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82. 发明申请

US20070011906A1 Dryer apparatus for clothing knitted or woven fabric 失效
标题翻译：服装针织或机织布干燥机
公开(公告)号：US20070011906A1
公开(公告)日：2007-01-18
申请号：US10569281
申请日：2004-08-24
申请人： Toshiaki Morita
发明人： Toshiaki Morita
IPC分类号： F26B13/06 , F26B13/10
CPC分类号： F26B21/024 , F26B3/283
摘要： A dryer apparatus for use in a woven and knitted fabric is constructed such that a first drying rack disposed at an upper step, and at least one step of a second drying rack disposed at a lower step thereof are provided in a frame. Each of the drying racks is formed of a drying surface having ventilation. A first drying device is disposed above the first drying rack, and a second drying device is disposed above the second rack. Each of the drying devices is formed of a drying irradiation surface for irradiating heat ray and/or heated air, and is constructed to be movable for reciprocation along the drying surface of the drying rack by means of a driving device. The drying device disposed above the second drying rack is constructed to be able to switch a direction of the drying irradiation surface from downside to upside and to be able to dry from both of an upper and a lower surface of the first drying rack.
摘要翻译：一种用于织造和编织织物的干燥设备被构造成使得设置在上部台阶处的第一干燥架和设置在其下部的第二干燥架的至少一个台阶设置在框架中。每个干燥架由具有通风的干燥表面形成。第一干燥装置设置在第一干燥架上方，第二干燥装置设置在第二机架的上方。每个干燥装置由用于照射热射线和/或加热空气的干燥照射表面形成，并且被构造成可通过驱动装置沿着干燥架的干燥表面往复运动。设置在第二干燥架上方的干燥装置被构造成能够将干燥照射表面的方向从下侧切换到上侧，并且能够从第一干燥架的上表面和下表面两者干燥。

83. 发明申请

US20060138679A1 Semiconductor device having improved adhesion between bonding and ball portions of electrical connectors 有权
标题翻译：具有改善电连接器的接合和球部之间的粘合性的半导体器件
公开(公告)号：US20060138679A1
公开(公告)日：2006-06-29
申请号：US11357024
申请日：2006-02-21
申请人： Naoki Kawanabe , Tomoo Matsuzawa , Toshiaki Morita , Takafumi Nishita
发明人： Naoki Kawanabe , Tomoo Matsuzawa , Toshiaki Morita , Takafumi Nishita
IPC分类号： H01L23/52
CPC分类号： H01L24/85 , H01L21/565 , H01L23/3128 , H01L24/05 , H01L24/06 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/78 , H01L24/97 , H01L2224/02166 , H01L2224/0401 , H01L2224/04042 , H01L2224/05553 , H01L2224/05554 , H01L2224/05624 , H01L2224/05644 , H01L2224/32225 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45164 , H01L2224/4807 , H01L2224/48091 , H01L2224/48227 , H01L2224/48453 , H01L2224/48455 , H01L2224/48465 , H01L2224/4847 , H01L2224/48624 , H01L2224/48644 , H01L2224/48724 , H01L2224/49171 , H01L2224/49431 , H01L2224/49433 , H01L2224/73265 , H01L2224/78301 , H01L2224/78704 , H01L2224/85045 , H01L2224/85181 , H01L2224/85201 , H01L2224/85203 , H01L2224/85205 , H01L2224/92247 , H01L2224/97 , H01L2924/00011 , H01L2924/01202 , H01L2924/01204 , H01L2924/014 , H01L2924/05042 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/20752 , H01L2924/351 , H01L2924/01046 , H01L2224/85 , H01L2924/00014 , H01L2924/01013 , H01L2924/00 , H01L2924/00012 , H01L2224/48744 , H01L2924/00015 , H01L2924/0102 , H01L2924/013 , H01L2924/01004 , H01L2924/00013 , H01L2924/01006
摘要： A semiconductor device with improved the adhesion between bonding pads and ball portions of gold wires is provided to improve the reliability of a semiconductor device. About 1 wt. % of Pd is contained in gold wires for connection between electrode pads formed on a wiring substrate and electrode pads (exposed areas of a top layer wiring formed mainly of Al) formed on a semiconductor chip. In bonded portions between the electrode and ball portions of the gold wires, an interdiffusion of Au and Al is suppressed to prevent the formation of Au4Al after PCT (Pressure Cooker Test). Thus, a desired bonding strength is obtained even when the pitch of the electrode pads is smaller than 65 μm and the diameter of the ball portion is smaller than 55 μm or the diameter of the wire portion of each gold wire is not larger than 25 μm.
摘要翻译：提供了提高接合焊盘和金线的球部之间的粘附性的半导体器件，以提高半导体器件的可靠性。约1重量％用于在形成在布线基板上的电极焊盘和形成在半导体芯片上的电极焊盘（主要由Al形成的顶层布线的暴露区域）之间的连接的金线中包含Pd的％。在金线的电极和球部之间的接合部分中，抑制了Au和Al的相互扩散，以防止在PCT（压力锅试验）之后形成Au 4 Al。因此，即使当电极焊盘的间距小于65μm并且球部的直径小于55μm或每个金线的线部分的直径不大于25μm时，也获得期望的接合强度。

