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1. 发明专利

MY101265A APPARATUS FOR HOLDING ELECTRICAL OR ELECTRONIC COMPONENTS DURING THE APPLICATION OF SOLDER. 未知
公开(公告)号：MY101265A
公开(公告)日：1991-08-17
申请号：MYPI19870972
申请日：1987-07-09
申请人： SUN INDUSTRIAL COATINGS PRIVATE LTD
发明人： SIM AH TEE (A SINGAPORE CITIZEN)
IPC分类号： B23K3/00 , B23K3/08 , H01L21/00
摘要： A CARRIER FOR HOLDING SOIC PACKAGES DURING THE APPLICATION OF SOLDER TO THEIR LEADS COMPRISES A FRAME INCLUDING AN END PLATE (17) WITH MOUNTING LUGS (20). ONE EACH LUG IS MOUNTED AN UPPER "U" SHAPED MEMBER (1) AND LOWER "U" SHAPED ELONGGATE MEMBER (8), WITH THEIR LEGS (3) AND (10) RESPECTIVELY PROJECTING DOWNWARDS. THE LEGS (10) ARE WITHIN THE LEGS (3) BUT EXTEND FURTHER AND ARE TURNED OUTWARDS AT THE ENDS (11). BETWEEN EACH SUCH ASSEMBLY IS DEFINED A TRACK (T) FOR A LINE OF SOIC PACKAGES (24) WHOSE LEADS (26) REST ON END PORTIONS (11) AND WHICH ARE RESTRICTED AGAINST UPWARDS MOTION BY THE END (4) OF LEGS (3).(FIG. 4)

2. 发明授权

US4856455A Apparatus for holding electrical or electronic components during the application of solder 失效
标题翻译：用于在焊料应用期间保持电气或电子部件的装置
公开(公告)号：US4856455A
公开(公告)日：1989-08-15
申请号：US43310
申请日：1987-04-28
申请人： Sim A. Tee
发明人： Sim A. Tee
IPC分类号： H05K13/02
CPC分类号： H05K13/02
摘要： A carrier for dual-in-line packages to be wave soldered, comprises a frame with tracks into which the packages can be slid. The tracks are defined by aligned upper and lower "U"-shaped channel members providing rails. Each track is defined between adjacent pairs of upper and lower members. Gates at either end of the tracks control movement of the packages into or out of the carrier. The carrier can be loaded and unloaded by means of apparatus including an inclined ramp on which the carrier can be releasably located, the packages being fed into the top of the ramp to fill the carrier, and sliding to the bottom of the ramp to empty the carrier of soldered packages prior to re-filling. Movement of the packages down the ramp is controlled by gates.
摘要翻译：用于双列直插式封装的波导焊接的载体包括具有轨道的框架，封装可以滑入该框架中。轨道由对准的上和下“U”形通道构件提供轨道限定。每个轨道在相邻的上部和下部构件对之间限定。轨道的任一端的门控制包装进入或离开承运人的运动。载体可以通过包括倾斜斜面的装置装载和卸载，载体可以在其上可释放地定位，所述包装被馈送到斜坡的顶部以填充载体，并滑动到斜坡的底部以将在重新填充之前，焊接包装的载体。封装在斜坡下的移动由门控制。

3. 发明授权

US5611475A Soldering apparatus 失效
标题翻译：焊接设备
公开(公告)号：US5611475A
公开(公告)日：1997-03-18
申请号：US658691
申请日：1991-02-21
申请人： Ah T. Sim
发明人： Ah T. Sim
IPC分类号： B23K3/06 , H05K3/34 , B23K37/047
CPC分类号： B23K3/0676
摘要： Apparatus for applying solder to electrical or electronic components mounted in a horizontally oriented carrier, includes a solder bath, a pair of tracks (1,2) for guiding the carrier across the solder bath, and a device for urging the carrier along the tracks. The track has a first profiled region (12,19) for guiding a leading position of the carrier down towards the surface of the solder, and a second profiled region (16,20) longitudinally spaced from the first region, and laterally offset, for simultaneously guiding a trailing portion of the carrier down towards the surface of the solder, the profiles being substantially the same so that the carrier maintains its horizontal orientation while being moved vertically towards and away from the surface of the solder. The carrier moves on follower wheels which run along the tracks.
摘要翻译：用于将焊料施加到安装在水平定向的载体上的电气或电子部件的装置包括焊料槽，用于引导载体穿过焊料槽的一对轨道（1,2），以及用于沿轨道推动载体的装置。轨道具有用于将载体的引导位置向下引导到焊料的表面的第一成型区域（12,19）和与第一区域纵向间隔开的第二成型区域（16,20），并且横向偏移，用于同时将载体的尾部向下引导朝向焊料的表面，所述轮廓基本相同，使得载体保持其水平取向，同时垂直朝向和远离焊料的表面移动。载体在沿着轨道延伸的从动轮上移动。

