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1. 发明专利

JP2005203744A Printed circuit transformer 审中-公开
标题翻译：印刷电路变压器
公开(公告)号：JP2005203744A
公开(公告)日：2005-07-28
申请号：JP2004331421
申请日：2004-11-16
申请人： Vlt Inc , ヴィエルティーインコーポレーテッド
发明人： VINCIARELLI PATRIZIO
IPC分类号： H05K1/16 , H01F17/00 , H01F27/28 , H01F30/00
CPC分类号： H01F27/2804 , H01F27/2847 , H01F2038/006 , H05K1/165
摘要： PROBLEM TO BE SOLVED: To easily make adjustments so as to be applied to a broad scope of turns ratio and applications while keeping desired characteristics. SOLUTION: A circuit board has an opening. Individual magnetic flux paths each pass through at least one opening to form a closed loop that encloses an internal space. The magnetic flux path includes a part of the magnetic flux path that is extended inside a permeable core piece. At least two magnetic flux paths are opposite to each other, and a straight line that does not pass through even one opening contained in the path and passes through the internal spaces of the two magnetic flux paths exists in the circuit board. A conductive primary winding has a second segment located outside a first segment that passes through the internal space of the permeable path and the internal space. Two conductive secondary windings or more exist. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：为了容易地进行调整，以适用于广泛的匝数比和应用，同时保持期望的特性。
解决方案：电路板有一个开口。单独的磁通路径每个穿过至少一个开口以形成封闭内部空间的闭环。磁通路径包括在可渗透芯片内延伸的磁通路径的一部分。至少两个磁通路径彼此相对，并且不通过包含在通路中的一个开口并穿过两个磁通路径的内部空间的直线存在于电路板中。导电初级绕组具有位于穿过可渗透路径的内部空间和内部空间的第一段之外的第二段。存在两个导电次级绕组。版权所有（C）2005，JPO＆NCIPI

2. 发明专利

JP2005151799A Surface attachment of power converter 审中-公开
标题翻译：电力转换器表面贴装
公开(公告)号：JP2005151799A
公开(公告)日：2005-06-09
申请号：JP2004327395
申请日：2004-11-11
申请人： Vlt Inc , ヴィエルティーインコーポレーテッド
发明人： VINCIARELLI PATRIZIO , PRAGER JAY , LAFLEUR MICHAEL B
IPC分类号： H02M3/00 , H01R43/02 , H05K1/14 , H05K3/34 , H05K3/36 , H05K7/10
CPC分类号： H05K3/368 , H01R12/57 , H01R43/0256 , H05K1/141 , H05K3/3426 , H05K3/3436 , H05K2201/1031 , Y02P70/611
摘要： PROBLEM TO BE SOLVED: To provide a power converter module that is surface-mounted on an electronic circuit board. SOLUTION: A power converter module 30 has soldered ball grid arrays 31a, 31b that constitute electric connections, and the soldered ball grid arrays 31a, 31b are provided with right-left symmetric J shape lead connectors 28, 29, which serve as electric connection terminals. In the case that the power converter module 30 is surface mounted on an electronic circuit board, the J shape lead connectors 28, 29 form legs, thus creating a clearance between the power converter module 30 and the board. This configuration increases the mounting density of the electronic circuit board and facilitates the cooling of the power converter module 30. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种表面安装在电子电路板上的功率转换器模块。电源转换器模块30具有构成电连接的焊接球栅阵列31a，31b，焊接球栅阵列31a，31b设置有左右对称J形引线连接器28,29，其用作电连接端子。在电力转换器模块30被表面安装在电子电路板上的情况下，J形引线连接器28,29形成支脚，从而在电力转换器模块30与电路板之间产生间隙。该配置增加了电子电路板的安装密度，并且有助于功率转换器模块30的冷却。版权所有（C）2005，JPO＆NCIPI

