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81. 发明公开

EP3038173A1 LIGHT EMITTING DEVICE AND LIGHTING SYSTEM 有权转让
标题翻译：发光装置和照明系统
公开(公告)号：EP3038173A1
公开(公告)日：2016-06-29
申请号：EP15199381.3
申请日：2015-12-10
申请人： LG Innotek Co., Ltd.
发明人： KIM, Baek Jun , KODAIRA, Hiroshi , KANG, Ki Man , KIM, Ha Na , SONG, Hyun Don , LEE, Jung Woo , OH, Jung Hun
IPC分类号： H01L33/58
CPC分类号： H01L33/486 , H01L33/58 , H01L33/62 , H01L2224/48091 , H01L2224/73265 , H01L2924/16195 , H01L2924/16315 , H01L2933/0058 , H01L2924/00014
摘要： A light emitting device is disclosed. The light emitting device comprises:
a body having a cavity and a stepped structure around the cavity;
a plurality of electrodes in the cavity;
a light emitting chip in the cavity;
a transparent window having an outer portion provided on the stepped structure to cover the cavity; and
an adhesive member between the transparent window and the body.
The adhesive member comprises a first adhesive member between an outer bottom surface of the transparent window and a bottom of the stepped structure and a second adhesive member between the outer portion of the transparent window and the body.
摘要翻译：公开了一种发光器件。该发光装置包括：具有空腔和围绕该空腔的台阶结构的主体; 在腔中的多个电极; 在空腔中的发光芯片; 透明窗口，其具有设置在所述台阶结构上以覆盖所述腔体的外部; 以及透明窗和主体之间的粘合构件。粘合构件包括在透明窗的外底部表面和阶梯结构的底部之间的第一粘合构件以及在透明窗的外部与本体之间的第二粘合构件。

82. 发明公开

EP3001466A1 LIGHT-EMITTING MODULE 有权转让
标题翻译：发光模块
公开(公告)号：EP3001466A1
公开(公告)日：2016-03-30
申请号：EP14801082.0
申请日：2014-05-12
申请人： LG Innotek Co., Ltd.
发明人： KIM, Ha Na , KIM, Byung Mok
IPC分类号： H01L33/48
CPC分类号： H01L33/486 , H01L33/502 , H01L33/58 , H01L2924/16195 , H01L2924/16315
摘要： An embodiment relates to a light emitting module. A light emitting module according to an embodiment comprises: a light source unit comprising a light emitting device; a body comprising a lower portion on which the light source unit is arranged, a wall portion arranged on the lower portion and configured to surround the light source unit, and an upper portion arranged on the wall portion; an optical member arranged on the light source unit to transmit light from the light emitting device; and an adhesive member arranged between the wall portion of the body and the optical member to couple the body and the optical member, wherein the upper portion of the body is arranged between the light emitting device and the adhesive member.
摘要翻译：一个实施例涉及一种发光模块。根据实施例的发光模块包括：光源单元，其包括发光器件; 主体，所述主体包括其上布置有所述光源单元的下部，布置在所述下部上并且被配置为围绕所述光源单元的壁部以及布置在所述壁部上的上部; 布置在所述光源单元上以传输来自所述发光器件的光的光学构件; 以及布置在主体的壁部分和光学构件之间以将主体和光学构件耦合的粘合构件，其中主体的上部布置在发光器件和粘合构件之间。

