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1. 发明专利

JP6400318B2 チップ部品及びその製造方法有权
公开(公告)号：JP6400318B2
公开(公告)日：2018-10-03
申请号：JP2014070630
申请日：2014-03-28
申请人：株式会社谷黒組
发明人：渡邊源蔵
IPC分类号： H01G13/00 , H01F41/10 , H01C1/144 , B23K1/20 , B23K1/00 , H01G4/30

2. 发明专利

JPWO2014020751A1 電極溶食防止層を有する部品及びその製造方法有权
标题翻译：部件及其制造方法电极防腐蚀层
公开(公告)号：JPWO2014020751A1
公开(公告)日：2016-07-11
申请号：JP2012535480
申请日：2012-08-02
申请人：株式会社谷黒組
发明人：克守谷黒 , 克守谷黒 , 渡邊　源蔵 , 源蔵渡邊
IPC分类号： H05K3/24 , B23K1/00 , B23K1/20 , H01L21/60 , H01L23/12
CPC分类号： B23K1/203 , B23K1/0016 , B23K1/008 , B23K1/20 , B23K3/0669 , B23K3/082 , B23K2201/38 , H01L2224/11 , H05K3/24 , H05K3/3468 , H05K3/3489 , H05K2203/044 , H05K2203/0746 , H05K2203/122
摘要：【課題】低コストで、歩留まりが高く、信頼性の高いはんだ付けを行うことができる部品の製造方法を提供する。【解決手段】電極2を有する部品10’を準備する工程と、電極2に第1の有機脂肪酸含有溶液3aを接触させる工程と、電極2に第1の溶融はんだ5aを接触させて電極2上に第1の溶融はんだ5aを付着させる工程と、付着した第1の溶融はんだ5aに向けて、気流又は液流を噴射して電極2上に付着した余剰の第1の溶融はんだ5aを除去する工程と、余剰の第1の溶融はんだ5aが除去された電極2を第1の溶融はんだ5aの融点未満に下げる工程とを備えている。第1の溶融はんだ5aが、電極2に含まれる成分に化合して電極2の表面に金属間化合物層からなる電極溶食防止層4を形成する成分を含み、電極2への第1の溶融はんだ5aの接触を、部品10’を移動させながら電極2に第1の溶融はんだ5aの液流を衝突させ又は回り込ませて行うようにする。【選択図】図1
摘要翻译：低成本，高产量，一种用于制造能够进行高可靠的可焊的部件的方法。制备A组分10与电极2”，在电极2上的第一有机脂肪酸含酸溶液3A接触的步骤，第一熔融焊料5a上的电极2上的接触由电极2 粘附的第一熔融焊料5a到，朝向第一熔融焊料附着5A，通过喷出的气流或液流中除去过量沉积在电极2上的第一熔融焊料5a中的步骤，并且降低其中第一熔融焊料5a中过量已被删除到第一熔融焊料5a的熔点以下的电极2的工序。第一熔融焊料5a中包括组件，用于在电极2的表面上包括在电极2部件形成具有化合物制成的金属间化合物层的电极的防腐蚀层4，第一熔到电极2 焊料5a的接触时，电极2，而移动部件10“是第一与熔融焊料5a的液体流碰撞或包裹具有履行。点域1

