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1. 发明申请

WO2008109820A1 METHODS FOR IDENTIFYING ARRAY AREAS IN DIES FORMED ON A WAFER AND METHODS FOR SETTING UP SUCH METHODS 审中-公开
标题翻译：用于识别在波形上形成的阵列中的阵列区域的方法和用于设置这些方法的方法
公开(公告)号：WO2008109820A1
公开(公告)日：2008-09-12
申请号：PCT/US2008/056212
申请日：2008-03-07
申请人： KLA-TENCOR CORPORATION , CHEN, Chien-huei (adam) , GUPTA, Ajay , WALLINGFORD, Richard , NAMJOSHI, Kaustubh , VAN RIET, Mike , COOK, Michael
发明人： CHEN, Chien-huei (adam) , GUPTA, Ajay , WALLINGFORD, Richard , NAMJOSHI, Kaustubh , VAN RIET, Mike , COOK, Michael
IPC分类号： G06T7/00
CPC分类号： G06T7/001 , G06T2207/30148
摘要： Methods for identifying array areas in dies formed on a wafer and methods for setting up such methods are provided. One method for identifying array areas in dies formed on a wafer includes comparing an array pattern in a template image acquired in one of the array areas to a search area image acquired for the wafer. The method also includes determining areas in the search area image in which a pattern is formed that substantially matches the array pattern in the template image based on results of the comparing step. In addition, the method includes identifying the array areas in the dies formed on the wafer based on results of the determining step.
摘要翻译：提供了用于识别在晶片上形成的模具中的阵列区域的方法以及用于设置这种方法的方法。用于识别在晶片上形成的管芯中的阵列区域的一种方法包括将在一个阵列区域中获取的模板图像中的阵列图案与为晶片获取的搜索区域图像进行比较。该方法还包括基于比较步骤的结果来确定在其中形成图案的搜索区域图像中的与模板图像中的阵列图案基本匹配的区域。此外，该方法包括基于确定步骤的结果识别在晶片上形成的管芯中的阵列区域。

2. 发明申请

WO2007022538A2 TEST PADS, METHODS AND SYSTEMS FOR MEASURING PROPERTIES OF A WAFER, AND SYSTEMS AND METHODS FOR CONTROLLING DEPOSITION OF A CHARGE ON A WAFER FOR MEASUREMENT OF ONE OR MORE ELECTRICAL PROPERTIES OF THE WAFER 审中-公开
标题翻译：用于测量波形特性的测试垫，方法和系统，以及用于控制在波形上沉积电荷以测量一个或更多个电流特性的系统和方法
公开(公告)号：WO2007022538A2
公开(公告)日：2007-02-22
申请号：PCT/US2006/032822
申请日：2006-08-21
申请人： KLA-TENCOR TECHNOLOGIES CORPORATION , SHI, Jianou , ZHANG, Xiafang , PEI, Shiyou , HUANG, Shu, Chun , YEH, Dennis , RZEPIELA, Jeffrey, A. , FENG, Yiping , KHAN, Ahmad , KAGAN, Alexander , EDELSTEIN, Sergio
发明人： SHI, Jianou , ZHANG, Xiafang , PEI, Shiyou , HUANG, Shu, Chun , YEH, Dennis , RZEPIELA, Jeffrey, A. , FENG, Yiping , KHAN, Ahmad , KAGAN, Alexander , EDELSTEIN, Sergio
IPC分类号： G01R31/26
CPC分类号： G01R31/2831 , G01R31/2856 , H01L22/34 , H01L2924/0002 , H01L2924/00
摘要： Test pads, methods, and systems for measuring properties of a wafer are provided. One test pad formed on a wafer includes a test structure configured such that one or more electrical properties of the test structure can be measured. The test pad also includes a conductive layer formed between the test structure and the wafer. The conductive layer prevents structures located under the test structure between the conductive layer and the wafer from affecting the one or more electrical properties of the test structure during measurement. One method for assessing plasma damage of a wafer includes measuring one or more electrical properties of a test structure formed on the wafer and determining an index characterizing the plasma damage of the test structure using the one or more electrical properties. In addition, systems and methods for controlling deposition of a charge on a wafer for measurement of one or more electrical properties of the wafer are provided. One system includes a corona source configured to deposit the charge on the wafer and a sensor configured to measure one or more conditions within the corona source. This system also includes a control subsystem configured to alter one or more parameters of the corona source based on the one or more conditions. Another system includes a corona source configured to deposit the charge on the wafer and a mixture of gases disposed within a discharge chamber of the corona source during the deposition of the charge. The mixture of gases alters one or more parameters of the charge deposited on the wafer.
摘要翻译：提供了用于测量晶片性能的测试垫，方法和系统。形成在晶片上的一个测试焊盘包括测试结构，其被配置为使得可以测量测试结构的一个或多个电特性。测试垫还包括在测试结构和晶片之间形成的导电层。导电层防止在测量期间位于导电层和晶片之间的测试结构下方的结构影响测试结构的一个或多个电性能。用于评估晶片的等离子体损伤的一种方法包括测量形成在晶片上的测试结构的一个或多个电特性，并使用一个或多个电性质确定表征测试结构的等离子体损伤的指标。此外，提供了用于控制晶片上的电荷沉积以测量晶片的一个或多个电性能的系统和方法。一个系统包括配置成将电荷沉积在晶片上的电晕源和配置成测量电晕源内的一个或多个条件的传感器。该系统还包括配置为基于一个或多个条件来改变电晕源的一个或多个参数的控制子系统。另一种系统包括电晕源，其被配置为在电荷沉积期间将电荷沉积在晶片上以及布置在电晕源的放电室内的气体混合物。气体混合物改变沉积在晶片上的电荷的一个或多个参数。