3. 发明申请

WO2012155036A3 PANEL-MOLDED ELECTRONIC ASSEMBLIES 审中-公开
公开(公告)号：WO2012155036A3
公开(公告)日：2012-11-15
申请号：PCT/US2012/037495
申请日：2012-05-11
申请人： VLT, INC. , VINCIARELLI, Patrizio , LAFLEUR, Michael B. , FLEMING, Sean Timothy , MUTTER, Rudolph , D'AMICO, Andrew, T
发明人： VINCIARELLI, Patrizio , LAFLEUR, Michael B. , FLEMING, Sean Timothy , MUTTER, Rudolph , D'AMICO, Andrew, T
IPC分类号： H05K7/00 , H01R43/00 , H05K5/00 , B29C33/20
摘要： A method of encapsulating a panel of electronic components such as power converters reduces wasted printed circuit board area. The panel, which may include a plurality of components, may be cut into one or more individual pieces after encapsulation. The mold may be used to form part of the finished product. Interconnection features provided along boundaries of individual circuits are exposed during the singulation process providing electrical connections to the components without wasting valuable PCB surface area. The molds may include various internal features. Wide cuts may be made in the molds after encapsulation reducing thermal stresses. Blank mold panels may be machined to provide some or all of the above features in an on-demand manufacturing system. Connection adapters may be provided to use the modules in vertical or horizontal mounting positions in connector, through-hole, surface-mount solder variations.

4. 发明申请

WO2012155036A2 PANEL-MOLDED ELECTRONIC ASSEMBLIES 审中-公开
标题翻译：面板模制电子组件
公开(公告)号：WO2012155036A2
公开(公告)日：2012-11-15
申请号：PCT/US2012037495
申请日：2012-05-11
申请人： VLT INC , VINCIARELLI PATRIZIO , LAFLEUR MICHAEL B , FLEMING SEAN TIMOTHY , MUTTER RUDOLPH , D AMICO ANDREW
发明人： VINCIARELLI PATRIZIO , LAFLEUR MICHAEL B , FLEMING SEAN TIMOTHY , MUTTER RUDOLPH , D AMICO ANDREW
IPC分类号： H05K7/00 , B29C33/20 , H01R43/00 , H05K5/00
CPC分类号： H05K3/284 , B23P15/007 , B29C45/0055 , B29C45/14639 , B29C45/1679 , B29C2045/0058 , B29C2045/169 , B29C2793/0009 , B29C2793/0027 , B29C2793/009 , H01F27/24 , H01F27/2804 , H01F2027/2809 , H01R43/24 , H05K1/0209 , H05K1/0298 , H05K1/115 , H05K1/181 , H05K5/0004 , H05K5/0065 , H05K5/0217 , H05K5/0247 , H05K5/04 , H05K5/064 , H05K7/1427 , H05K7/209 , H05K2201/066 , H05K2201/10545 , H05K2203/1316 , H05K2203/1327 , H05K2203/167 , Y10T29/49117 , Y10T29/49126 , Y10T29/4913 , Y10T29/49133 , Y10T29/49144 , Y10T29/49155
摘要： A method of encapsulating a panel of electronic components such as power converters reduces wasted printed circuit board area. The panel, which may include a plurality of components, may be cut into one or more individual pieces after encapsulation. The mold may be used to form part of the finished product, e.g. providing heat sink fins or a surface mount solderable surface. Interconnection features provided along boundaries of individual circuits are exposed during the singulation process providing electrical connections to the components without wasting valuable PCB surface area. The molds may include various internal features such as registration features accurately locating the circuit board within the mold cavity, interlocking contours for structural integrity of the singulated module, contours to match component shapes and sizes enhancing heat removal from internal components and reducing the required volume of encapsulant, clearance channels providing safety agency spacing and setbacks for the interconnects. Wide cuts may be made in the molds after encapsulation reducing thermal stresses and reducing the thickness of material to be cut during subsequent singulation. External mold features can include various fin configurations for heat sinks, flat surfaces for surface mounting or soldering, etc. Blank mold panels may be machined to provide some or all of the above features in an on-demand manufacturing system. Connection adapters may be provided to use the modules in vertical or horizontal mounting positions in connector, through-hole, surface-mount solder variations. The interconnects may be plated to provide a connectorized module that may be inserted into a mating connector. Reuseable plates may be used instead of the heat sink panels. Alternatively the panel may be encapsulated in and separated from a re-useable mold after curing.
摘要翻译：封装诸如功率转换器之类的电子部件的面板的方法减少了浪费的印刷电路板面积。可以包括多个部件的面板可以在封装之后切割成一个或多个单独的部件。模具可以用于形成成品的一部分，例如，提供散热鳍片或表面安装可焊接表面。在分离过程中，单独电路边界处提供的互连特征暴露于提供与组件的电连接，而不浪费有价值的PCB表面积。模具可以包括各种内部特征，例如将电路板精确地定位在模腔内的配准特征，用于单个模块的结构完整性的互锁轮廓，用于匹配部件形状的轮廓和增加从内部部件散热的尺寸，以及减小所需体积密封剂，间隙通道为互连提供安全机构间距和挫折。封装之后可以在模具中形成宽切削，从而降低热应力并减小在随后的切割过程中要切割的材料的厚度。外部模具特征可以包括用于散热器的各种翅片配置，用于表面安装或焊接的平坦表面等。可以加工空白模具面板以在按需制造系统中提供部分或全部上述特征。可以提供连接适配器，以在连接器，通孔，表面贴装焊料变化中的垂直或水平安装位置使用模块。互连可以被电镀以提供可插入到配合连接器中的连接器化模块。可以使用可再利用的板来代替散热板。或者，面板可以在固化之后被封装在可再使用的模具中并与其分离。