3. 发明专利

JP2014033172A Component with electrode corrosion preventive layer, and method of manufacturing the same 有权
标题翻译：具有电极腐蚀防止层的部件及其制造方法
公开(公告)号：JP2014033172A
公开(公告)日：2014-02-20
申请号：JP2012242297
申请日：2012-11-02
申请人： Tanigurogumi:Kk , 株式会社谷黒組
发明人： TANIGURO KATSUMORI , WATANABE GENZO
IPC分类号： H05K3/34 , B23K1/00 , B23K1/20 , B23K101/42
摘要： PROBLEM TO BE SOLVED: To provide a method of manufacturing a component that achieves high-reliability soldering at low cost in high yield.SOLUTION: A method of manufacturing a component includes the steps of: preparing a component 10' with an electrode 2; bringing a first organic fatty acid-containing solution 3a into contact with the electrode 2; bringing first fused solder 5a into contact with the electrode 2 so as to stick the first fused solder 5a on the electrode 2; jetting an air current or liquid flow toward the stuck first fused solder 5a to remove excessive first fused solder 5a stuck on the electrode 2; and lowering the temperature of the electrode 2 from which the excessive first fused solder 5a is removed below the fusion point of the first fused solder 5a. The first fused solder 5a includes a component which is chemically combined with a component included in the electrode 2 so as to form an electrode corrosion preventive layer 4 of an inter-metal compound layer on a surface of the electrode 2, and the first fused solder 5a is brought into contact with the electrode 2 while the component 10' is moved to cause the liquid flow of the first fused solder 5a to collide against the electrode 2 or to flow around.
摘要翻译：要解决的问题：提供以高成本低成本实现高可靠性焊接的部件的制造方法。解决方案：制造部件的方法包括以下步骤：用电极2制备部件10'; 使第一含有机脂肪酸的溶液3a与电极2接触; 使第一熔融焊料5a与电极2接触，以将第一熔融焊料5a粘附在电极2上; 向被粘附的第一熔融焊料5a喷射气流或液流，以去除粘附在电极2上的过量的第一熔融焊料5a; 并且降低在第一熔融焊料5a的熔点之下除去过量的第一熔融焊料5a的电极2的温度。第一熔敷焊料5a包括与电极2中包含的部件化学组合的部件，以在电极2的表面上形成金属间化合物层的电极防腐蚀层4，并且第一熔融焊料 5a与电极2接触，同时元件10'移动以使第一熔融焊料5a的液体流动与电极2碰撞或流动。

4. 发明专利

JP5191616B1 Production method of forming method and the mounting board of the solder bump 有权
公开(公告)号：JP5191616B1
公开(公告)日：2013-05-08
申请号：JP2012518680
申请日：2012-04-17
申请人：株式会社谷黒組
发明人：克守谷黒
IPC分类号： H01L21/60
CPC分类号： B23K37/06 , H01L21/4853 , H01L23/49811 , H01L24/05 , H01L24/11 , H01L24/13 , H01L2224/0401 , H01L2224/05026 , H01L2224/05147 , H01L2224/05571 , H01L2224/05647 , H01L2224/11312 , H01L2224/11472 , H01L2224/1181 , H01L2224/11821 , H01L2224/11849 , H01L2224/131 , H01L2224/13111 , H01L2224/13113 , H01L2224/13118 , H01L2224/1312 , H01L2224/13139 , H01L2224/13155 , H01L2224/16503 , H01L2224/94 , H01L2924/00014 , H05K3/282 , H05K3/3468 , H05K13/0465 , H05K2203/0557 , H05K2203/0746 , H05K2203/1344 , H01L2924/00012 , H01L2924/01028 , H01L2924/0105 , H01L2924/01047 , H01L2924/01029 , H01L2924/014 , H01L2924/0132 , H01L2224/11 , H01L2224/05552
摘要： [Problem] To provide a solder bump forming method capable of forming solder bumps having a desired constant thickness, without any failure such as copper corrosion, on a mounting board such as a printed circuit board having fine copper electrodes. [Solution] The solder bump forming method includes: a process in which a prepared mask (5) is placed on a prepared substrate (1) and then a molten solder jet is blown to fill an opening of the mask (5) with molten solder (11a) until the molten solder (11a) exceeds the thickness of the mask (5); a process of removing a part of the molten solder (11a) that exceeds the thickness of the mask (5) to form a solder bump (11) having a predetermined thickness; and a process of removing the mask (5). The molten solder (11a) is molten lead-free solder that includes tin as a main ingredient and at least nickel as a sub ingredient, and further includes one or more other ingredients such as silver, copper, and germanium. The part of the molten solder (11a) that exceeds the thickness of the mask (5) is removed by using a blade or an air cutter or by spraying a solution (18) that includes organic fatty acid having 12 to 20 carbon atoms.

5. 发明专利

JP6267427B2 はんだ付け方法及び実装基板有权
公开(公告)号：JP6267427B2
公开(公告)日：2018-01-24
申请号：JP2013014864
申请日：2013-01-29
申请人：株式会社谷黒組
发明人：谷黒克守 , 渡邊源蔵
IPC分类号： B23K1/00 , B23K1/20 , B23K101/42 , B23K103/12 , H05K3/34