83. 发明公开

EP2980842A1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE 有权
标题翻译： HERSBLEITERBAUEMENT UND HERSTELLUNGSVERFAHREN DES HALBLEITERS
公开(公告)号：EP2980842A1
公开(公告)日：2016-02-03
申请号：EP15178991.4
申请日：2015-07-30
申请人： Socionext Inc.
发明人： Urago, Kazuyuki , Shimizu, Nobutaka
IPC分类号： H01L23/04 , H01L23/552
CPC分类号： H01L23/053 , H01L21/52 , H01L23/04 , H01L23/10 , H01L23/49838 , H01L23/49894 , H01L23/552 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/83 , H01L24/92 , H01L2224/131 , H01L2224/16225 , H01L2224/2919 , H01L2224/32225 , H01L2224/32245 , H01L2224/73204 , H01L2224/73253 , H01L2224/83191 , H01L2224/92125 , H01L2924/15311 , H01L2924/15787 , H01L2924/1579 , H01L2924/16153 , H01L2924/16235 , H01L2924/16251 , H01L2924/1631 , H01L2924/16315 , H01L2924/1659 , H01L2924/16724 , H01L2924/16747 , H01L2924/19041 , H01L2924/19042 , H01L2924/19105 , H01L2924/3511 , H01L2924/014 , H01L2924/00
摘要： A semiconductor device includes: a substrate; a semiconductor element disposed on the substrate; a plurality of electrodes disposed on the substrate separately from one another and arranged so as to surround the semiconductor element in a plan view; a lid that cover the semiconductor element, the lid including an inner portion and a periphery portion that is outer than the inner portion in a plan view, the lid including a plurality of first protruding members that is provided separately from one another, the first protruding members being disposed in the inner portion; and conductive members disposed between the plurality of electrodes and the plurality of protruding members disposed in positions opposed to the plurality of electrodes respectively, the conductive members being joined to the plurality of electrodes and the plurality of protruding members respectively.
摘要翻译：半导体器件包括：衬底; 设置在所述基板上的半导体元件; 多个电极，彼此分离设置在基板上，并且以平面图包围半导体元件; 覆盖所述半导体元件的盖，所述盖在平面图中包括内部部分和外部部分，所述外部部分在所述内部部分的外侧，所述盖子包括彼此分开设置的多个第一突出部件，所述第一突出部构件设置在内部; 以及设置在所述多个电极之间的导电构件和分别设置在与所述多个电极相对的位置的所述多个突出构件，所述导电构件分别与所述多个电极和所述多个突出构件接合。

84. 发明授权

EP2448377B1 MULTI-PATTERN WIRING SUBSTRATE AND ELECTRONIC DEVICE 有权
标题翻译：多个结构化布线基板和电子设备
公开(公告)号：EP2448377B1
公开(公告)日：2015-11-25
申请号：EP10792138.9
申请日：2010-06-23
申请人： Kyocera Corporation
发明人： NAKASHIMA,Shuzou
IPC分类号： H05K1/02 , H01L23/02 , H01L23/13 , H05K3/00
CPC分类号： H05K3/0052 , H01L23/055 , H01L23/13 , H01L23/3121 , H01L24/97 , H01L2224/16225 , H01L2224/48227 , H01L2224/97 , H01L2924/09701 , H01L2924/12042 , H01L2924/14 , H01L2924/15159 , H01L2924/1531 , H01L2924/16152 , H01L2924/16251 , H01L2924/16315 , H01L2924/19041 , H01L2924/19043 , H01L2924/19103 , H01L2924/3025 , H01L2924/351 , H05K2201/09036 , H05K2201/0909 , H05K2201/10371 , H05K2203/0195 , H05K2203/0228 , H01L2224/81 , H01L2224/85 , H01L2924/00

85. 发明公开

EP1627419A4 PACKAGE FOR INTEGRATED CIRCUIT DIE 审中-公开
标题翻译：进行封装集成电路芯片
公开(公告)号：EP1627419A4
公开(公告)日：2011-02-23
申请号：EP04706475
申请日：2004-01-29
申请人： INTERPLEX QLP INC
发明人： ZIMMERMAN MICHAEL
IPC分类号： H01L23/08 , H01L23/047 , H01L23/10 , H01L23/492 , H01L23/498
CPC分类号： H01L21/50 , H01L23/047 , H01L23/10 , H01L23/492 , H01L23/49861 , H01L23/562 , H01L23/564 , H01L24/29 , H01L24/48 , H01L24/85 , H01L2224/32506 , H01L2224/45099 , H01L2224/48247 , H01L2224/73265 , H01L2224/85205 , H01L2924/00014 , H01L2924/01012 , H01L2924/0102 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H01L2924/16195 , H01L2924/16315 , H01L2924/181 , H01L2924/18301 , H01L2924/3511 , Y10T428/24132 , H01L2924/3512 , H01L2924/00 , H01L2224/45015 , H01L2924/207
摘要： A circuit package for housing semiconductor or other integrated circuit devices (“die”) includes a high-copper flange, one or more high-copper leads and a liquid crystal polymer frame molded to the flange and the leads. The flange includes a dovetail-shaped groove or other frame retention feature that mechanically interlocks with the molded frame. During molding, a portion of the frame forms a key that freezes in or around the frame retention feature. The leads include one or more lead retention features to mechanically interlock with the frame. During molding, a portion of the frame freezes in or adjacent these lead retention features. The frame includes compounds to prevent moisture infiltration and match its coefficient of thermal expansion (CTE) to the CTE of the leads and flange. The is frame is formulated to withstand die-attach temperatures. A lid is ultrasonically welded to the frame after a die is attached to the flange.

