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    • 83. 发明授权
    • Image processing welding control method
    • 图像处理焊接控制方法
    • US4594497A
    • 1986-06-10
    • US736691
    • 1985-05-22
    • Youichi TakahashiKoji KashiwakuraJunichiro MorisawaMasahiro Kobayashi
    • Youichi TakahashiKoji KashiwakuraJunichiro MorisawaMasahiro Kobayashi
    • B23K9/12B23K9/095B23K9/127B23K9/10
    • B23K9/0956B23K9/127
    • An image processing welding control method comprises detection of isothermal pattern of a weld zone in the welding state through photographing the weld zone by an infrared camera; calculation of the area of the region defined by the isothermal line detected; comparison of the area with a standard area which is obtained in advance; control of welding heat input such that the area will be substantially the same as the standard area whereby a suitable welding heat is input the welding portion; detection of an asymmetric extent of said isothermal pattern; and controlling the torch position such that the asymmetric extent will be within a predetermined value, so that the torch will be strictly aligned with the welding groove center. This method enables two kinds of welding control methods, torch position control and welding heat input control, based on the same image information.
    • 图像处理焊接控制方法包括通过红外摄像机拍摄焊接区域来检测处于焊接状态的焊接区域的等温图案; 计算由等温线确定的区域面积; 面积与预先获得的标准面积进行比较; 控制焊接热输入,使得该区域将与标准区域基本相同,由此焊接部分输入合适的焊接热量; 检测所述等温模式的不对称程度; 并且控制割炬位置使得不对称程度将在预定值内,使得割炬将严格地对准焊接槽中心。 该方法基于相同的图像信息,实现了两种焊接控制方式,割炬位置控制和焊接热输入控制。
    • 89. 发明授权
    • Solid-state imaging device, members for the same, and imaging system
    • 固态成像装置,成像装置和成像系统
    • US09142587B2
    • 2015-09-22
    • US13807142
    • 2011-06-21
    • Masahiro Kobayashi
    • Masahiro Kobayashi
    • H01L27/146H01L23/48
    • H01L27/14636H01L23/481H01L27/14609H01L27/14632H01L27/14634H01L27/14638H01L27/1464H01L27/1469H01L2924/0002H01L2924/00
    • The present invention provides a solid-state imaging device including a pad capable of reducing inferior connection with an external terminal. The solid-state imaging device includes a first substrate provided, on its front face, with photoelectric conversion elements, a first wiring structure, a second substrate provided, on its front face, with at least a part of peripheral circuits, and a second wiring structure. The first substrate, the first wiring structure, the second wiring structure, and the second substrate are provided in this order. The first wiring structure includes a wiring layer including wirings made mainly of copper. The second wiring structure includes a wiring layer including wirings made mainly of copper. Wirings made mainly of copper in the first wiring structure are bonded with wirings made mainly of copper in the second wiring structure. The solid-state imaging device includes a pad formed of a conductive element made mainly of aluminum.
    • 本发明提供了一种固态成像装置,其包括能够减少与外部端子的不良连接的焊盘。 固态成像装置包括:第一基板,其表面上设置有光电转换元件,第一布线结构,在其正面上设置有至少一部分外围电路的第二基板和第二布线 结构体。 第一基板,第一布线结构,第二布线结构和第二基板依次设置。 第一布线结构包括布线层,包括主要由铜制成的布线。 第二布线结构包括布线层,该布线层包括主要由铜制成的布线。 在第一布线结构中主要由铜制成的布线在第二布线结构中与主要由铜制成的布线接合。 固态成像装置包括由主要由铝制成的导电元件形成的焊盘。