84. 发明申请

US20060071860A1 Inverter and vehicle drive unit using the same 有权
公开(公告)号：US20060071860A1
公开(公告)日：2006-04-06
申请号：US11206166
申请日：2005-08-18
申请人： Hiroshi Hozoji , Toshiaki Morita , Satoru Shigeta , Tokihito Suwa
发明人： Hiroshi Hozoji , Toshiaki Morita , Satoru Shigeta , Tokihito Suwa
IPC分类号： H01Q1/38
CPC分类号： H02M7/003 , H01L24/37 , H01L24/40 , H01L24/84 , H01L24/91 , H01L24/95 , H01L25/072 , H01L2224/16245 , H01L2224/37124 , H01L2224/37147 , H01L2224/37611 , H01L2224/37644 , H01L2224/37655 , H01L2224/4007 , H01L2224/40095 , H01L2224/40137 , H01L2224/40225 , H01L2224/45124 , H01L2224/45147 , H01L2224/48091 , H01L2224/48472 , H01L2224/73221 , H01L2224/73265 , H01L2224/83801 , H01L2224/84801 , H01L2924/00011 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/01051 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/1301 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/19041 , H01L2924/19043 , H01L2924/30107 , H01L2924/3011 , H01L2924/351 , H01L2924/00 , H01L2924/01026 , H01L2924/01028 , H01L2224/0401
摘要： The inverter has a plurality of arms for conducting or cutting off a current and each arm has a switching device and a first and a second wiring layer for connecting the switching device. The first and second wiring layers of each arm are respectively formed on insulating substrates, and one face of the switching device is fixed to the first wiring layer, and the second wiring layer and the other face of the switching device are electrically connected by a laminal conductor, and the laminal conductor has a first and a second connection, and the first connection of the laminal conductor is fixed to the other face of the switching device, and the second connection of the laminal conductor is fixed to the second wiring layer. Thereby, a large current of the inverter can be realized and the assembly capacity of the inverter or the vehicle drive unit will be improved.

85. 发明授权

US07015127B2 Semiconductor device and a method of manufacturing the same 失效
公开(公告)号：US07015127B2
公开(公告)日：2006-03-21
申请号：US10408119
申请日：2003-04-08
申请人： Yasuyuki Nakajima , Toshiaki Morita , Tomoo Matsuzawa , Seiichi Tomoi , Naoki Kawanabe
发明人： Yasuyuki Nakajima , Toshiaki Morita , Tomoo Matsuzawa , Seiichi Tomoi , Naoki Kawanabe
IPC分类号： H01L21/44
CPC分类号： H01L24/05 , H01L23/53223 , H01L24/03 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/78 , H01L24/85 , H01L2224/04042 , H01L2224/05073 , H01L2224/05166 , H01L2224/05181 , H01L2224/05184 , H01L2224/05187 , H01L2224/05554 , H01L2224/05556 , H01L2224/05624 , H01L2224/45015 , H01L2224/45144 , H01L2224/4807 , H01L2224/48091 , H01L2224/48095 , H01L2224/48227 , H01L2224/48453 , H01L2224/48465 , H01L2224/48507 , H01L2224/48624 , H01L2224/49175 , H01L2224/78301 , H01L2224/85045 , H01L2224/85181 , H01L2224/85201 , H01L2224/85203 , H01L2224/85205 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01022 , H01L2924/01047 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/01079 , H01L2924/014 , H01L2924/04941 , H01L2924/0496 , H01L2924/05042 , H01L2924/1306 , H01L2924/14 , H01L2924/181 , H01L2924/20106 , H01L2924/20305 , H01L2924/20306 , H01L2924/20307 , H01L2924/20308 , H01L2924/20752 , H01L2924/3011 , H01L2924/00014 , H01L2924/04953 , H01L2924/00 , H01L2924/20751 , H01L2924/00012
摘要： Provided is a semiconductor device comprising a first metal film formed above a semiconductor chip, a ball portion formed over said first metal film and made of a second metal, and an alloy layer of said first metal and said second metal which alloy layer is formed between said first metal film and said ball portion, wherein said alloy layer reaches the bottom of said first metal film, and said ball portion is covered with a resin; and a manufacturing method thereof. The present invention makes it possible to improve adhesion between the bonding pad portion and ball portion of a bonding wire over an interconnect, thereby improving the reliability of the semiconductor device.