86. 发明公开

EP1697175A1 STEUERGERÄTEEINHEIT UND VERFAHREN ZUR HERSTELLUNG DERSELBEN 有权
标题翻译： CONTROLLERS单元和方法生产同样
公开(公告)号：EP1697175A1
公开(公告)日：2006-09-06
申请号：EP04762379.8
申请日：2004-07-13
申请人： ROBERT BOSCH GMBH
发明人： WETZEL, Gerhard
IPC分类号： B60R16/02 , H05K5/00
CPC分类号： H05K5/0082 , B60R16/0239 , H01L21/50 , H01L23/04 , H01L23/047 , H01L23/10 , H01L24/48 , H01L24/49 , H01L2224/05554 , H01L2224/48091 , H01L2224/4823 , H01L2224/48472 , H01L2224/49171 , H01L2924/00014 , H01L2924/09701 , H01L2924/10161 , H01L2924/12042 , H01L2924/15312 , H01L2924/16152 , H01L2924/16315 , H01L2924/181 , H01L2924/19041 , H05K5/061 , H05K5/069 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： The invention relates to a control unit (1), especially for use in motor vehicles, which comprises a frame (8) having a recess (9) in which electrical strip conductors (10) for a supply with power extend; a base plate (11) which is inserted in the frame (8); a circuit carrier (12) mounted on the base plate (11) and carrying electronic components; an electrical connection (14) for connecting the circuit carrier (12) to the strip conductors (10); and a cover (4) for hermetically sealing the control unit (1), which cover is provided with a piece (40) molded onto it that can be inserted in the allocated recess (9) in the frame (8). A sealing gel (16) is provided in the recess (9) and is viscous to such a degree that it can flow around the electrical strip conductors (10) extending through the recess (9). The invention also relates to a manufacturing method for producing a control unit (1) of the aforementioned kind.

87. 发明公开

EP1562230A1 PACKAGING STRUCTURE 有权
标题翻译： VERPACKUNGSSTRUKTUR
公开(公告)号：EP1562230A1
公开(公告)日：2005-08-10
申请号：EP02778091.5
申请日：2002-11-12
申请人： FUJITSU LIMITED
发明人： SHIGAKI, Masafumi, c/o FUJITSU LIMITED , NAKAZAWA, Isao, c/o FUJITSU LIMITED , YAMANAKA, Kazunori, c/o FUJITSU LIMITED
IPC分类号： H01L23/373
CPC分类号： H05K1/021 , H01L23/66 , H01L25/165 , H01L2223/6627 , H01L2924/1423 , H01L2924/15153 , H01L2924/15165 , H01L2924/1616 , H01L2924/16195 , H01L2924/16315 , H01L2924/166 , H01L2924/19032 , H05K1/0203 , H05K1/0243 , H05K1/142 , H05K1/182 , H05K3/0061 , H05K2201/0323 , H05K2201/09745 , H05K2201/10166 , H05K2201/10409
摘要： In a package mounting structure for mounting a package on a case, wherein the package internally incorporates at least one of a high-frequency transistor, MIC and MMIC used in the microwave to millimeter-wave band, and a base thereof is formed of metal and serves as ground, an electrically conductive sheet having excellent thermal conductivity and exhibiting restorability and having a size identical with that of the base of the package is laid on the case at a package-bearing location, the package and sheet are fastened together by two or more screws, and the sheet is mounted on the case while it is pressed by a pressing force of 10 N/cm 2 or greater owing to fastening.
摘要翻译：在用于将封装安装在外壳上的封装安装结构中，其中封装内部包括微波至毫米波段使用的高频晶体管，MIC和MMIC中的至少一个，其基极由金属和作为地面，具有优异的导热性并具有恢复性并且具有与包装的基底尺寸相同的尺寸的导电片被放置在封装承载位置的壳体上，封装和片材通过两个或更多的螺丝，并且当由于紧固而以10N / cm 2或更大的压力按压时，该片被安装在外壳上。