6. 发明专利

JP6150881B2 はんだ付け装置及びはんだ付け方法有权
公开(公告)号：JP6150881B2
公开(公告)日：2017-06-21
申请号：JP2015506866
申请日：2014-03-20
申请人：株式会社谷黒組
发明人：谷黒克守 , 渡邊源蔵
IPC分类号： H01L23/12 , B23K1/00 , B23K1/20 , B23K3/06 , H05K3/34
CPC分类号： H05K3/34 , B23K1/0016 , B23K1/018 , B23K1/08 , B23K1/203 , B23K1/206 , B23K3/0607 , B23K3/082 , B23K3/087 , B23K31/02 , B23K37/04 , H05K3/26 , H05K3/3463 , H05K3/3468 , H05K3/3489 , B23K2201/40 , B23K2201/42 , B23K35/262 , H05K2203/04 , H05K2203/0445 , H05K2203/075 , H05K2203/0783 , H05K2203/1509 , H05K2203/1518 , H05K2203/1572 , H05K2203/159

7. 发明专利

JP6076698B2 電極溶食防止層を有する部品有权
标题翻译：具有电极的防腐蚀层成分
公开(公告)号：JP6076698B2
公开(公告)日：2017-02-08
申请号：JP2012242297
申请日：2012-11-02
申请人：株式会社谷黒組
发明人：谷黒克守 , 渡邊源蔵
IPC分类号： B23K1/20 , H05K3/34

8. 发明专利

JP5079169B1 Soldering apparatus and method, as well as manufactured boards and electronic parts 有权
公开(公告)号：JP5079169B1
公开(公告)日：2012-11-21
申请号：JP2012518678
申请日：2012-04-14
申请人：株式会社谷黒組
发明人：克守谷黒
IPC分类号： B23K1/018
CPC分类号： B23K3/0607 , B23K1/0016 , B23K1/20 , B23K1/206 , B23K3/0692 , H01L2924/14 , H05K1/0296 , H01L2924/00
摘要： Provided are a soldering device and a soldering method which allow for soldering at low cost with high yield and high reliability. The soldering device has: first organic fatty acid-containing solution bath 21 in which workpiece member 10 having a copper electrode is immersed in organic fatty acid-containing solution 31a; space section 24 having a steam atmosphere of organic fatty acid-containing solution 31b, the space section horizontally having ejection unit 33 to spray a jet stream of a molten solder to the copper electrode provided on workpiece member 10 and ejection unit 34 to spray a liquid to an excess of the molten solder for removal; and second organic fatty acid-containing solution bath 23 in which workpiece member 10 from which the excess of the molten solder is removed in space section 24 is immersed again in organic fatty acid-containing solution 31c.

9. 发明专利

JPWO2013157064A1 はんだ付け装置及び方法並びに製造された基板及び電子部品有权
标题翻译：焊接装置和方法，以及制造板和电子元件
公开(公告)号：JPWO2013157064A1
公开(公告)日：2015-12-21
申请号：JP2012518679
申请日：2012-04-16
申请人：株式会社谷黒組
发明人：克守谷黒 , 克守谷黒
IPC分类号： H05K3/26 , B23K1/00 , B23K1/20 , B23K3/06 , H01L21/60 , H05K3/34
CPC分类号： B23K3/0607 , B23K1/0016 , B23K1/08 , B23K1/20 , B23K1/203 , B23K3/0646 , B23K3/0669 , B23K3/082 , B23K35/262 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/741 , H01L24/742 , H01L2224/03312 , H01L2224/03418 , H01L2224/036 , H01L2224/0381 , H01L2224/03821 , H01L2224/0401 , H01L2224/05073 , H01L2224/05082 , H01L2224/05111 , H01L2224/05147 , H01L2224/05582 , H01L2224/05611 , H01L2224/05647 , H01L2224/0569 , H01L2224/11312 , H01L2224/116 , H01L2224/11821 , H01L2224/13111 , H01L2224/1369 , H01L2224/741 , H01L2924/381 , H05K3/0085 , H05K3/282 , H05K3/3468 , H05K2203/081 , H05K2203/122 , H05K2203/1366 , H05K2203/1518 , Y10T428/31678 , H01L2224/1141 , H01L2924/00012 , H01L2924/00014 , H01L2924/01028 , H01L2924/01047 , H01L2924/01029 , H01L2924/01032 , H01L2924/01083 , H01L2924/0103 , H01L2924/01051 , H01L2224/03
摘要：【課題】低コストで、歩留まりが高く、信頼性の高いはんだ付けを行うことができるはんだ付け装置及び方法を提供する。【解決手段】銅電極2を有する被処理部材10を有機脂肪酸含有溶液31に浸漬し、浸漬した被処理部材10を有機脂肪酸含有溶液31中で水平移動する第1処理部と、処理した被処理部材10を上方向の蒸気雰囲気の空間部24に引き上げながら、被処理部材10に向けて溶融はんだ5aの噴流5’を吹き付ける噴射手段33を備えた第2処理部と、処理した被処理部材10を空間部24中で水平移動した後に有機脂肪酸含有溶31液中に降下させながら、被処理部材10上の余剰の溶融はんだ5aに有機脂肪酸含有溶液31を吹き付けて除去する噴射手段34を備えた第3処理部と、処理した被処理部材10を有機脂肪酸含有溶液31中で水平移動した後に上方向に引き上げて溶液外に取り出す第4処理部とを備えるはんだ付け装置により上記課題を解決した。【選択図】図1
摘要翻译：低成本，高成品率，提供一种软钎焊装置和能够执行高可靠性的焊接的方法。该构件具有铜电极2浸渍在有机脂肪酸被处理10含酸溶液31，为对浸入工件构件10在有机脂肪酸水平移动含酸溶液31，处理后的被处理的第一处理单元而构件10上在空间部24中的蒸气氛围的向上方向向上拉，和具有喷射的第二处理部分装置33，用于朝向所述构件喷雾射流5“的熔融焊料5a的待处理10，处理后的工件构件10 的同时降低有机脂肪酸在该空间24的水平移动，设置有在注射后31溶剂溶液含有酸的装置34用于通过在该构件上吹在过量的熔融焊料5a中的有机含脂肪酸的溶液31中除去待处理10 第三处理单元，已经解决了通过焊接设备和第四处理部，其通过拉动向上在有机含脂肪酸的溶液31水平移动后处理的工件部件10取出解掉上述问题。点域1

