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1. 发明专利

TW200739875A 半導體封裝體、具有導電性柱之基板、疊層式半導體裝置、半導體封裝體之製造方法、及疊層式半導體裝置之製造方法 SEMICONDUCTOR PACKAGE, SUBSTRATE WITH CONDUCTIVE POST, STACKED TYPE SEMICONDUCTOR DEVICE, MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF STACKED TYPE SEMICONDUCTOR DEVICE 审中-公开
简体标题：半导体封装体、具有导电性柱之基板、叠层式半导体设备、半导体封装体之制造方法、及叠层式半导体设备之制造方法 SEMICONDUCTOR PACKAGE, SUBSTRATE WITH CONDUCTIVE POST, STACKED TYPE SEMICONDUCTOR DEVICE, MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF STACKED TYPE SEMICONDUCTOR DEVICE
公开(公告)号：TW200739875A
公开(公告)日：2007-10-16
申请号：TW096101456
申请日：2007-01-15
申请人：爾必達存儲器股份有限公司 ELPIDA MEMORY, INC. , NEC凸版電子基板股份有限公司 NEC TOPPAN CIRCUIT SOLUTIONS, INC.
发明人：山口昌浩 YAMAGUCHI, MASAHIRO , 中村博文 NAKAMURA, HIROFUMI
IPC分类号： H01L
CPC分类号： H01L25/0657 , H01L23/5389 , H01L24/48 , H01L24/73 , H01L25/105 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48225 , H01L2224/48227 , H01L2224/73265 , H01L2225/0651 , H01L2225/06541 , H01L2225/06568 , H01L2225/06586 , H01L2225/1023 , H01L2225/1058 , H01L2225/1088 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/1815 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要：一種半導體封裝體,包含:基板,包含連接至複數外部電極的配線圖型;一或多個半導體晶片,連接至該配線圖型並被裝設於該基板上;導電性柱,連接至一預定的該外部電極,且在垂直方向上具有繼電電極的作用;及樹脂密封層,在該導電性柱處於其上端面受到裸露的狀態下該樹脂密封層係用以一體性地密封該半導體晶片及該導電性柱。
简体摘要：一种半导体封装体,包含:基板,包含连接至复数外部电极的配线图型;一或多个半导体芯片,连接至该配线图型并被装设于该基板上;导电性柱,连接至一预定的该外部电极,且在垂直方向上具有继电电极的作用;及树脂密封层,在该导电性柱处于其上端面受到裸露的状态下该树脂密封层系用以一体性地密封该半导体芯片及该导电性柱。

2. 发明专利

TWI224490B 印刷電路板及其製造方法與半導體裝置 PRINTED CIRCUIT BOARD AND ITS MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE 失效
简体标题：印刷电路板及其制造方法与半导体设备 PRINTED CIRCUIT BOARD AND ITS MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE
公开(公告)号：TWI224490B
公开(公告)日：2004-11-21
申请号：TW092117421
申请日：2003-06-26
申请人： NEC凸版電子基板股份有限公司 NEC TOPPAN CIRCUIT SOLUTIONS, INC. , NEC東金股份有限公司 NEC TOKIN CORPORATION
发明人：中村博文 HIROFUMI NAKAMURA , 荒井智次 SATOSHI ARAI
IPC分类号： H05K
CPC分类号： H01L24/81 , H01L21/563 , H01L23/49816 , H01L23/49822 , H01L23/49827 , H01L23/642 , H01L2224/16237 , H01L2224/32225 , H01L2224/73204 , H01L2224/81801 , H01L2224/83102 , H01L2224/92125 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/01061 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/15311 , H01L2924/19041 , H01L2924/30105 , H05K1/162 , H05K3/382 , H05K2201/0329 , H05K2201/0347 , H05K2201/035 , H05K2201/09509 , H05K2201/09554 , H05K2203/0315 , Y10T428/24917 , H01L2224/16225 , H01L2924/00 , H01L2224/0401
摘要：本發明旨在提供一種內設大靜電容值之電容器之薄型印刷電路板。為達成前述目的，本發明提供一種印刷電路板，具備：金屬板11，表面之一部分或全部受到粗化處理而具有凹凸面；電容器用電介質膜12，覆蓋金屬板之表面；第一導電層13，由覆蓋電容器用電介質膜表面之導電性樹脂構成；第二導電層14，於陰極連接用通孔18之區域，配設在第一導電層13之表面上；及樹脂15，覆蓋於金屬板11、第一導電層13第二導電層14；陰極連接用通孔18具有電極20，此電極20係被覆於將該樹脂15鑽孔至達到第二導電層14為止而成之通孔。在陽極連接用通孔19具有電極21，此電極21係被覆於將樹脂15鑽孔至達到該金屬板11之表面為止之通孔，電極21和第一導電層13係利用樹脂15予以絕緣。
简体摘要：本发明旨在提供一种内设大静电容值之电容器之薄型印刷电路板。为达成前述目的，本发明提供一种印刷电路板，具备：金属板11，表面之一部分或全部受到粗化处理而具有凹凸面；电容器用电介质膜12，覆盖金属板之表面；第一导电层13，由覆盖电容器用电介质膜表面之导电性树脂构成；第二导电层14，于阴极连接用通孔18之区域，配设在第一导电层13之表面上；及树脂15，覆盖于金属板11、第一导电层13第二导电层14；阴极连接用通孔18具有电极20，此电极20系被覆于将该树脂15钻孔至达到第二导电层14为止而成之通孔。在阳极连接用通孔19具有电极21，此电极21系被覆于将树脂15钻孔至达到该金属板11之表面为止之通孔，电极21和第一导电层13系利用树脂15予以绝缘。

