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    • 82. 发明申请
    • Method for Forming Self-Aligned Thermal Isolation Cell for a Variable Resistance Memory Array
    • 用于形成可变电阻存储器阵列的自对准热隔离单元的方法
    • US20070158633A1
    • 2007-07-12
    • US11463824
    • 2006-08-10
    • Erh-Kun LaiChiaHua HoKuang Yeu Hsieh
    • Erh-Kun LaiChiaHua HoKuang Yeu Hsieh
    • H01L47/00
    • H01L45/06H01L45/1233H01L45/1293H01L45/144H01L45/1683
    • A non-volatile method with a self-aligned RRAM element. The method includes a lower electrode element, generally planar in form, having an inner contact surface. At the top of the device is a upper electrode element, spaced from the lower electrode element. A containment structure extends between the upper electrode element and the lower electrode element, and this element includes a sidewall spacer element having an inner surface defining a generally funnel-shaped central cavity, terminating at a terminal edge to define a central aperture; and a spandrel element positioned between the sidewall spacer element and the lower electrode, having an inner surface defining a thermal isolation cell, the spandrel inner walls being spaced radially outward from the sidewall spacer terminal edge, such that the sidewall spacer terminal edge projects radially inward from the spandrel element inner surface. ARRAM element extends between the lower electrode element and the upper electrode, occupying at least a portion of the sidewall spacer element central cavity and projecting from the sidewall spacer terminal edge toward and making contact with the lower electrode. In this manner, the spandrel element inner surface is spaced from the RRAM element to define a thermal isolation cell adjacent the RRAM element.
    • 具有自对准RRAM元素的非易失性方法。 该方法包括具有内部接触表面的大体平面形状的下部电极元件。 在装置的顶部是与下部电极元件间隔开的上部电极元件。 容纳结构在上电极元件和下电极元件之间延伸,并且该元件包括侧壁间隔元件,其具有限定大致漏斗形中心腔的内表面,终止于端边缘以限定中心孔; 以及位于所述侧壁间隔元件和所述下电极之间的突出元件,具有限定了热隔离单元的内表面,所述凸起内壁与所述侧壁间隔件终端边缘径向向外间隔开,使得所述侧壁间隔件末端边缘径向向内突出 从弹簧元件内表面。 ARRAM元件在下电极元件和上电极之间延伸,占据侧壁间隔元件中心空腔的至少一部分并且从侧壁间隔件终端边缘朝向和与下电极接触。 以这种方式,伞形元件内表面与RRAM元件间隔开以限定与RRAM元件相邻的热隔离单元。
    • 83. 发明授权
    • Program and erase methods with substrate transient hot carrier injections in a non-volatile memory
    • 在非易失性存储器中进行衬底瞬态热载体注入的编程和擦除方法
    • US07590005B2
    • 2009-09-15
    • US11625236
    • 2007-01-19
    • Tzu Hsuan HsuChao-I WuKuang Yeu HsiehYa-Chin King
    • Tzu Hsuan HsuChao-I WuKuang Yeu HsiehYa-Chin King
    • G11C11/34
    • G11C16/0466
    • The present invention describes a uniform program method and a uniform erase method of a charge trapping memory by employing a substrate transient hot electron technique for programming, and a substrate transient hot hole technique for erasing, which emulate an FN tunneling method for NAND memory operation. The methods of the present invention are applicable to a wide variety of charge trapping memories including n-channel or p-channel SONOS types of memories and floating gate (FG) type memories. The programming of the charge trapping memory is conducted using a substrate transient hot electron injection in which a body bias voltage Vb has a short pulse width and a gate bias voltage Vg has a pulse width that is sufficient to move electrons from a channel region to a charge trapping structure.