3. 发明申请

WO2006063268A3 COMPUTER-IMPLEMENTED METHODS FOR DETECTING AND/OR SORTING DEFECTS IN A DESIGN PATTERN OF A RETICLE 审中-公开
公开(公告)号：WO2006063268A3
公开(公告)日：2006-06-15
申请号：PCT/US2005/044695
申请日：2005-12-07
申请人： KLA-TENCOR TECHNOLOGIES CORP. , WU, Kenong , RANDALL, David , NAFISI, Kourosh , YNZUNZA, Ramon , PETERSON, Ingrid, B. , TRIBBLE, Ariel , KOWALSKI, Michal , GAO, Lisheng , KULKARNI, Ashok
发明人： WU, Kenong , RANDALL, David , NAFISI, Kourosh , YNZUNZA, Ramon , PETERSON, Ingrid, B. , TRIBBLE, Ariel , KOWALSKI, Michal , GAO, Lisheng , KULKARNI, Ashok
IPC分类号： G03F7/20 , G03F1/00 , G01N21/956
摘要： Various computer-implemented methods are provided. One method for sorting defects in a design pattern of a reticle includes searching for defects of interest in inspection data using priority information associated with individual defects in combination with one or more characteristics of a region proximate the individual defects. The priority information corresponds to modulation levels associated with the individual defects. The inspection data is generated by comparing images of the reticle generated for different values of a lithographic variable. The images include at least one reference image and at least one modulated image. A composite reference image can be generated from two or more reference images. The method also includes assigning one or more identifiers to the defects of interest. The identifier(s) may include, for example, a defect classification and/or an indicator identifying if the defects of interest are to be used for further processing.

4. 发明申请

WO2014186476A2 INTEGRATED MULTI-PASS INSPECTION 审中-公开
标题翻译：综合多通道检测
公开(公告)号：WO2014186476A2
公开(公告)日：2014-11-20
申请号：PCT/US2014/038017
申请日：2014-05-14
申请人： KLA-TENCOR CORPORATION
发明人： SOUSA, Weston, L , XIONG, Yalin , SHI, Rui-fang
CPC分类号： G01N21/8851 , G01N21/94 , G01N21/956 , G01N21/95607 , G01N2021/558 , G01N2021/8867 , G01N2021/95676 , G01N2201/12 , G03F1/84 , G06T7/0004 , G06T7/001 , G06T7/10 , G06T7/136 , G06T2207/30148
摘要： Methods and systems for integrated multi-pass reticle inspection are provided. One method for inspecting a reticle includes acquiring at least first, second, and third images for the reticle. The first image is a substantially high resolution image of light transmitted by the reticle. The second image is a substantially high resolution image of light reflected from the reticle. The third image is an image of light transmitted by the reticle that is acquired with a substantially low numerical aperture. The method also includes detecting defects on the reticle using at least the first, second, and third images for the reticle in combination.
摘要翻译：提供了综合多通道掩模检测的方法和系统。用于检查掩模版的一种方法包括获取用于掩模版的至少第一，第二和第三图像。第一个图像是由光罩传输的光的基本上高分辨率的图像。第二个图像是从掩模版反射的光的基本上高分辨率的图像。第三图像是由具有基本上低的数值孔径获得的掩模版传输的光的图像。该方法还包括组合使用至少第一，第二和第三图像来检测掩模版上的缺陷。