3. 发明专利

TW200405785A 印刷電路板及其製造方法與半導體裝置 PRINTED CIRCUIT BOARD AND ITS MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE 失效
简体标题：印刷电路板及其制造方法与半导体设备 PRINTED CIRCUIT BOARD AND ITS MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE
公开(公告)号：TW200405785A
公开(公告)日：2004-04-01
申请号：TW092117421
申请日：2003-06-26
申请人： NEC凸版電子基板股份有限公司 NEC TOPPAN CIRCUIT SOLUTIONS, INC. , NEC東金股份有限公司 NEC TOKIN CORPORATION
发明人：中村博文 HIROFUMI NAKAMURA , 荒井智次 SATOSHI ARAI
IPC分类号： H05K
CPC分类号： H01L24/81 , H01L21/563 , H01L23/49816 , H01L23/49822 , H01L23/49827 , H01L23/642 , H01L2224/16237 , H01L2224/32225 , H01L2224/73204 , H01L2224/81801 , H01L2224/83102 , H01L2224/92125 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/01061 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/15311 , H01L2924/19041 , H01L2924/30105 , H05K1/162 , H05K3/382 , H05K2201/0329 , H05K2201/0347 , H05K2201/035 , H05K2201/09509 , H05K2201/09554 , H05K2203/0315 , Y10T428/24917 , H01L2224/16225 , H01L2924/00 , H01L2224/0401
摘要：本發明旨在提供一種內設大靜電容值之電容器之薄型印刷電路板。為達成前述目的，本發明提供一種印刷電路板，具備：金屬板11，表面之一部分或全部受到粗化處理而具有凹凸面；電容器用電介質膜12，覆蓋金屬板之表面；第一導電層13，由覆蓋電容器用電介質膜表面之導電性樹脂構成；第二導電層14，於陰極連接用通孔18之區域，配設在第一導電層13之表面上；及樹脂15，覆蓋於金屬板11、第一導電層13第二導電層14；陰極連接用通孔18具有電極20，此電極20係被覆於將該樹脂15鑽孔至達到第二導電層14為止而成之通孔。在陽極連接用通孔19具有電極21，此電極21係被覆於將樹脂15鑽孔至達到該金屬板11之表面為止之通孔，電極21和第一導電層13係利用樹脂15予以絕緣。
简体摘要：本发明旨在提供一种内设大静电容值之电容器之薄型印刷电路板。为达成前述目的，本发明提供一种印刷电路板，具备：金属板11，表面之一部分或全部受到粗化处理而具有凹凸面；电容器用电介质膜12，覆盖金属板之表面；第一导电层13，由覆盖电容器用电介质膜表面之导电性树脂构成；第二导电层14，于阴极连接用通孔18之区域，配设在第一导电层13之表面上；及树脂15，覆盖于金属板11、第一导电层13第二导电层14；阴极连接用通孔18具有电极20，此电极20系被覆于将该树脂15钻孔至达到第二导电层14为止而成之通孔。在阳极连接用通孔19具有电极21，此电极21系被覆于将树脂15钻孔至达到该金属板11之表面为止之通孔，电极21和第一导电层13系利用树脂15予以绝缘。

