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    • 82. 发明授权
    • Resistor built-in spark plug
    • 电阻内置火花塞
    • US4004183A
    • 1977-01-18
    • US573326
    • 1975-04-30
    • Masami OkiMasatoshi SuzukiYasuo NakamuraOsami KamigaitoHideyuki Masaki
    • Masami OkiMasatoshi SuzukiYasuo NakamuraOsami KamigaitoHideyuki Masaki
    • H01C7/00F02B75/02H01T13/20H01T13/41H01T1/16
    • H01T13/41F02B2075/027
    • A resistor built-in spark plug comprising an insulator formed therein with an axially extending bore, a terminal nut fitted in an upper end portion of the bore, a center electrode fitted in a lower end portion of the bore, a resistor arranged in a central portion of the bore, one copper-glass electrode interposed between the resistor and the terminal nut, and another copper-glass electrode interposed between the resistor and the center electrode, such resistor being made by firing (calcining) and solidifying a resistor powder mixture consisting of 30 to 10 volume % of a principal resistor component containing tin oxide, 35 to 85 volume % of insulating ceramic filler powder of a higher electric resistivity than the principal resistor component which is selected from the group consisting of quartz glass, alumina, zircon, zirconia, silica (SiO.sub.2) and .beta.-spodumene, and 35 to 5 volume % of glass powder having a softening temperature in a range between 300.degree. and 600.degree. C. One or both of the two copper-glass electrodes may consist of two electrode layers, one copper-glass layer maintained in contact wth the resistor and having a higher copper content than the other copper-glass electrode layer.
    • 一种电阻内置火花塞,其包括形成有轴向延伸的孔的绝缘体,装配在所述孔的上端部的端子螺母,安装在所述孔的下端部的中心电极,设置在中心的电阻器 孔中的一部分,插在电阻器和端子螺母之间的一个铜玻璃电极和插入在电阻器和中心电极之间的另一个铜玻璃电极,这种电阻器通过烧结(煅烧)和固化电阻器粉末混合物制成, 含有氧化锡的主电阻体成分为30〜10体积%,35〜85体积%的绝缘陶瓷填料粉末,其电阻率高于主要电阻体成分,所述主电阻体成分选自石英玻璃,氧化铝,锆石, 氧化锆,二氧化硅(SiO 2)和β-锂辉石,以及35〜5体积%的软化温度在300〜600℃的玻璃粉末。 两个铜玻璃电极可以由两个电极层组成,一个铜 - 玻璃层保持与电阻器接触并且具有比另一个铜 - 玻璃电极层更高的铜含量。
    • 87. 发明授权
    • Work transfer device
    • 工作转移装置
    • US08678167B1
    • 2014-03-25
    • US13605090
    • 2012-09-06
    • Yasuo NakamuraNorio Kito
    • Yasuo NakamuraNorio Kito
    • B65G17/00
    • B65G23/12B62D65/022B62D65/18B65G17/34
    • A work transfer device is capable of moving a carriage in any direction and easily changes processes even with a simple configuration. The work transfer device includes a frame having a slit in a transfer direction, a ribbon body stored in the frame such that an upper portion is guided by the slit, a carriage coupling part connected to an upper end of the ribbon body and protruding from an upper side of the frame, a driving part feeding power to move the ribbon body in the transfer direction, and a tool carriage, which has a support part supporting a work W and has a coupling part coupled to the carriage coupling part, travelling on the frame.