4. 发明授权

US4747532A Apparatus for holding electrical or electronic components during the application of solder 失效
标题翻译：用于在焊料应用期间保持电气或电子部件的装置
公开(公告)号：US4747532A
公开(公告)日：1988-05-31
申请号：US897824
申请日：1986-08-19
申请人： Ah T. Sim
发明人： Ah T. Sim
IPC分类号： H05K13/04 , B23K37/04
CPC分类号： H05K13/0465 , Y10S269/903
摘要： A carrier for components to be soldered includes an upper frame pivotally connected to a lower frame. The upper frame includes longitudinal grid members interlocked with transverse grid members to define recessed zones with stepped corners to locate the components. The lower frame has slidably mounted strips with projections which engage the components when the lower frame is pivoted to a closed condition.
摘要翻译：待焊接部件的载体包括枢转地连接到下部框架的上部框架。上框架包括与横向网格构件互锁的纵向格栅构件，以限定具有阶梯形拐角以定位构件的凹陷区域。当下框架枢转到关闭状态时，下框架具有可滑动地安装的具有凸起的条带，该突起与部件接合。

5. 发明授权

US4677937A Apparatus for holding electrial or electronic components during the application of solder 失效
标题翻译：用于在焊料应用过程中保持电子元件或电子部件的装置
公开(公告)号：US4677937A
公开(公告)日：1987-07-07
申请号：US760585
申请日：1985-07-30
申请人： Sim Ah Tee
发明人： Sim Ah Tee
IPC分类号： B23K3/00 , B05D5/12 , H05K13/02
CPC分类号： H05K13/02
摘要： A carrier for dual-in-line packages to be wave soldered, comprises a frame with tracks into which the packages can be slid. The tracks are defined by aligned upper and lower "U"-shaped channel members providing rails. Each track is defined between adjacent pairs of upper and lower members. Gates at either end of the tracks control movement of the packages into or out of the carrier. The carrier can be loaded and unloaded by means of apparatus including an inclined ramp on which the carrier can be releasably located, the packages being fed into the top of the ramp to fill the carrier, and sliding to the bottom of the ramp to empty the carrier of soldered packages prior to re-filling. Movement of the packages down the ramp is controlled by gates.
摘要翻译：用于双列直插式封装的波导焊接的载体包括具有轨道的框架，封装件可以滑入其中。轨道由对准的上和下“U”形通道构件提供轨道限定。每个轨道在相邻的上部和下部构件对之间限定。轨道的任一端的门控制包装进入或离开承运人的运动。载体可以通过包括倾斜斜面的装置装载和卸载，载体可以在其上可释放地定位，所述包装被馈送到斜坡的顶部以填充载体，并且滑动到斜坡的底部以将在重新填充之前，焊接包装的载体。封装在斜坡下的移动由门控制。

6. 发明授权

EP0252771B1 Soldering apparatus 失效
标题翻译：焊接设备
公开(公告)号：EP0252771B1
公开(公告)日：1992-12-02
申请号：EP87306187.3
申请日：1987-07-13
申请人： SUN INDUSTRIAL COATINGS PRIVATE LTD.
发明人： Sim, Ah Tee
IPC分类号： B23K3/06 , H01L21/00
CPC分类号： B23K3/0676

