIST, Stefan
    • G03F7/20
    • ZE7150WO – 2020P00299WO 33 Abstract Control device for controlling manipulators for a projection lens A control device (14) for controlling manipulators (M1-M4, 36) for changing an op-5 tical behaviour of a microlithographic projection lens (16) by generating respective stipulations (38) for a plurality of travel variables which define manipulations, to be undertaken by means of the manipulators, of at least one optical element (E1-E4) of the projection lens for the purposes of changing state parameters (34) of the projection lens is provided. The control device is configured to generate a respec-10 tive approximation (38-1) of the stipulations for the travel variables by optimizing a uniform scaling factor (86) using a first optimization algorithm (74), said scaling factor, in constraints (82) of the first optimization algorithm, defining a uniform scaling of limits (84) specified for the individual state parameters, and to ascertain a respective final result (38) of the stipulations for the travel variables by means of 15 at least one further optimization algorithm (76, 78) in the case where an optimiza- tion result (87) for the uniform scaling factor, as ascertained by means of the first optimization algorithm, does not exceed a specified threshold (85). (Fig. 3) 20 25