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81. 发明申请

US20100118445A1 Suspension board with circuit 有权
标题翻译：悬挂板带电路
公开(公告)号：US20100118445A1
公开(公告)日：2010-05-13
申请号：US12591102
申请日：2009-11-09
申请人： Tetsuya Ohsawa , Toshiki Naito
发明人： Tetsuya Ohsawa , Toshiki Naito
IPC分类号： G11B21/16
CPC分类号： H05K1/189 , G11B5/4833 , G11B5/484 , G11B5/4853 , G11B5/486 , G11B5/4866 , G11B2005/0021 , H05K1/056 , H05K1/182 , H05K2201/048 , H05K2201/055 , H05K2201/0969 , H05K2201/10106 , H05K2201/10537 , H05K2201/10727
摘要： A suspension board with circuit includes a conductive pattern, a board main body portion, an auxiliary portion folded back with respect to the board main body portion, a slider disposed on a side of the suspension board with circuit which is closer to the board main body portion, and mounting thereon a magnetic head, and a light emitting element disposed on a side of the suspension board with circuit which is closer to the auxiliary portion. The conductive pattern includes a first conductive pattern including first and second terminals connected to an external circuit and the magnetic head, and second conductive pattern including third and fourth terminals connected to the external circuit and light emitting element. Both of the first and second terminal are disposed on the board main body portion. The third and fourth terminals are disposed on the board main body portion and on the auxiliary portion respectively.
摘要翻译：具有电路的悬挂板包括导电图案，板主体部分，相对于板主体部分折回的辅助部分，设置在悬挂板侧面的滑块，该滑块更靠近板主体并安装在磁头上的发光元件和配置在靠近辅助部分的电路的悬挂板侧的发光元件。导电图案包括第一导电图案，包括连接到外部电路和磁头的第一和第二端子，以及包括连接到外部电路和发光元件的第三和第四端子的第二导电图案。第一端子和第二端子都设置在板主体部分上。第三和第四端子分别设置在板主体部分和辅助部分上。

82. 发明授权

US07649143B2 Wired-circuit-board assembly sheet 失效
标题翻译：有线电路板组装板
公开(公告)号：US07649143B2
公开(公告)日：2010-01-19
申请号：US11654547
申请日：2007-01-18
申请人： Tetsuya Ohsawa , Kouji Kataoka , Yoshihiko Takeuchi
发明人： Tetsuya Ohsawa , Kouji Kataoka , Yoshihiko Takeuchi
IPC分类号： H05K1/00
CPC分类号： H05K1/0269 , G11B5/484 , G11B5/486 , H05K1/056 , H05K3/225 , H05K2201/09127 , H05K2201/0969 , H05K2201/09781
摘要： A wired-circuit-board assembly sheet is provided having removable portions that are easily removable without any generation of metal powder. The wired-circuit-board assembly sheet comprises a plurality of suspension boards with circuits, distinguishing marks for distinguishing defectiveness of the suspension boards with circuits, and a supporting sheet for supporting the suspension boards with circuits and the distinguishing marks, wherein openings are formed in the supporting sheet, and removable portions which are to be removed when the suspension boards with circuits are judged defective are located in the openings and also supported by the supporting sheet via joint portions formed of resin.
摘要翻译：提供了一种布线电路板组装片，其具有易拆卸而不产生金属粉末的可去除部分。布线电路板组装片包括多个具有电路的悬挂板，用于区分悬挂板与电路的缺陷的区别标记，以及用于支撑具有电路和区别标记的悬挂板的支撑片，其中开口形成在支撑片和可拆卸部分位于开口中，并且还通过由树脂形成的接合部分由支撑片支撑。

83. 外观设计

USD594425S1 Identification mark for a wiring circuit board carrying sheet 有权
标题翻译：布线电路板承载板的识别标志
公开(公告)号：USD594425S1
公开(公告)日：2009-06-16
申请号：US29324370
申请日：2008-09-11
申请人： Tetsuya Ohsawa , Yoshihiko Takeuchi , Kouji Kataoka
设计人： Tetsuya Ohsawa , Yoshihiko Takeuchi , Kouji Kataoka

84. 发明授权

US07531753B2 Suspension board with circuit 有权
标题翻译：悬挂板带电路
公开(公告)号：US07531753B2
公开(公告)日：2009-05-12
申请号：US11123181
申请日：2005-05-06
申请人： Yasuhito Funada , Tetsuya Ohsawa
发明人： Yasuhito Funada , Tetsuya Ohsawa
IPC分类号： H05K1/00
CPC分类号： H05K1/028 , G11B5/484 , H05K1/056 , H05K3/28 , H05K2201/0969 , H05K2201/0989
摘要： A suspension board with circuit that can allow precise adjustment of flotation (flotation angle) of even a small-sized slider to a magnetic disc even when the outrigger portions are reduced in rigidity. A gimbal portion of the suspension board with circuit is formed by a tongue portion for mounting a magnetic head thereon, and outrigger portions provided at both sides of the tongue portion, and an opening is formed in the insulating cover layer 5 so that the conductor layer can be exposed therefrom in the outrigger portions. This can allow reduction in rigidity of the outrigger portions, and as such can allow precise adjustment of flotation (flotation angle) of the slider to the magnetic disc even when a small-sized slider is mounted on the gimbal portion.
摘要翻译：具有电路的悬挂板，即使当外伸支架部分的刚度降低时，也能够将即使小型滑块的浮选（浮选角）精确地调整到磁盘。具有电路的悬架板的万向节部分由用于在其上安装磁头的舌部和设置在舌部两侧的外伸支架部分形成，并且在绝缘覆盖层5中形成开口，使得导体层可以从外伸支架部分露出。这可以允许外伸支架部分的刚度降低，并且因此即使当小尺寸的滑块安装在万向节部分上时，这样可以允许滑块与磁盘的浮选（浮选角度）的精确调节。