88. 发明公开

EP1472726A1 WIRE BOND-LESS ELECTRONIC COMPONENT FOR USE WITH AN EXTERNAL CIRCUIT AND METHOD OF MANUFACTURE 审中-公开
标题翻译：焊线无线电子元件用在外部电路和方法
公开(公告)号：EP1472726A1
公开(公告)日：2004-11-03
申请号：EP02806458.2
申请日：2002-12-16
申请人： Freescale Semiconductor, Inc.
发明人： VISWANATHAN, Lakshminarayan, , PIEL, Pierre-Marie, J. , FUNK, Garry, Duane , DAVIDSON, Robert, P.
IPC分类号： H01L23/14 , H01L23/485
CPC分类号： H01L23/10 , H01L23/053 , H01L23/66 , H01L2224/16 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/01322 , H01L2924/09701 , H01L2924/16152 , H01L2924/16315 , H01L2924/3011
摘要： A wire bond-less electronic component is for use with a circuit external to the wire bond-less electronic component. The wire bond-less electronic component includes a support substrate (110, 410), an electronic device (130) over the support substrate, and a cover (140, 440, 540) located over the electronic device and the support substrate. The cover includes an interconnect structure (141, 441, 541) electrically coupled to the electronic device and adapted to electrically couple together the electronic device and the circuit for providing impedance transformation of an electrical signal between the electronic device and the circuit.

89. 发明公开

EP0928025A3 Wiring board and process for the production thereof 审中-公开
标题翻译： Leiterplatte und ihre Herstellung
公开(公告)号：EP0928025A3
公开(公告)日：2000-04-12
申请号：EP98310764.0
申请日：1998-12-29
申请人： TDK Corporation
发明人： Gotoh, Masashi , Kanazawa, Jitsuo , Yamamoto, Syuichiro
IPC分类号： H01L23/10 , H01L23/13
CPC分类号： H01L23/10 , H01L23/5383 , H01L23/5385 , H01L2224/16 , H01L2924/01078 , H01L2924/01079 , H01L2924/16152 , H01L2924/16315 , H05K1/111 , H05K3/062 , H05K3/243 , H05K3/28 , H05K3/383 , H05K2201/0989 , H05K2203/0307 , Y10T29/49155 , Y10T428/24917
摘要： A wiring board having a conductor layer (2) formed on a substrate (1) and a connecting pad (4) disposed in a connecting pad disposition portion (2) provided in part of the conductor layer surface (2), the conductor layer (2) having a resin inflow prevention portion (26) which is provided adjacently to the said connecting pad disposition portion (2a) and which has a surface roughness greater than the surface roughness of the said connecting pad disposition portion (2a), the resin inflow prevention portion (2b) being capable of overcoming the problem of prior art that an adhesive resin (resin layer) (20) of a prepreg or an adhesive flows out onto the upper surface of the pad (4), due to its softening under heat and its being pressurized for bonding when a structure member such as a cover layer (30) is bonded to the wiring board, and forms a cured resin which extremely inhibits the bonding property of a chip element (10) onto the pad (4).
摘要翻译：一种布线板，其具有形成在基板（1）上的导体层（2）和布置在设置在导体层表面（2）的一部分中的连接焊盘布置部分（2）中的连接焊盘（4），导体层 2）具有与所述连接焊盘布置部分（2a）相邻设置并且具有大于所述连接焊盘布置部分（2a）的表面粗糙度的表面粗糙度的树脂流入防止部分（26），树脂流入预防部分（2b）能够克服现有技术的问题，即预浸料或粘合剂的粘合树脂（树脂层）（20）由于其在加热下的软化而流出到垫（4）的上表面并且当诸如覆盖层（30）的结构构件接合到布线板上时，其被加压以进行接合，并且形成极其抑制芯片元件（10）与焊盘（4）的接合性能的固化树脂。

90. 发明公开

EP0309920A3 Electronic circuit apparatus of automobile 失效
标题翻译：汽车电子电路设备
公开(公告)号：EP0309920A3
公开(公告)日：1990-02-21
申请号：EP88115588.1
申请日：1988-09-22
申请人： HITACHI, LTD.
发明人： Urushiwara, Noriyoshi , Sugiura, Noboru , Kobayashi, Ryoichi
IPC分类号： H05K5/06 , H05K5/00
CPC分类号： H05K5/062 , H01L2224/45124 , H01L2224/48091 , H01L2224/48472 , H01L2924/16315 , H05K5/0052 , H05K5/064 , H01L2924/00014 , H01L2924/00
摘要： An electronic circuits (11, 12) are mounted on a metal base (13). The metal base is covered by a mold resin case (16) at the peripheral portion thereof. A projected portion (29) is formed along all the peripheral edge portion of the metal base. A step portion is formed to the metal base next to the projected portion of the metal base. A groove (28) is formed along all the peripheral portion of the bottom surface of the mold resin case. The projected portion is engaged to the groove which is filled with a bonding material (33). The bottom surface of the step portion is also covered by the bonding material when the projected portion is thrust into the groove of the mold resin case.

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