5. 发明授权

US10763759B1 Power adapter 有权
公开(公告)号：US10763759B1
公开(公告)日：2020-09-01
申请号：US16360781
申请日：2019-03-21
申请人： VLT, Inc.
发明人： Patrizio Vinciarelli , Andrew T. D{grave over ( )}Amico
IPC分类号： H05K5/00 , H02M7/04 , H01R31/06 , H05K7/20 , H02M7/00 , H05K5/02
摘要： An efficient, high density, inline converter module includes a power conversion circuit and an input wiring harness for connecting the input of the power circuit to a unipolar source. A second wiring harness or electrical connectors may be provided for connecting the output of the power conversion circuit to a load. Connections between a wiring harness and the power conversion circuit may comprise conductive contacts, configured to distribute heat. The power circuit may be over molded to provide electrical insulation and efficient heat transfer to external ambient air. A DC transformer based inline converter module may be used in AC adapter, vehicular, and power system architectures. An input connector for connecting the input wiring harness to the input source may be provided. In some embodiments the input source may be an AC source and the input connector may comprise a rectifier for delivering a rectified, unipolar, voltage to the input of the power conversion assembly via an input wiring harness. By separating the rectifier from the power conversion assembly, the power conversion assembly may be packaged into a smaller volume than would be required if the rectifier, and its associated heat loss, were included in the power conversion assembly.

6. 发明授权

US10701828B1 Panel-molded electronic assemblies 有权
公开(公告)号：US10701828B1
公开(公告)日：2020-06-30
申请号：US15150875
申请日：2016-05-10
申请人： VLT, Inc.
发明人： Patrizio Vinciarelli , Michael B. LaFleur , Sean Timothy Fleming , Rudolph F. Mutter , Andrew T. D'Amico
IPC分类号： H05K1/00 , H05K1/18 , H05K7/00 , H05K7/14 , H05K1/11 , B29C45/14 , B29C45/00 , B29C45/16 , B29K63/00
摘要： A method of encapsulating a panel of electronic components such as power converters reduces wasted printed circuit board area. The panel, which may include a plurality of components, may be cut into one or more individual pieces after encapsulation with the mold forming part of the finished product, e.g. providing heat sink fins or a surface mount solderable surface. Interconnection features provided along boundaries of individual circuits are exposed during the singulation process providing electrical connections to the components without wasting valuable PCB surface area. The molds may include various internal features such as registration features accurately locating the circuit board within the mold cavity, interlocking contours for structural integrity of the singulated module, contours to match component shapes and sizes enhancing heat removal from internal components and reducing the required volume of encapsulant, clearance channels providing safety agency spacing and setbacks for the interconnects. Wide cuts may be made in the molds after encapsulation reducing thermal stresses and reducing the thickness of material to be cut during subsequent singulation. External mold features can include various fin configurations for heat sinks, flat surfaces for surface mounting or soldering, etc. Blank mold panels may be machined to provide some or all of the above features in an on-demand manufacturing system. Connection adapters may be provided to use the modules in vertical or horizontal mounting positions in connector, through-hole, surface-mount solder variations. The interconnects may be plated to provide a connectorized module that may be inserted into a mating connector.