86. 发明申请

US20050183466A1 Weft knitting machine with movable sinker device 失效
公开(公告)号：US20050183466A1
公开(公告)日：2005-08-25
申请号：US10516258
申请日：2003-05-01
申请人： Toshiaki Morita , Toshinori Nakamori
发明人： Toshiaki Morita , Toshinori Nakamori
IPC分类号： D04B15/06 , D04B15/70 , D04B7/04
CPC分类号： D04B15/70 , D04B15/06 , D04B15/362 , D04B15/90
摘要： A weft knitting machine with a movable sinker device capable of preventing yarn from being worn caused by repeatedly striking the yarn with a sinker energized by a spring to push down knitting fabric, wherein a stroke to which a yarn locking part (2a) at the tip of a sinker plate (2) is moved to a tooth port (6) by the energization of the spring (4) is increased at a first stage shown in (a) and decreased at a second stage shown in (b), the stroke is limited in (b) by locking a holding locking part (12a) of a holding member (12) to the holding locking part (2d) of the sinker plate (2), and a stage is switched to a second stage at a knitting portion where the yarn locking part (2a) repeatedly strikes the yarn to prevent the yarn from being thinned and fluffed.

87. 发明申请

US20050035449A1 Method of manufacturing a semiconductor device to provide improved adhesion between bonding pads and ball portions of electrical connectors 失效
标题翻译：制造半导体器件的方法，以提供接合焊盘和电连接器的球部之间的改进的粘合
公开(公告)号：US20050035449A1
公开(公告)日：2005-02-17
申请号：US10807249
申请日：2004-03-24
申请人： Naoki Kawanabe , Tomoo Matsuzawa , Toshiaki Morita , Takafumi Nishita
发明人： Naoki Kawanabe , Tomoo Matsuzawa , Toshiaki Morita , Takafumi Nishita
IPC分类号： H01L21/60 , H01L21/56 , H01L21/603 , H01L23/31 , H01L23/49 , H01L23/495
CPC分类号： H01L24/85 , H01L21/565 , H01L23/3128 , H01L24/05 , H01L24/06 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/78 , H01L24/97 , H01L2224/02166 , H01L2224/0401 , H01L2224/04042 , H01L2224/05553 , H01L2224/05554 , H01L2224/05624 , H01L2224/05644 , H01L2224/32225 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45164 , H01L2224/4807 , H01L2224/48091 , H01L2224/48227 , H01L2224/48453 , H01L2224/48455 , H01L2224/48465 , H01L2224/4847 , H01L2224/48624 , H01L2224/48644 , H01L2224/48724 , H01L2224/49171 , H01L2224/49431 , H01L2224/49433 , H01L2224/73265 , H01L2224/78301 , H01L2224/78704 , H01L2224/85045 , H01L2224/85181 , H01L2224/85201 , H01L2224/85203 , H01L2224/85205 , H01L2224/92247 , H01L2224/97 , H01L2924/00011 , H01L2924/01202 , H01L2924/01204 , H01L2924/014 , H01L2924/05042 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/20752 , H01L2924/351 , H01L2924/01046 , H01L2224/85 , H01L2924/00014 , H01L2924/01013 , H01L2924/00 , H01L2924/00012 , H01L2224/48744 , H01L2924/00015 , H01L2924/0102 , H01L2924/013 , H01L2924/01004 , H01L2924/00013 , H01L2924/01006
摘要： A method is provided to improve adhesion between bonding pads and ball portions of gold wires to improve reliability of a semiconductor device. About 1 wt. % of Pd is contained in gold wires for connection between electrode pads formed on a wiring substrate and electrode pads (exposed areas of a top layer wiring formed mainly of Al) formed on a semiconductor chip. In bonded portions between the electrode and ball portions of the gold wires, an interdiffusion of Au and Al is suppressed to prevent the formation of Au4A1 after POT (Pressure Cooker Test). Thus, a desired bonding strength is obtained even when the pitch of the electrode pads is smaller than 65 pin and the diameter of the ball portion is smaller than 55 pm or the diameter of the wire portion of each gold wire is not larger than 25 pin.
摘要翻译：提供了一种提高接合焊盘和金线球部之间粘合性的方法，以提高半导体器件的可靠性。约1重量％用于在形成在布线基板上的电极焊盘和形成在半导体芯片上的电极焊盘（主要由Al形成的顶层布线的暴露区域）之间的连接的金线中包含Pd的％。在金线的电极和球部之间的接合部分中，抑制Au和Al的相互扩散，以防止在POT（压力锅试验）之后形成Au4A1。因此，即使当电极焊盘的间距小于65针并且球部的直径小于55μm或每个金线的线部分的直径不大于25针时，也获得期望的接合强度。