4. 发明专利

HK1099469A1 SOLDERING METHOD AND SOLDER JOINT MEMBER 未知
公开(公告)号：HK1099469A1
公开(公告)日：2007-08-10
申请号：HK07106370
申请日：2003-12-22
申请人： NEC INFRONTIA CORP , NEC TOPPAN CIRCUIT SOLUTIONS INC , SOLDERCOAT CO LTD , MARUYA SEISAKUSHO CO LTD , NIHON DEN-NETSU KEIKI KK
发明人： KAZUHIKO TANABE , HIROAKI TERADA , MASAHIRO SUGIURA , TETSUHARU MIZUTANI , KEIICHIRO IMAMURA , TAKASHI TANAKA
IPC分类号： B23K35/26 , B23K1/08 , B23K1/20 , B23K3/06 , B23K35/36 , B23K35/363 , B23K101/42 , C22C13/00 , H05K20100101 , H05K3/34
摘要： In a soldering method for soldering an electronic component including a palladium or palladium alloy layer formed on a surface of the electronic component and also including a soldering lead terminal onto a printed wiring board including a soldering land and plated through hole, a solder layer containing tin and zinc as main components is formed on the surfaces of the land through hole by a HAL treatment. The lead terminal is inserted and mounted in the through hole. The printed wiring board is brought into contact with jet flows of a solder containing tin and zinc as the main components to thereby supply a solder to the land and through hole.

5. 发明专利

HK1057147A1 Soldering method and solder joint member 未知
公开(公告)号：HK1057147A1
公开(公告)日：2004-03-12
申请号：HK03109301
申请日：2003-12-22
申请人： NEC INFRONTIA CORP , NEC TOPPAN CIRCUIT SOLUTIONS INC , SOLDERCOAT CO LTD , MARUYA SEISAKUSHO CO LTD , NIPPON DENNETSU KEIKI KK
发明人： TANABE KAZUHIKO , TERADA HIROAKI , SUGIURA MASAHIRO , MIZUTANI TETSUHARU , IMAMURA KEIICHIRO , TANAKA TAKASHI
IPC分类号： B23K35/26 , H05K20060101 , B23K20060101 , B23K1/08 , B23K1/20 , B23K3/06 , B23K35/36 , B23K35/363 , B23K101/42 , C22C13/00 , H05K3/34
摘要： In a soldering method for soldering an electronic component including a palladium or palladium alloy layer formed on a surface of the electronic component and also including a soldering lead terminal onto a printed wiring board including a soldering land and plated through hole, a solder layer containing tin and zinc as main components is formed on the surfaces of the land through hole by a HAL treatment. The lead terminal is inserted and mounted in the through hole. The printed wiring board is brought into contact with jet flows of a solder containing tin and zinc as the main components to thereby supply a solder to the land and through hole.

6. 发明专利

JP2013175521A Identification tag 有权
标题翻译：识别标签
公开(公告)号：JP2013175521A
公开(公告)日：2013-09-05
申请号：JP2012037922
申请日：2012-02-23
申请人： Toppan Printing Co Ltd , 凸版印刷株式会社 , Nec Toppan Circuit Solutions Inc , 株式会社トッパンNecサーキットソリューションズ
发明人： OZAWA TATSURO , KAMATA MITSUAKI , KATO KATSUMUNE , SHIMA TOSHIYUKI
IPC分类号： H05K1/02 , G09F3/02 , G09F7/16 , G09F13/20
摘要： PROBLEM TO BE SOLVED: To provide an identification tag for manufacturing a printed wiring board with high reliability in counterfeit prevention.SOLUTION: The identification tag is installed between layers of a printed wiring board or a printed circuit board and is used for confirming that it is an authentic article and includes a substrate having heat resistance and a printed layer including a fluorescent substance disposed on the substrate.
摘要翻译：要解决的问题：提供用于制造具有高可靠性的防伪印刷布线板的识别标签。解决方案：识别标签安装在印刷线路板或印刷电路板的层之间，并用于确认它是包括具有耐热性的基材和包含布置在基材上的荧光物质的印刷层。