    • 本发明通过采用用于编程的衬底瞬态热电子技术和用于擦除的衬底瞬时热孔技术来描述电荷捕获存储器的均匀编程方法和均匀擦除方法,其模拟用于NAND存储器操作的FN隧穿方法。 本发明的方法可应用于包括n沟道或p沟道SONOS类型的存储器和浮动栅(FG)型存储器的各种电荷捕获存储器。 电荷捕获存储器的编程是使用衬底瞬态热电子注入进行的,其中体偏置电压Vb具有短的脉冲宽度,并且栅极偏置电压Vg具有足以将电子从沟道区域移动到 电荷捕获结构。
    • 88. 发明申请
    • PROGRAM AND ERASE METHODS WITH SUBSTRATE TRANSIENT HOT CARRIER INJECTIONS IN A NON-VOLATILE MEMORY
    • 在非易失性存储器中具有基板瞬态热载体注入的程序和擦除方法
    • US20110116317A1
    • 2011-05-19
    • US12985743
    • 2011-01-06
    • TZU HSUAN HSUChao-I WuKuang Yeu HsiehYa-Chin King
    • TZU HSUAN HSUChao-I WuKuang Yeu HsiehYa-Chin King
    • G11C16/04
    • G11C16/0466
    • The present invention describes a uniform program method and a uniform erase method of a charge trapping memory by employing a substrate transient hot electron technique for programming, and a substrate transient hot hole technique for erasing, which emulate an FN tunneling method for NAND memory operation. The methods of the present invention are applicable to a wide variety of charge trapping memories including n-channel or p-channel SONOS types of memories and floating gate (FG) type memories. the programming of the charge trapping memory is conducted using a substrate transient hot electron injection in which a body bias voltage Vb has a short pulse width and a gate bias voltage Vg has a pulse width that is sufficient to move electrons from a channel region to a charge trapping structure.
    • 本发明通过采用用于编程的衬底瞬态热电子技术和用于擦除的衬底瞬时热孔技术来描述电荷俘获存储器的均匀编程方法和均匀擦除方法,其模拟用于NAND存储器操作的FN隧道法。 本发明的方法可应用于包括n沟道或p沟道SONOS类型的存储器和浮动栅(FG)型存储器的各种电荷捕获存储器。 使用衬底瞬态热电子注入进行电荷俘获存储器的编程,其中体偏置电压Vb具有短的脉冲宽度,并且栅极偏置电压Vg具有足以将电子从沟道区域移动到 电荷捕获结构。
    • 90. 发明申请
    • Program and Erase Methods with Substrate Transient Hot Carrier Injections in a Non-Volatile Memory
    • 在非易失性存储器中基片瞬态热载体注入的程序和擦除方法
    • US20070236994A1
    • 2007-10-11
    • US11625236
    • 2007-01-19
    • Tzu Hsuan HsuChao-I WuKuang Yeu HsiehYa-Chin King
    • Tzu Hsuan HsuChao-I WuKuang Yeu HsiehYa-Chin King
    • G11C16/02
    • G11C16/0466
    • The present invention describes a uniform program method and a uniform erase method of a charge trapping memory by employing a substrate transient hot electron technique for programming, and a substrate transient hot hole technique for erasing, which emulate an FN tunneling method for NAND memory operation. The methods of the present invention are applicable to a wide variety of charge trapping memories including n-channel or p-channel SONOS types of memories and floating gate (FG) type memories. the programming of the charge trapping memory is conducted using a substrate transient hot electron injection in which a body bias voltage Vb has a short pulse width and a gate bias voltage Vg has a pulse width that is sufficient to move electrons from a channel region to a charge trapping structure.
    • 本发明通过采用用于编程的衬底瞬态热电子技术和用于擦除的衬底瞬时热孔技术来描述电荷俘获存储器的均匀编程方法和均匀擦除方法,其模拟用于NAND存储器操作的FN隧道法。 本发明的方法可应用于包括n沟道或p沟道SONOS类型的存储器和浮动栅(FG)型存储器的各种电荷捕获存储器。 使用衬底瞬态热电子注入进行电荷俘获存储器的编程,其中体偏置电压Vb具有短的脉冲宽度,并且栅极偏置电压Vg具有足以将电子从沟道区域移动到 电荷捕获结构。