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    • 6. 发明申请
    • LOW REFRACTIVE INDEX POLYMERS AS UNDERLAYERS FOR SILICON-CONTAINING PHOTORESISTS
    • 低折射率聚合物作为含硅光电子器件的底层
    • WO2006096221A1
    • 2006-09-14
    • PCT/US2005/043210
    • 2005-11-30
    • INTERNATIONAL BUSINESS MACHINES CORPORATIONHUANG, Wu-songBURNS, SeanKHOJASTEH, Mahmoud
    • HUANG, Wu-songBURNS, SeanKHOJASTEH, Mahmoud
    • G03C1/76
    • G03F7/094G03F7/091
    • A new underlayer composition that exhibits high etch resistance and improved optical properties is disclosed. The underlayer composition comprises a vinyl or acrylate polymer, such as a methacrylate polymer, the polymer comprising at least one substituted or unsubstituted naphthalene or naphthol moiety, including mixtures thereof. Examples of the polymer of this invention include: formula (I), (II), (III), (IV), where each R 1 is independently selected from an organic moiety or a halogen; each A is independently a single bond or an organic moietry; R 2 is hydrogen or a methyl group; and each X, Y and Z is an integer of 0 to 7, and Y+Z is / or less. The organic moiety mentioned above may be a substituted or unsubtituted hydrocarbon selected from the group consisting of a linear or branched alkyl, halogenated linear or branched alkyl, aryl, halogenated aryl, cyclic alkyl, and halogenated cyclic alkyl, and any combination thereof. The compositions are suitable for use as planarizing underlayer in a multilayer lithographic process, including a trilayer lothographic process.
    • 公开了具有高耐蚀刻性和改善的光学性能的新型底层组合物。 底层组合物包含乙烯基或丙烯酸酯聚合物,例如甲基丙烯酸酯聚合物,该聚合物包含至少一个取代或未取代的萘或萘酚部分,包括其混合物。 本发明的聚合物的实例包括:式(I),(II),(III),(IV),其中每个R 1独立地选自有机部分或卤素; 每个A独立地是单键或有机溶剂; R 2是氢或甲基; 并且每个X,Y和Z为0至7的整数,Y + Z为/或更小。 上述有机部分可以是选自直链或支链烷基,卤代直链或支链烷基,芳基,卤代芳基,环状烷基和卤代环状烷基的取代或未取代的烃及其任何组合。 该组合物适用于在多层平版印刷工艺中的平面化底层,包括三层薄膜工艺。
    • 9. 发明申请
    • SI-CONTAINING POLYMERS FOR NANO-PATTERN DEVICE FABRICATION
    • 用于纳米图案装置制造的含SI聚合物
    • WO2008055137A2
    • 2008-05-08
    • PCT/US2007/082967
    • 2007-10-30
    • INTERNATIONAL BUSINESS MACHINES CORPORATIONCHEN, Kuang-JungHUANG, Wu-SongLI, Wai-KinLIN, Yi-Hsiung, S.
    • CHEN, Kuang-JungHUANG, Wu-SongLI, Wai-KinLIN, Yi-Hsiung, S.
    • G03C1/00
    • G03F7/0758G03F7/0045
    • A resist polymer (22) that has nano-scale patterns of sub-lithographic openings (26) located therein that are oriented substantially perpendicular to its major surfaces is provided. Such a resist polymer having the nano-scale patterns is used as an etch mask transferring nano-scale patterns to an underlying substrate such as, for example, dielectric material (12). After the transferring of the nano-scale patterns into the substrate, nano-scale openings having a width of less than 50 nm are created in the substrate. The presence of the nano-scale voids in a dielectric material lowers the dielectric constant, k, of the original dielectric material. In accordance with an aspect of the present invention, the inventive resist polymer comprises a copolymer that includes a first monomer unit (A) that contains a Si-containing component, and a second monomer unit (B) that contains an organic component, wherein said two monomer units (A and B) have different etch rates.
    • 提供了具有位于其中的基本上垂直于其主表面定向的亚光刻开口(26)的纳米尺度图案的抗蚀剂聚合物(22)。 具有纳米尺度图案的这种抗蚀剂聚合物用作将纳米尺度图案转移到诸如介电材料(12)的下面的基底的蚀刻掩模。 在将纳米尺度图案转移到基底中之后,在基底中产生宽度小于50nm的纳米级开口。 电介质材料中纳米尺度空隙的存在降低了原始电介质材料的介电常数k。 根据本发明的一个方面,本发明的抗蚀剂聚合物包括包含含有含Si组分的第一单体单元(A)和含有有机组分的第二单体单元(B)的共聚物,其中所述 两个单体单元(A和B)具有不同的蚀刻速率。