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1. 发明专利

CA2042102A1 MDI FAULT DETECTION CIRCUIT WITH DUAL MODE FAULT DETECTION 未知
公开(公告)号：CA2042102A1
公开(公告)日：1992-05-17
申请号：CA2042102
申请日：1991-05-08
申请人： DELCO ELECTRONICS CORPORATION
发明人： KELLEY, GERARD F. , HACH, LARRY R. , TALLANT, JAMES C., II
IPC分类号： H02H7/08 , H02P7/00
摘要： A motor driver interface (MDI) circuit for an H-bridge electric motor drive apparatus is responsive to an enable signal to turn off all switching transistors in a not enabled mode and turn on the upper bridge transistors in an enabled mode and includes large resistors, sufficiently large to prevent motor activation therethrough, from the motor terminals to the power supply terminals to establish a bias voltage in the not enabled mode. Fault detection apparatus compares the voltages at the motor terminals with a first reference voltage apparatus in the not enabled mode and a second reference voltage apparatus in the enabled mode in response to the enable signal.

2. 发明专利

CA2000166A1 VEHICLE DIPLEX DOPPLER NEAR-OBSTACLE DETECTION SYSTEM 未知
公开(公告)号：CA2000166A1
公开(公告)日：1990-05-01
申请号：CA2000166
申请日：1989-10-05
申请人： DELCO ELECTRONICS CORPORATION
发明人： MAY, PHILLIP A.
IPC分类号： G01S13/32 , G01S13/34 , G01S13/56 , G01S13/60 , G01S13/93

3. 发明专利

AU632721B2 REMOTE ACCESSING SYSTEM 未知
公开(公告)号：AU632721B2
公开(公告)日：1993-01-07
申请号：AU8966491
申请日：1991-12-13
申请人： DELCO ELECTRONICS CORPORATION
发明人： RUSSELL WILBUR POGUE JR , RONALD L. RIVEST
IPC分类号： B60R25/10 , B60R25/00 , E05B49/00 , E05B65/20 , G06F1/00 , G06F21/00 , G07C9/00 , G08C19/00 , H04L9/08 , H04L9/32 , H04Q9/00
摘要： Access to a vehicle by a remote electronic key (14) via a radio link is secured by an exchange of encrypted signals. A remote unit (14) having a secret number (S) is introduced to a base unit (12) and a common key (P) is agreed upon by an exponential key exchange. The common key (P) is encrypted using the secret number (S) and stored in the base unit (12). Thereafter, the base unit (12) is able to authenticate the identity of the remote unit (14) by sending the encrypted common key (Q) and a random number (R) to the remote unit (14) which decrypts the key (Q) and uses it to encrypt the random number (R). The random number (R) is also encrypted in the base unit (12) and compared with the encrypted random number (X) from the remote unit (14).

4. 发明专利

CA2042344A1 MDI FAULT DETECTION APPARATUS USING INITIAL TURN-ON AND NOISE TIMERS 未知
公开(公告)号：CA2042344A1
公开(公告)日：1992-05-17
申请号：CA2042344
申请日：1991-05-10
申请人： DELCO ELECTRONICS CORPORATION
发明人： HACH, LARRY R. , KELLEY, GERARD F.
IPC分类号： G01R31/02 , G01R31/40 , H02H1/04 , H02H7/08
摘要： A motor driver interface (MDI) circuit includes fault detection apparatus effective to detect short circuits to the power supply in the switching transistors of an H-bridge reversible DC motor arrangement. A pair of timers distinguishes a true fault condition. The first timer is responsive to a continuous fault detection to define a first time period from its initiation; and a second timer is responsive to a continuous presence of a transistor conduction signal to define a second time period from its initiation. The apparatus stores a fault signal in response to the detection of the fault condition at the end of the first or second time periods with the first timer providing fault detection upon turn-on after the brief initial high transistor turn-on current and the second timer providing noise immunity.