85. 发明授权

US07525764B2 Suspension board with circuit 有权
标题翻译：悬挂板带电路
公开(公告)号：US07525764B2
公开(公告)日：2009-04-28
申请号：US11256800
申请日：2005-10-24
申请人： Tetsuya Ohsawa , Yasuhito Funada , Hitoki Kanagawa
发明人： Tetsuya Ohsawa , Yasuhito Funada , Hitoki Kanagawa
IPC分类号： G11B5/60 , G11B21/21
CPC分类号： G11B5/4853 , G11B5/486 , H05K1/056 , H05K3/3442 , H05K3/3494 , H05K2201/0397 , H05K2201/09063 , H05K2201/0969 , H05K2203/041 , H05K2203/107 , Y02P70/613
摘要： An area 5 for mounting a magnetic head is formed on a metal board 1, a conductive layer 4 is formed as a circuit pattern via an insulation layer 2 interposed outside this area and up to a metal board 1. A pattern end 4 to be a connection terminal for connection with the terminal of the magnetic head is formed on the circuit pattern, an end face 4a of the pattern end 4 is aligned with an end face 2a of the insulation layer 2 directly beneath it or protruded in the terminating direction from the end face 2a, thereby providing a structure preventing irradiation of a laser beam on the insulation layer 2.
摘要翻译：用于安装磁头的区域5形成在金属板1上，导电层4经由绝缘层2形成为电路图案，绝缘层2插入该区域的外部，直到金属板1为止。图案端4为用于与磁头的端子连接的连接端子形成在电路图案上，图案端4的端面4a与绝缘层2的正下方的端面2a对齐，或者从终端方向突出从而提供防止激光束在绝缘层2上的照射的结构。

86. 外观设计

USD584250S1 Grooves formed around a semiconductor device on a circuit board 有权
标题翻译：在电路板上的半导体器件周围形成沟槽
公开(公告)号：USD584250S1
公开(公告)日：2009-01-06
申请号：US29303707
申请日：2008-02-15
申请人： Emiko Tani , Tetsuya Ohsawa
设计人： Emiko Tani , Tetsuya Ohsawa

87. 外观设计

USD577691S1 Grooves formed around a semiconductor device on a circuit board 有权
公开(公告)号：USD577691S1
公开(公告)日：2008-09-30
申请号：US29303833
申请日：2008-02-19
申请人： Tetsuya Ohsawa , Emiko Tani
设计人： Tetsuya Ohsawa , Emiko Tani

88. 外观设计

USD568838S1 Grooves formed around a semiconductor device on a circuit board 有权
公开(公告)号：USD568838S1
公开(公告)日：2008-05-13
申请号：US29268260
申请日：2006-11-01
申请人： Naohiro Terada , Kouji Kataoka , Tetsuya Ohsawa , Toshiki Naito
设计人： Naohiro Terada , Kouji Kataoka , Tetsuya Ohsawa , Toshiki Naito

89. 外观设计

USD568836S1 Groove formed around a semiconductor device on a circuit board 有权
公开(公告)号：USD568836S1
公开(公告)日：2008-05-13
申请号：US29240252
申请日：2005-10-11
申请人： Tetsuya Ohsawa , Emiko Tani
设计人： Tetsuya Ohsawa , Emiko Tani

90. 发明授权

US07329817B2 Partially completed wiring circuit board assembly sheet and production method of wiring circuit board using said sheet 有权
标题翻译：部分完成布线电路板组装片及使用该片的布线电路板的生产方法
公开(公告)号：US07329817B2
公开(公告)日：2008-02-12
申请号：US11195965
申请日：2005-08-03
申请人： Hidenori Aonuma , Tetsuya Ohsawa , Yasuhito Ohwaki
发明人： Hidenori Aonuma , Tetsuya Ohsawa , Yasuhito Ohwaki
IPC分类号： H01R12/04
CPC分类号： H05K3/242 , H05K1/056 , H05K3/0052 , H05K3/28 , H05K2201/0969
摘要： The present invention provides a partially completed wiring circuit board assembly sheet capable of preventing deposition of a plating metal on the surface of a metal sheet, even when pinholes are produced in an insulating layer for insulating a lead wire for electroplating from a metal sheet.The assembly sheet 100 of the present invention has a metal sheet 1, multiple wiring circuit board forming area 1A in compartments on the metal sheet and area 1B for forming a lead wire for electroplating, which is in compartment on the metal sheet 1. Each area 1A has a partially completed wiring circuit board 10. The partially completed wiring circuit board 10 is equipped with a base insulating layer 2, a wiring pattern 3 and a cover insulating layer 4. In the area 1B, a first insulating layer 12, a lead wire 13 for electroplating and a second insulating layer 14 are laminated in this order. Of the metal sheet 1, an opening 16 is formed in the part under the lead wire 13.
摘要翻译：本发明提供了一种部分完成的布线电路板组装片，即使在用于使金属片的电镀用引线绝缘的绝缘层中产生针孔时，也能够防止电镀金属在金属片的表面上的沉积。本发明的组装片100具有金属片1，金属片上的隔室中的多个布线电路板形成区域1A和金属片1上的隔室中形成用于电镀的导线的区域1B。每个区域1A具有部分完成的布线电路板10。部分完成的布线电路板10配备有基底绝缘层2，布线图案3和覆盖绝缘层4。在区域1B中，依次层叠第一绝缘层12，电镀用引线13和第二绝缘层14。在金属片1中，在引线13下面的部分中形成开口16。

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