7. 发明专利

JP2012169523A Manufacturing method of rigid flexible printed wiring board 审中-公开
标题翻译：刚性柔性布线板的制造方法
公开(公告)号：JP2012169523A
公开(公告)日：2012-09-06
申请号：JP2011030715
申请日：2011-02-16
申请人： Nec Toppan Circuit Solutions Inc , 株式会社トッパンNecサーキットソリューションズ
发明人： AMEMIYA HIROYASU , KATO KATSUMUNE , ISHIGURO KINYA , TATSUMII KIYOKAZU
IPC分类号： H05K3/46 , H05K3/00
摘要： PROBLEM TO BE SOLVED: To solve the problem that quality of a through-hole formed at a rigid part deteriorates.SOLUTION: A rigid flexible printed wiring board is manufactured by: a first step of forming a wiring pattern of a pad on both surfaces of a position of a through-hole scheduled to be formed to a flexible support film; a second step of bonding a cover lay film to both surfaces of the support film and forming a surface cover opening for which a part on the pad of the cover lay film is removed in a diameter larger than a diameter of the through-hole scheduled to be formed; a step of laminating an insulating resin layer on the partial region of the cover lay film, filling the surface cover opening with a resin of the insulating resin layer, and forming a rigid part where the wiring pattern is formed on the insulating resin layer; and a step of forming the through-hole scheduled to be formed at the rigid part.
摘要翻译：要解决的问题：为了解决刚性部件形成的通孔的质量恶化的问题。解决方案：通过以下步骤制造刚性柔性印刷线路板：第一步骤，在预定形成为柔性支撑膜的通孔的位置的两个表面上形成焊盘的布线图案; 将覆盖膜粘合到支撑膜的两个表面的第二步骤，并且形成表面覆盖开口，其中覆盖膜的焊盘上的部分的直径大于排列为形成; 在覆盖膜的部分区域上层叠绝缘树脂层的步骤，用绝缘树脂层的树脂填充表面盖开口，并且在绝缘树脂层上形成布线图案的刚性部分; 以及形成预定形成在刚性部分的通孔的步骤。版权所有（C）2012，JPO＆INPIT

8. 发明专利

JP2012069863A Wiring board and manufacturing method therefor 有权
标题翻译：接线板及其制造方法
公开(公告)号：JP2012069863A
公开(公告)日：2012-04-05
申请号：JP2010215256
申请日：2010-09-27
申请人： Nec Corp , Nec Toppan Circuit Solutions Inc , 日本電気株式会社 , 株式会社トッパンNecサーキットソリューションズ
发明人： KIKUCHI KATSU , YAMAMICHI SHINTARO , MURAI HIDEYA , MORI KENTARO , NAKAJIMA YOSHIKI , OSHIMA DAISUKE , AKIMOTO YUTAKA , ISHIOKA TAKU
IPC分类号： H05K3/46 , H01L23/12
CPC分类号： H01L2224/04105 , H01L2224/18 , H01L2224/24195 , H01L2224/73267 , H01L2224/92244 , H01L2924/19105 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To provide a thin wiring board excellent in rigidity, having an embedded electronic component.SOLUTION: The wiring board having the embedded electronic component includes: a base insulation layer; a pedestal pattern disposed on the upper face side of the base insulation layer; an electronic component on the pedestal pattern; a reinforcement insulation layer surrounding the outer circumference of the electronic component; a core wiring structure layer disposed on the reinforcement insulation layer and including a core insulation layer, having an opening having the electronic component disposed inside, upper face-side core wiring and lower face-side core wiring; an embedded insulation layer disposed on the core wiring structure layer in a manner to embed the electronic component; and first wiring on the substrate upper face side and second wiring on the substrate lower face side electrically connected to the electronic component. The outer edge of the pedestal is placed on the outer side than the outer edge of the electronic component. The reinforcement insulation layer includes a first reinforcement fiber, which is disposed from the peripheral area of the pedestal pattern outer than the outer edge to right above the outer edge of the pedestal pattern.
摘要翻译：要解决的问题：提供具有嵌入式电子部件的刚性优异的薄布线基板。解决方案：具有嵌入式电子部件的布线基板包括：基底绝缘层; 设置在所述基底绝缘层的上表面侧的基座图案; 基座图案上的电子部件; 围绕电子部件的外周的加强绝缘层; 芯线布线结构层，设置在所述加强绝缘层上并且包括芯绝缘层，具有设置在所述电子部件内部的开口，上表面侧芯线布线和下表面侧芯线布线; 嵌入绝缘层，以嵌入电子部件的方式设置在芯线布线结构层上; 并且在基板上表面侧的第一布线和与电子部件电连接的基板下表面侧的第二布线。基座的外边缘位于电子部件的外边缘的外侧。所述加强绝缘层包括第一加强纤维，所述第一加强纤维从所述基座图案的周边区域设置在所述基座图案的外边缘的外边缘的外侧。版权所有（C）2012，JPO＆INPIT