5. 发明专利

CA2039808A1 ABS YAW CONTROL 未知
公开(公告)号：CA2039808A1
公开(公告)日：1991-12-20
申请号：CA2039808
申请日：1991-04-04
申请人： DELCO ELECTRONICS CORPORATION , GENERAL MOTORS CORPORATION
发明人： HEADLEY, PHILIP M. , KULKARNI, PRAKASH K.
IPC分类号： B60T8/172 , B60T8/1755 , B60T8/1764
摘要： In a vehicle anti-lock brake control system, a differential slip between the wheels on each side of an axle is sensed to detect a yaw condition and the wheel with the lower slip value is identified as the high coefficient wheel. In response to a detected yaw condition, the monitored value of slip of the high coefficient wheel is controlled about a target slip value that has an initial value less than the critical slip value at the beginning of antilock controlled braking to minimize longitudinal force imbalance and which is thereafter ramped to the critical slip value to maximize longitudinal braking forces.

6. 发明授权

EP0744785B1 Vehicle window antenna 失效
标题翻译：车窗天线
公开(公告)号：EP0744785B1
公开(公告)日：2001-10-17
申请号：EP96201191.2
申请日：1996-04-29
申请人： DELCO ELECTRONICS CORPORATION , GENERAL MOTORS CORPORATION
发明人： Nagy, Louis Leonard , Martin, Douglas Courtney , Bellinger, Mark
IPC分类号： H01Q1/12
CPC分类号： B32B17/10293 , B32B17/10036 , B32B17/10174 , H01Q1/1271 , H01Q13/16

7. 发明授权

EP0729010B1 Apparatus for compensation of micromachined sensors 失效
标题翻译：用于微机械传感器补偿装置
公开(公告)号：EP0729010B1
公开(公告)日：2000-07-26
申请号：EP96200083.2
申请日：1996-01-15
申请人： DELCO ELECTRONICS CORPORATION
发明人： Johnson, Jack Daniel , Liem, Fie AN
IPC分类号： G01C19/56
CPC分类号： G01C19/5684

8. 发明公开

EP0918355A2 Solder bump input/output pad for a surface mount circuit device 审中-公开
标题翻译：焊料凸块的输入/输出表面，用于表面安装的电路装置
公开(公告)号：EP0918355A2
公开(公告)日：1999-05-26
申请号：EP98203298.9
申请日：1998-09-29
申请人： DELCO ELECTRONICS CORPORATION
发明人： Cornell, Ralph Edward , Erickson, Curtis A. , Vaidyanthan, Aparna
IPC分类号： H01L23/485
CPC分类号： H01L24/10 , H01L24/13 , H01L2224/05124 , H01L2224/05155 , H01L2224/05644 , H01L2224/05647 , H01L2224/13 , H01L2224/13099 , H01L2924/01004 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/15787 , H05K3/3436 , H05K2201/09381 , H05K2201/097 , H05K2203/0465 , Y02P70/613 , H01L2924/00 , H01L2924/00014 , H01L2924/013
摘要： A surface mount circuit device (110), such as a flip chip, of the type which is attached to a conductor pattern (126) with solder bump connections (120). The solder bump connections (120) are formed by reflowing solder on shaped input/output pads (112) on the device (110), with the shape of the pads (112) being tailored to favorably affect optimal distribution, shape and height of the solder bump connections (120) following reflow soldering of the device (110) to the conductor pattern (126). The solder bump connections (120) are preferably characterized by a shape that increases the stand-off height of the device (110). The shaped solder bump connections (120) also promote stress relief during thermal cycling, improve mechanical bonding, allow better penetration of cleaning solutions, and improve flow of encapsulation materials between the device (110) and its substrate (122).