7. 发明公开

EP0252770A2 Apparatus for holding electrical or electronic components during the application of solder 失效
标题翻译：装置用于Lötmittelauflegens期间保持电气或电子元件。
公开(公告)号：EP0252770A2
公开(公告)日：1988-01-13
申请号：EP87306186.5
申请日：1987-07-13
申请人： SUN INDUSTRIAL COATINGS PRIVATE LTD.
发明人： Sim, Ah Tee
IPC分类号： H01L21/00 , B23K3/00
CPC分类号： B23K3/087
摘要： A carrier for holding SOIC packages during the application of solder to their leads comprises a frame including an end plate (17) with mounting lugs (20). On each lug is mounted an upper "U"shaped member (1) and a lower "U" shaped eleongate member (8), with their legs (3) and (10) respectively projecting downwards. The legs (10) are within the legs (3) but extend further and are turned outwards at the ends (11). Between each such assembly is defined a track (T) for a line of SOIC packages (24) whose leads (26) rest on end portions (11) and which are restricted against upwards motion by the ends (4) of legs (3).
摘要翻译：一种用于焊料的应用，它们的引线期间保持SOIC封装载波包括框架，其包括安装到端板（17）与突出部（20）。上每个凸耳被安装上的“U”形的构件（1）和较低的“U”形的构件eleongate（8）随着他们的腿（3）和（10）分别向下伸出上。腿（10）是腿（3）内延伸，但进一步，并且在端部（11）向外转动。之间的每个求组件被用于SOIC封装的是谁的引线（26）的线（24）搁置在端部（11）和其中所定义的轨道（T）由腿的端部（4）对向上运动受限（3），

8. 发明公开

EP0211692A2 Apparatus for holding electrical or electronic components during the application of solder 失效
标题翻译：一种用于焊料的应用过程中保持电气或电子元件。
公开(公告)号：EP0211692A2
公开(公告)日：1987-02-25
申请号：EP86306464.8
申请日：1986-08-20
申请人： SUN INDUSTRIAL COATINGS PRIVATE LTD.
发明人： Sim, Ah Tee
IPC分类号： H05K13/02 , H05K13/04
CPC分类号： H05K13/0465 , Y10S269/903
摘要： A carrier for components to be soldered includes an upper frame (1) pivotally connected to a lower frame (3). The upper frame includes longitudinal grid members (14) interlocked with transverse grid members (15) to define recessed zones (31) with stepped corners to locate the components. The lower frame (3) has slidably mounted strips (9) with projections (21) which engage the components when the lower frame is pivoted to a closed condition.

9. 发明公开

EP0171257A3 Apparatus for holding electrical or electronic components during the application of solder 失效
标题翻译：用于在焊接应用过程中保持电气或电子部件的装置
公开(公告)号：EP0171257A3
公开(公告)日：1986-09-03
申请号：EP85305437
申请日：1985-07-30
申请人： SUN INDUSTRIAL COATINGS PRIVATE LTD.
发明人： Sim, Ah Tee
IPC分类号： H05K13/04
CPC分类号： H05K13/02
摘要： A carrier for dual-in-line packages (200) to be wave soldered, comprises a frame (11) with tracks (T) into which the packages (200) can be slid. The tracks (T) are defined by aligned upper and lower «U»-shaped channel members (1, 6) providing rails (2, 7). Each track is defined between adjacent pairs of upper and lower members (1, 6). Gates (23) at either end of the tracks (T) control movement of the packages into or out of the carrier. The carrier can be loaded and unloaded by means of apparatus including an inclined ramp (29) on which the carrier can be releasably located, the packages being fed into the top of the ramp (29) to fill the carrier, and sliding to the bottom of the ramp (29) to empty the carrier of soldered packages prior to re-filling. Movement of the packages down the ramp is controlled by gates (32, 33, 34, 42, 43).

10. 发明授权

EP0211692B1 Apparatus for holding electrical or electronic components during the application of solder 失效
标题翻译：一种用于焊料的应用过程中保持电气或电子元件。
公开(公告)号：EP0211692B1
公开(公告)日：1994-07-06
申请号：EP86306464.8
申请日：1986-08-20
申请人： SUN INDUSTRIAL COATINGS PRIVATE LTD.
发明人： Sim, Ah Tee
IPC分类号： H05K13/02 , H05K13/04
CPC分类号： H05K13/0465 , Y10S269/903

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