9. 发明专利

JP2009299084A Continuous carrying type plating apparatus 审中-公开
标题翻译：连续运行型镀膜设备
公开(公告)号：JP2009299084A
公开(公告)日：2009-12-24
申请号：JP2008151424
申请日：2008-06-10
申请人： Nec Toppan Circuit Solutions Inc , 株式会社トッパンNecサーキットソリューションズ
发明人： SASAKI TAKAHISA
IPC分类号： C25D17/08 , C25D17/00 , C25D17/06
摘要： PROBLEM TO BE SOLVED: To replace for a fresh clamp 4 by early finding the deterioration of clamp 4 fixed to the transfer belt 7 of a continuous carrying type plating apparatus.
SOLUTION: The deteriorated clamp is early replaced by the fresh one to keep the clamp excellent and to keep excellent plating quality by changing the shape of a contact area where a clamp contact point of the clamp fixed to a transportation belt and holding the printed wiring board is brought into contact with the printed wiring board is changed for every clamp to form a mark capable of identifying the clamp holding the printed wiring board and used for the plating on the contact part of the clamp contact point to identify the deteriorated clamp in the inspection of the plating quality of the printed wiring board.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：通过早期发现固定在连续运载型电镀设备的转印带7上的夹具4的劣化来更换新的夹具4。
解决方案：恶劣的夹具早期由新鲜的夹具代替，以保持夹具的优异性，并通过改变夹具的夹紧接触点固定在传送带上并保持其的接触区域的形状来保持优异的电镀质量印刷电路板与印刷电路板接触的每个夹具都被改变，以形成能够识别夹持印刷电路板并用于电镀在夹具接触点的接触部分上的夹具的标记，以识别恶化的夹具在检查印刷电路板的电镀质量。版权所有（C）2010，JPO＆INPIT

10. 发明专利

JP2009290056A Planting pin, and method for manufacturing of printed wiring board with pin 有权
标题翻译：用于制造具有针的印刷线路板的制造引脚和方法
公开(公告)号：JP2009290056A
公开(公告)日：2009-12-10
申请号：JP2008142244
申请日：2008-05-30
申请人： Nec Toppan Circuit Solutions Inc , 株式会社トッパンNecサーキットソリューションズ
发明人： ODA MASAHITO
IPC分类号： H01L23/12 , H01L23/50
CPC分类号： H01L2224/16225 , H01L2924/15174 , H01L2924/15312
摘要： PROBLEM TO BE SOLVED: To provide a structure where a nail head is solidly supported by a solder fillet while preventing solder from excessively dragging itself on to a rod-like part of a planting pin of a printed wiring board with a pin. SOLUTION: In this planting pin, a nail head 1b is formed at a chip of a rod-like part 1a. For the planting pin, a chp joint surface 1c of the nail head 1b of the planting pin is soldered to an external electrode pad 2 of a printed wiring board 100 with a pin. The planting pin with a resist coating 1e removable by a solvent or a flux cleaning liquid formed at least in the vicinity of the nail head 1b of the rod-like part 1a is planted on the printed wiring board 100. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种结构，其中钉头由焊接圆角牢固地支撑，同时防止焊料自身过度地拖到具有销的印刷线路板的种植针的棒状部分上。解决方案：在该种植销中，在杆状部分1a的芯片处形成钉头1b。对于种植针，将种植针的钉头1b的chp接合面1c焊接到具有针的印刷线路板100的外部电极焊盘2。至少在棒状部1a的钉头1b附近形成的溶剂或助焊剂清洗液可除去具有抗蚀剂涂层1e的种植针。印刷线路板100（ C）2010，JPO＆INPIT

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