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    • 2. 发明授权
    • Stacked LED device with diagonal bonding pads
    • 堆叠的LED器件与对角焊盘
    • US08835948B2
    • 2014-09-16
    • US13450682
    • 2012-04-19
    • Yuan-Hsiao ChangYi-An Lu
    • Yuan-Hsiao ChangYi-An Lu
    • H01L29/201H01L33/00
    • H01L25/0756H01L25/0753H01L33/62H01L2224/48137H01L2224/49175H01L2924/00
    • A semiconductor light emitting device includes a substrate and a first epitaxial structure over the substrate. The first epitaxial structure includes a first doped layer, a first light emitting layer, and a second doped layer. A first electrode is coupled to the first doped layer. A second electrode is coupled to the second doped layer facing the same direction as the first electrode. A second epitaxial structure includes a third doped layer, a second light emitting layer, and a fourth doped layer. A third electrode is coupled to the third doped layer facing the same direction as the first electrode. A fourth electrode is coupled to the fourth doped layer facing the same direction as the first electrode. An adhesive layer is between the first epitaxial structure and the second epitaxial structure.
    • 半导体发光器件包括衬底和衬底上的第一外延结构。 第一外延结构包括第一掺杂层,第一发光层和第二掺杂层。 第一电极耦合到第一掺杂层。 第二电极被耦合到面向与第一电极相同的方向的第二掺杂层。 第二外延结构包括第三掺杂层,第二发光层和第四掺杂层。 第三电极耦合到面向与第一电极相同方向的第三掺杂层。 第四电极耦合到面向与第一电极相同方向的第四掺杂层。 粘合剂层位于第一外延结构和第二外延结构之间。
    • 4. 发明申请
    • STACKED LED DEVICE WITH POSTS IN ADHESIVE LAYER
    • 堆叠式LED装置,粘贴层
    • US20140070261A1
    • 2014-03-13
    • US14077625
    • 2013-11-12
    • PHOSTEK, INC.
    • Yi-An LuHeng Liu
    • H01L33/36
    • H01L33/36H01L25/0756H01L33/22H01L2924/0002H01L2924/00
    • A semiconductor light emitting device includes a substrate and a first epitaxial structure over the substrate. The first epitaxial structure includes a first doped layer, a first light emitting layer, and a second doped layer. The first doped layer includes a first dopant type and the second doped layer includes a second dopant type. A second epitaxial structure includes a third doped layer, a second light emitting layer, and a fourth doped layer. An adhesive layer is between the first epitaxial structure and the second epitaxial structure. One or more posts are located in the adhesive layer. An electrode pattern is located on an upper surface of the second epitaxial structure, wherein the posts are located under electrodes in the electrode pattern.
    • 半导体发光器件包括衬底和衬底上的第一外延结构。 第一外延结构包括第一掺杂层,第一发光层和第二掺杂层。 第一掺杂层包括第一掺杂剂类型,第二掺杂层包括第二掺杂剂类型。 第二外延结构包括第三掺杂层,第二发光层和第四掺杂层。 粘合剂层位于第一外延结构和第二外延结构之间。 一个或多个柱位于粘合剂层中。 电极图案位于第二外延结构的上表面上,其中柱位于电极图案中的电极下方。
    • 6. 发明申请
    • STACKED LED DEVICE USING OXIDE BONDING
    • 堆叠LED设备使用氧化物结合
    • US20130264587A1
    • 2013-10-10
    • US13438886
    • 2012-04-04
    • Yuan-Hsiao Chang
    • Yuan-Hsiao Chang
    • H01L27/15H01L33/42H01L33/08
    • H01L27/15H01L25/0756H01L33/08H01L2224/48137H01L2224/48472H01L2224/49107
    • A semiconductor light emitting device includes a substrate, a first epitaxial structure, a first substantially transparent conducting layer, a second epitaxial structure, a second substantially transparent conducting layer, and a substantially transparent insulating layer. The first epitaxial structure is over the substrate and includes a first doped layer, a first light emitting layer, and a second doped layer. The first substantially transparent conducting layer is coupled to the second doped layer. The second epitaxial structure includes a third doped layer, a second light emitting layer, and a fourth doped layer. The second substantially transparent conducting layer is coupled to the fourth doped layer. The substantially transparent insulating layer is between the first substantially transparent conducting layer and the second substantially transparent conducting layer.
    • 半导体发光器件包括衬底,第一外延结构,第一基本上透明的导电层,第二外延结构,第二基本上透明的导电层和基本透明的绝缘层。 第一外延结构在衬底上,并且包括第一掺杂层,第一发光层和第二掺杂层。 第一基本上透明的导电层耦合到第二掺杂层。 第二外延结构包括第三掺杂层,第二发光层和第四掺杂层。 第二基本上透明的导电层耦合到第四掺杂层。 基本透明的绝缘层位于第一基本上透明的导电层和第二基本上透明的导电层之间。