5. 发明申请

WO2013059160A1 ACQUISITION OF INFORMATION FOR A CONSTRUCTION SITE 审中-公开
标题翻译：收购建筑工地的资料
公开(公告)号：WO2013059160A1
公开(公告)日：2013-04-25
申请号：PCT/US2012/060366
申请日：2012-10-16
申请人： KLA-TENCOR CORPORATION
发明人： ROSENGAUS, Eliezer , LEVY, Ady , BHASKAR, Kris
IPC分类号： G01S17/06
CPC分类号： G01C15/002
摘要： Systems and methods for acquiring information for a construction site are provided. One system includes a base unit positioned within a construction site by a user. A computer subsystem of the base unit determines a position of the base unit with respect to the construction site. The system also includes a measurement unit moved within the construction site by a user. The measurement unit includes one or more elements configured to interact with light in a known manner. An optical subsystem of the base unit directs light to the element(s) and detects the light after interacting with the element(s). The computer subsystem is configured to determine a position and pose of the measurement unit with respect to the base unit based on the detected light. The measurement unit includes a measurement device used by the measurement unit or the base unit to determine information for the construction site.
摘要翻译：提供了获取施工现场信息的系统和方法。一个系统包括由用户定位在施工现场内的基本单元。基座的计算机子系统确定基座相对于施工现场的位置。该系统还包括由用户在施工现场内移动的测量单元。测量单元包括被配置为以已知方式与光相互作用的一个或多个元件。基本单元的光学子系统将光引导到元件，并在与元件相互作用之后检测光。计算机子系统被配置为基于检测到的光来确定测量单元相对于基本单元的位置和姿态。测量单元包括由测量单元或基座单元用于确定施工现场的信息的测量装置。

6. 发明申请

WO2010091307A2 SELECTING ONE OR MORE PARAMETERS FOR INSPECTION OF A WAFER 审中-公开
标题翻译：选择一个或多个参数来检查晶片
公开(公告)号：WO2010091307A2
公开(公告)日：2010-08-12
申请号：PCT/US2010/023396
申请日：2010-02-05
申请人： KLA-TENCOR CORPORATION , LEE, Chris , GAO, Lisheng , LUO, Tao , WU, Kenong , TORELLI, Tommaso , VAN RIET, Michael J. , DUFFY, Brian
发明人： LEE, Chris , GAO, Lisheng , LUO, Tao , WU, Kenong , TORELLI, Tommaso , VAN RIET, Michael J. , DUFFY, Brian
IPC分类号： H01L21/66 , G01N21/88
CPC分类号： H01L22/20 , G01N21/9501 , H01L22/12 , H01L2924/0002 , H01L2924/00
摘要： Computer-implemented methods, computer-readable media, and systems for selecting one or more parameters for inspection of a wafer are provided.
摘要翻译：提供了用于选择用于检查晶片的一个或多个参数的计算机实现的方法，计算机可读介质和系统。

7. 发明申请

WO2012005863A3 DATA PERTURBATION FOR WAFER INSPECTION OR METROLOGY SETUP 审中-公开
公开(公告)号：WO2012005863A3
公开(公告)日：2012-01-12
申请号：PCT/US2011/039876
申请日：2011-06-09
申请人： KLA-TENCOR CORPORATION , THATTAISUNDARAM, Govind , MAHADEVAN, Mohan , GUPTA, Ajay , CHEN, Chien-Huei Adam , KULKARNI, Ashok , KIRKWOOD, Jason , WU, Kenong , RONG, Songnian
发明人： THATTAISUNDARAM, Govind , MAHADEVAN, Mohan , GUPTA, Ajay , CHEN, Chien-Huei Adam , KULKARNI, Ashok , KIRKWOOD, Jason , WU, Kenong , RONG, Songnian
IPC分类号： G06F19/00
摘要： Various embodiments for determining parameters for wafer inspection and/or metrology are provided.