9. 发明公开

EP0911623A2 High pressure sensor and method of forming 审中-公开
标题翻译：高压传感器和成形方法
公开(公告)号：EP0911623A2
公开(公告)日：1999-04-28
申请号：EP98203191.6
申请日：1998-09-23
申请人： DELCO ELECTRONICS CORPORATION
发明人： Ratell, Joseph Martin , Hart, John Marcus, Jr.
IPC分类号： G01L9/06
CPC分类号： G01L9/0055 , Y10T29/49007 , Y10T29/49103
摘要： A media-compatible, high-pressure transducer cell (12), a rugged sensor assembly (10) incorporating the cell (12), and a method for its production. The pressure cell (12) generally includes a metal body having a diaphragm (26), at least one dielectric layer (28, 38) on the diaphragm (26), and at least one thick-film piezoresistive element (34) on the dielectric layer (28, 38) for sensing deflection of the diaphragm (26). For purposes of compatibility with a wide variety of media, the metal body is preferably formed of steel, most preferably a stainless steel alloy such as an AISI Type 300 or 400 Series. The diaphragm (26) can be formed by etching or machining the metal body. The dielectric layers (28, 38) are preferably formed by thick-film processing as done for the piezoresistive element (34), employing materials that will adhere to the metal diaphragm (26), withstand the strains induced as the diaphragm (26) deflects, and faithfully transmit such strains to the thick-film piezoresistor (34).
摘要翻译：介质兼容的高压传感器单元（12），结合有单元（12）的坚固的传感器组件（10）以及用于其生产的方法。压力室（12）通常包括具有膜片（26），膜片（26）上的至少一个电介质层（28,38）和电介质上的至少一个厚膜压阻元件（34）的金属主体（28,38），用于感测隔膜（26）的偏转。为了与各种介质兼容，金属体优选由钢制成，最优选不锈钢合金，例如AISI型300或400系列。隔膜（26）可以通过蚀刻或加工金属体来形成。电介质层（28,38）优选通过厚膜处理形成，如对于压阻元件（34）所做的那样，使用将粘附到金属隔膜（26）的材料，承受隔膜（26）弯曲时引起的应变并忠实地将这些应变传递到厚膜压敏电阻器（34）。

10. 发明公开

EP0909117A2 Method of making thick film circuits 有权
标题翻译： Verfahren zur Herstellung von Dickfilmschaltungen
公开(公告)号：EP0909117A2
公开(公告)日：1999-04-14
申请号：EP98203059.5
申请日：1998-09-14
申请人： DELCO ELECTRONICS CORPORATION
发明人： Walsh, James Edward , Isenberg, John Karl , Lautzenhiser, Frans Peter
IPC分类号： H05K1/02 , H05K3/12
CPC分类号： H05K1/0268 , H05K3/12 , H05K2201/09781 , H05K2203/166 , Y10T428/23986
摘要： An improved method of making a multiple print thick film circuit wherein the alignment between successive conductor print steps is both optically inspectable and electrically testable. The first of two or more successive conductor prints includes a pair of adjacent alignment features (10, 12), and the successive conductor prints include identical alignment features which are printed in registry with the alignment features of the first conductor print. The alignment features are defined by a pair of contiguous mutually perpendicular conductor segments or surfaces resembling a box or an upper case L. With proper print alignment, there is a non-conductive gap between adjacent alignment features, and test probes (44, 46) brought into contact with the features or associated probe pads will reveal a high or open-circuit impedance therebetween. However, if the second conductor print is misaligned relative to the first print, one or more of its alignment feature segments or surfaces will bridge the gap between the first pair of alignment features, and test probes brought into contact with the features or associated probe pads (50) will reveal a low or short-circuit impedance therebetween. The spacing between adjacent alignment features is less than the smallest conductor spacing on the circuit. Because the gap between alignment features is smaller than the circuit spacing, the test equipment can detect alignment errors large enough to short-circuit the adjacent alignment features, but not so large as to cause shorting in the actual circuit. Alignment features may be formed at multiple locations throughout the substrate to detect localized misalignment, and adjacent alignment features may span individual circuits formed on the same substrate (60).
摘要翻译：一种制造多重印刷厚膜电路的改进方法，其中连续导体印刷步骤之间的对准既可光学检查，也可电学测试。两个或更多个连续的导体印刷中的第一个包括一对相邻的对准特征（10,12），并且连续的导体印刷品包括与第一导体印刷的对准特征对准印刷的相同的对准特征。对准特征由一对连续相互垂直的导体段或类似于盒子或大壳体L的表面限定。通过适当的打印对准，在相邻对准特征之间存在非导电间隙，并且测试探针（44,46）与特征或相关联的探针焊盘接触将在其间显示高的或开路的阻抗。然而，如果第二导体印刷物相对于第一印刷件不对准，则其对准特征部分或表面中的一个或多个将桥接第一对对准特征之间的间隙，并且与特征或相关联的探针垫接触的测试探针（50）将显示它们之间的低或短路阻抗。相邻对准特征之间的间距小于电路上最小的导体间距。由于对准特征之间的间隙小于电路间距，所以测试设备可以检测到足够大的对准误差，以使相邻对准特征短路，但不会大于实际电路中的短路。对准特征可以形成在整个基底上的多个位置处以检测局部的未对准，并且相邻的对准特征可以跨越形成在同一基底（60）上的单个电路。

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