7. 发明授权

US10658923B1 Start-up control in power systems using fixed-ratio power conversion 有权
公开(公告)号：US10658923B1
公开(公告)日：2020-05-19
申请号：US16581580
申请日：2019-09-24
申请人： VLT, Inc.
发明人： Patrizio Vinciarelli
IPC分类号： H02M1/36 , H02M3/158 , H02M1/08
摘要： A power converter system converts power from an input source for delivery to an active load. An input current surge at startup may be reduced by combining power converter switch resistance modulation with active load control. In another aspect, an input current surge at startup in an array of power converters may be reduced by periodically reconfiguring the array during the startup phase to accumulatively increase the output voltage up to a predetermined output voltage. A power converter may include a controller that provides an over-current signal to the load to reduce the load or advise of potential voltage perturbations.

8. 发明授权

US10651744B1 Method and apparatus for delivering power to semiconductors 有权
公开(公告)号：US10651744B1
公开(公告)日：2020-05-12
申请号：US16591842
申请日：2019-10-03
申请人： VLT, Inc.
发明人： Patrizio Vinciarelli
IPC分类号： H05K1/11 , H02M3/335 , H02M1/44 , H01F1/44 , H01F3/10 , H05K3/00 , H05K1/18 , H05K1/02 , H05K1/16 , H05K3/02 , H01F27/28 , H01F41/04 , H02M3/337 , H02M1/00
摘要： A semiconductor package includes a VLSI semiconductor die and one or more output circuits connected to supply power to the die mounted to a package substrate. The output circuit(s), which include a transformer and rectification circuitry, provide current multiplication at an essentially fixed conversion ratio, K, in the semiconductor package, receiving AC power at a relatively high voltage and delivering DC power at a relatively low voltage to the die. The output circuits may be connected in series or parallel as needed. A driver circuit may be provided outside the semiconductor package for receiving power from a source and driving the transformer in the output circuit(s), preferably with sinusoidal currents. The driver circuit may drive a plurality of output circuits. The semiconductor package may require far fewer interface connections for supplying power to the die.

9. 发明授权

US10199950B1 Power distribution architecture with series-connected bus converter 有权
公开(公告)号：US10199950B1
公开(公告)日：2019-02-05
申请号：US13933252
申请日：2013-07-02
申请人： VLT, INC.
发明人： Patrizio Vinciarelli , Andrew D'Amico
IPC分类号： H02M3/335
摘要： Apparatus for power conversion are provided. One apparatus includes a power converter including an input circuit and an output circuit. The power converter is configured to receive power from a source for providing power at a DC source voltage VS. The power converter is adapted to convert power from the input circuit to the output circuit at a substantially fixed voltage transformation ratio KDC=VOUT/VIN at an output current, wherein VIN is an input voltage and VOUT is an output voltage. The input circuit and at least a portion of the output circuit are connected in series across the source, such that an absolute value of the input voltage VIN applied to the input circuit is approximately equal to the absolute value of the DC source voltage VS minus a number N times the absolute value of the output voltage VOUT, where N is at least 1.

10. 发明授权

US10153704B1 Adaptive control of resonant power converters 有权
公开(公告)号：US10153704B1
公开(公告)日：2018-12-11
申请号：US16003185
申请日：2018-06-08
申请人： VLT, Inc.
发明人： Patrizio Vinciarelli
IPC分类号： H02M3/335 , H02M1/08 , H02M3/337 , H02M1/00
摘要： A power converter including a transformer, a resonant circuit including the transformer and a resonant capacitor having a characteristic resonant frequency and period, and output circuitry connected to the transformer for delivering a rectified output voltage to a load. Primary switches drive the resonant circuit, a switch controller operates the primary switches in a series of converter operating cycles which include power transfer intervals of adjustable duration during which a resonant current at the characteristic resonant frequency flows through a winding of the transformer. The operating cycles may also include energy recycling intervals of variable duration for charging and discharging capacitances within the converter. A gate driver includes a transformer, a plurality of switches, a current monitor, and a controller that operates the switches in a series of driver operating cycles having adjustable ON periods and adjustable transition periods during which capacitances are resonantly charged and discharged.

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