8. 发明申请

WO2010093733A2 DETECTING DEFECTS ON A WAFER 审中-公开
标题翻译：检测波形上的缺陷
公开(公告)号：WO2010093733A2
公开(公告)日：2010-08-19
申请号：PCT/US2010/023802
申请日：2010-02-10
申请人： KLA-TENCOR CORPORATION , HUANG, Junqing , ZHANG, Yong , CHEN, Stephanie , LUO, Tao , GAO, Lisheng , WALLINGFORD, Richard
发明人： HUANG, Junqing , ZHANG, Yong , CHEN, Stephanie , LUO, Tao , GAO, Lisheng , WALLINGFORD, Richard
IPC分类号： H01L21/66 , G01N21/88
CPC分类号： G01N21/9501 , G01N21/8806 , H01L22/12 , H01L2924/0002 , H01L2924/00
摘要： Methods and systems for detecting defects on a wafer are provided.
摘要翻译：提供了用于检测晶片上的缺陷的方法和系统。

9. 发明申请

WO2009023154A2 SYSTEMS CONFIGURED TO INSPECT A WAFER 审中-公开
标题翻译：配置检查晶圆的系统
公开(公告)号：WO2009023154A2
公开(公告)日：2009-02-19
申请号：PCT/US2008/009571
申请日：2008-08-11
申请人： KLA-TENCOR CORPORATION , KADKLY, Azmi , BIELLAK, Stephen , VAEZ-IRAVANI, Mehdi
发明人： KADKLY, Azmi , BIELLAK, Stephen , VAEZ-IRAVANI, Mehdi
IPC分类号： H01L21/66
CPC分类号： G01N21/9501
摘要： Systems configured to inspect a wafer are provided. One system includes an illumination subsystem configured to illuminate an area on the wafer by directing light to the wafer at an oblique angle of incidence. The system also includes a collection subsystem configured to simultaneously collect light scattered from different spots within the illuminated area and to focus the light collected from the different spots to corresponding positions in an image plane. In addition, the system includes a detection subsystem configured to separately detect the light focused to the corresponding positions in the image plane and to separately generate output responsive to the light focused to the corresponding positions in the image plane. The output can be used to detect defects on the wafer.
摘要翻译：提供了配置为检查晶片的系统。一个系统包括照明子系统，该照明子系统被配置成通过以斜入射角将光引导到晶片来照射晶片上的区域。该系统还包括收集子系统，该收集子系统被配置成同时收集从照射区域内的不同点散射的光并且将从不同点收集的光聚焦到图像平面中的对应位置。此外，该系统包括检测子系统，该检测子系统被配置为分别检测聚焦到图像平面中的对应位置的光并且响应于聚焦到图像平面中的对应位置的光分别生成输出。输出可用于检测晶圆上的缺陷。

10. 发明申请

WO2008137919A1 COMPUTER-IMPLEMENTED METHODS, COMPUTER-READABLE MEDIA, AND SYSTEMS FOR IDENTIFYING ONE OR MORE OPTICAL MODES OF AN INSPECTION SYSTEM AS CANDIDATES FOR USE IN INSPECTION OF A LAYER OF A WAFER 审中-公开
标题翻译：计算机实现方法，计算机可读介质和系统，用于识别检查系统中的一个或多个光学模式，作为用于检查水平层的候选
公开(公告)号：WO2008137919A1
公开(公告)日：2008-11-13
申请号：PCT/US2008/062870
申请日：2008-05-07
申请人： KLA-TENCOR CORPORATION , FISCHER, Verlyn , MAHER, Chris , HIRIYANNAIAH, Harish , VORA, Younus , DING, Ping , HILL, Andrew
发明人： FISCHER, Verlyn , MAHER, Chris , HIRIYANNAIAH, Harish , VORA, Younus , DING, Ping , HILL, Andrew
IPC分类号： G01N21/95 , G01B11/06 , H01L21/66
CPC分类号： G01N21/9501 , G03F1/84
摘要： Computer- implemented methods, computer- readable media, and systems for identifying one or more optical modes of an inspection system as candidates for use in inspection of a layer of a wafer are provided. One method includes determining one or more characteristics of images (20) of the layer of the wafer acquired using the inspection system and different optical modes available on the inspection system. The method also includes identifying a first portion (22) of the different optical modes as not candidates for use in the inspection of the layer of the wafer based on the one or more characteristics of the images. In addition, the method includes generating output by eliminating (24) the first portion of the different optical modes from the different optical modes at which the images were acquired such that the output includes a second portion (30) of the different optical modes indicated as the candidates for use in the inspection (34).
摘要翻译：提供了计算机实现的方法，计算机可读介质和用于识别检查系统的一个或多个光学模式的系统，作为用于检查晶片层的候选。一种方法包括确定使用检查系统获取的晶片层的图像（20）的一个或多个特性以及在检查系统上可用的不同光学模式。该方法还包括基于图像的一个或多个特征，将不同光学模式的第一部分（22）识别为不用于检查晶片层的候选。此外，该方法包括通过从不同光学模式中消除（24）不同光学模式的第一部分来产生输出，在该模式下，获取图像，使得输出包括不同光学模式的第二部分（30），其指示为候选人在检查中使用（34）。

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