88. 外观设计

USD474810S1 Writing instrument 失效
公开(公告)号：USD474810S1
公开(公告)日：2003-05-20
申请号：US29160975
申请日：2002-05-20
申请人： Toshiaki Morita
设计人： Toshiaki Morita

89. 发明授权

US06422045B1 Compound needle of knitting machine 有权
标题翻译：针织复合针
公开(公告)号：US06422045B1
公开(公告)日：2002-07-23
申请号：US09958827
申请日：2001-10-15
申请人： Toshiaki Morita , Klaus Ruoff
发明人： Toshiaki Morita , Klaus Ruoff
IPC分类号： D04B3506
CPC分类号： D04B35/06
摘要： A compound needle has blades of a slider having tongues formed by two superposed blades accommodated in a blade accommodating groove formed in a needle body. The blades are provided with bends to bring side surfaces of the blades accommodated in the blade groove in the needle body into press-contact with side walls of the groove. Front end portions of the blades can thus be held in positions that are equally divided to the right and left with respect to the widthwise direction of the blade groove from a widthwise center of the groove to more reliably center the blades in the blade groove.
摘要翻译：复合针具有滑块的刀片，其具有由形成在针体中的刀片容纳槽中容纳的两个叠置的刀片形成的舌片。叶片设置有弯曲部，以使容纳在针体中的叶片槽中的叶片的侧表面与槽的侧壁压接。因此，叶片的前端部能够从槽的宽度方向的中心保持在相对于叶片槽的宽度方向左右相等的位置，以更可靠地使叶片在叶片槽中居中。

90. 发明授权

US06339942B1 Compound needle with asymmetrically divided closing element 有权
标题翻译：复合针具有不对称分割的闭合元件
公开(公告)号：US06339942B1
公开(公告)日：2002-01-22
申请号：US09690740
申请日：2000-10-18
申请人： Sigmar Majer , Bernhard Schuler , Kurt Wiedenhöfer , Toshiaki Morita , Kenji Kitahara
发明人： Sigmar Majer , Bernhard Schuler , Kurt Wiedenhöfer , Toshiaki Morita , Kenji Kitahara
IPC分类号： D04B3506
CPC分类号： D04B35/32 , D04B35/06
摘要： A compound needle comprises a closing element with two closing element springs. These are designed to be asymmetrical relative to each other or at least provided with clearances or openings which, during the operation of the compound needle, are made to overlap with a corresponding cutout or other openings in the basic compound needle member, so that deposits can be removed to the needle channel. An asymmetric design of the closing element springs prevents the closing element from being wedged into the closing element channel, even if the deposit removal is incomplete. As a result, the compound needle wear is reduced considerably and the operational safety is increased.
摘要翻译：复合针包括具有两个闭合元件弹簧的闭合元件。这些被设计为相对于彼此不对称或至少设置有间隙或开口，其在复合针的操作期间与基本复合针构件中的相应切口或其他开口重叠，使得沉积物被移除到针通道。关闭元件弹簧的不对称设计防止关闭元件楔入闭合元件通道，即使沉积物移除不完整。结果，复合针磨损显着降低，操作安全性增加。

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