    • 工作传送装置能够以任何方向移动托架,并且即使使用简单的配置也容易地改变过程。 工件传送装置包括:具有沿传送方向的狭缝的框架,容纳在框架中的色带体,使得上部由狭缝引导;滑架联接部,其连接到色带本体的上端并从 框架的上侧,用于使传送方向移动色带本体的驱动部件,以及工具托架,其具有支撑工件W的支撑部,并且具有联接到托架联接部的联接部, 帧。
    • 89. 发明申请
    • Light-Emitting Element and Light-Emitting Device
    • 发光元件和发光器件
    • US20120228657A1
    • 2012-09-13
    • US13412851
    • 2012-03-06
    • Yasuo NakamuraSatoshi SeoMasaaki Hiroki
    • Yasuo NakamuraSatoshi SeoMasaaki Hiroki
    • H01L51/52
    • H01L27/3225H01L27/3244H01L27/3281H01L51/5221H01L51/529H01L2251/5361H01L2251/568
    • To provide a light-emitting element or a light-emitting device in which power is not consumed wastefully even if a short-circuit failure occurs. The present invention focuses on heat generated due to a short-circuit failure which occurs in a light-emitting element. A fusible alloy which is melted at temperature T2 by heat generated due to the short-circuit failure when the short-circuit failure occurs is used for at least one of a pair of electrodes in a light-emitting element, and a layer containing an organic composition which is melted at temperature T1 is formed on a surface of the electrode opposite to a surface facing the other electrode. The present inventors have reached a structure in which the temperature T2 is lower than temperature T3 at which the light-emitting element is damaged and the temperature T1 is lower than the temperature T2, and this structure can achieve the objects.
    • 为了提供即使发生短路故障也不浪费电力的发光元件或发光装置。 本发明着重于由发生在发光元件中的短路故障而产生的热量。 在发生短路故障时由于短路故障而产生的热量在温度T2下熔化的可熔合金被用于发光元件中的一对电极中的至少一个,并且含有有机物 在与面对另一个电极的表面相反的电极的表面上形成在温度T1熔化的组合物。 本发明人已经达到了温度T2低于发光元件损坏的温度T3并且温度T1低于温度T2的结构,并且该结构可以实现目的。
    • 90. 发明申请
    • Light Emitting Device And Method of Manufacturing The Same
    • 发光装置及其制造方法
    • US20100173555A1
    • 2010-07-08
    • US12726429
    • 2010-03-18
    • Takeshi NishiYasuo Nakamura
    • Takeshi NishiYasuo Nakamura
    • H01J9/26
    • H01L51/5253H01L27/32H01L27/322H01L27/3244H01L33/56H01L51/0024H01L51/5221H01L51/5237H01L51/5246H01L2251/5315H01L2251/5323
    • A light emitting device having a structure in which oxygen and moisture are prevented from reaching light emitting elements, and a method of manufacturing the same, are provided. Further, the light emitting elements are sealed by using a small number of process steps, without enclosing a drying agent. The present invention has a top surface emission structure. A substrate on which the light emitting elements are formed is bonded to a transparent sealing substrate. The structure is one in which a transparent second sealing material covers the entire surface of a pixel region when bonding the two substrates, and a first sealing material (having a higher viscosity than the second sealing material), which contains a gap material (filler, fine particles, or the like) for protecting a gap between the two substrates, surrounds the pixel region. The two substrates are sealed by the first sealing material and the second sealing material. Further, reaction between electrodes of the light emitting elements (cathodes or anodes) and the sealing materials can be prevented by covering the electrodes with a transparent protective layer, for example, CaF2, MgF2, or BaF2.
    • 提供了具有防止氧气和水分到达发光元件的结构的发光器件及其制造方法。 此外,通过使用少量的工艺步骤来密封发光元件,而不包封干燥剂。 本发明具有顶面发射结构。 其上形成有发光元件的基板被接合到透明密封基板。 该结构是当粘合两个基板时透明第二密封材料覆盖像素区域的整个表面的结构,以及包含间隙材料(填料)的第一密封材料(具有比第二密封材料更高的粘度) 微粒等),用于保护两个基板之间的间隙,围绕像素区域。 两个基板由第一密封材料和第二密封材料密封。 此外,通过用透明保护层覆盖电极可以防止发光元件(阴极或阳极)的电极与密封材料之间的反应,例如CaF 2,MgF 2或BaF 2。