会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 5. 发明申请
    • FLEXIBLE LEAD FRAME FOR MULTI-LEG PACKAGE ASSEMBLY
    • 用于多重包装组件的柔性引线框架
    • WO2015157161A1
    • 2015-10-15
    • PCT/US2015/024484
    • 2015-04-06
    • ALPHABET ENERGY, INC.
    • LORIMER, AdamCHASE, JordanCRANE, DouglasBEERA, Sasi, BhushanARORA, HiteshAGUIRRE, Mario
    • H01L35/02H01L35/32H01L35/34
    • H01L35/32H01L35/34
    • Thermoelectric structures include a flexible substrate; a plurality of conductive shunts; and a plurality of thermoelectric legs that are in thermal and electrical communication with the thermoelectric legs via thermal and electrical paths. In some embodiments, the paths are through apertures in the flexible substrate, and the flexible substrate can be substantially out of the thermal and electrical paths. Some embodiments include a circuit board coupled to the flexible substrate, and a bend in the flexible substrate can be disposed between the plurality of conductive shunts and the circuit board. In some embodiments, a plurality of perforations are defined through the flexible substrate and can be configured to rupture responsive to a temperature condition that otherwise would damage one or more of the thermal and electrical paths, said rupture inhibiting such damage. Other embodiments, and methods, are provided.
    • 热电结构包括柔性基板; 多个导电分流器; 以及多个热电腿,其通过热和电路与热电腿热电连通。 在一些实施例中,路径穿过柔性基底中的孔,并且柔性基底可以基本上不在热和电路径之外。 一些实施例包括耦合到柔性基板的电路板,并且柔性基板中的弯曲部可设置在多个导电分流器和电路板之间。 在一些实施例中,通过柔性基底限定多个穿孔,并且可以被配置为响应于否则会损坏热路径和电路径中的一个或多个的温度条件而破裂,所述破裂抑制这种损伤。 提供了其他实施例和方法。