10. 发明专利

JP5079170B1 Soldering apparatus and method, as well as manufactured boards and electronic parts 有权
公开(公告)号：JP5079170B1
公开(公告)日：2012-11-21
申请号：JP2012518679
申请日：2012-04-16
申请人：株式会社谷黒組
发明人：克守谷黒
IPC分类号： H05K3/26 , B23K1/00 , B23K1/20 , B23K3/06 , B23K101/42 , B23K103/12 , H01L21/60 , H05K3/34
CPC分类号： B23K3/0607 , B23K1/0016 , B23K1/08 , B23K1/20 , B23K1/203 , B23K3/0646 , B23K3/0669 , B23K3/082 , B23K35/262 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/741 , H01L24/742 , H01L2224/03312 , H01L2224/03418 , H01L2224/036 , H01L2224/0381 , H01L2224/03821 , H01L2224/0401 , H01L2224/05073 , H01L2224/05082 , H01L2224/05111 , H01L2224/05147 , H01L2224/05582 , H01L2224/05611 , H01L2224/05647 , H01L2224/0569 , H01L2224/11312 , H01L2224/116 , H01L2224/11821 , H01L2224/13111 , H01L2224/1369 , H01L2224/741 , H01L2924/381 , H05K3/0085 , H05K3/282 , H05K3/3468 , H05K2203/081 , H05K2203/122 , H05K2203/1366 , H05K2203/1518 , Y10T428/31678 , H01L2224/1141 , H01L2924/00012 , H01L2924/00014 , H01L2924/01028 , H01L2924/01047 , H01L2924/01029 , H01L2924/01032 , H01L2924/01083 , H01L2924/0103 , H01L2924/01051 , H01L2224/03
摘要： Low-cost, high-yield, and highly reliable soldering is performed by a soldering device provided with: a first treatment unit for immersing a member to be treated (10) having a copper electrode (2) in an organic fatty acid-containing solution (31) and horizontally moving the immersed member to be treated (10) in the organic fatty acid-containing solution (31); a second treatment unit provided with a jetting means (33) for, while the treated member to be treated (10) is being pulled up to a space portion (24) of an upward vapor atmosphere, spraying a jet (5') of molten solder (5a) toward the member to be treated (10); a third treatment unit provided with a jetting means (34) for, while the treated member to be treated (10) is being lowered into the organic fatty acid-containing solution (31) after being horizontally moved in the space portion (24), spraying the organic fatty acid-containing solution (31) on excess molten solder (5a) on the member to be treated (10) to remove the excess molten solder; and a fourth treatment unit for pulling the treated member to be treated (10) upward after being horizontally moved in the organic fatty acid-containing solution (31), and taking the treated member to be treated out of the solution.

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