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81. 发明授权

US07901997B2 Method of manufacturing semiconductor device 有权
标题翻译：制造半导体器件的方法
公开(公告)号：US07901997B2
公开(公告)日：2011-03-08
申请号：US12021664
申请日：2008-01-29
申请人： Takashi Ozawa , Seiji Sato , Masao Nakazawa , Mitsuyoshi Imai , Masatoshi Nakamura , Kei Imafuji
发明人： Takashi Ozawa , Seiji Sato , Masao Nakazawa , Mitsuyoshi Imai , Masatoshi Nakamura , Kei Imafuji
IPC分类号： H01L21/00
CPC分类号： H01L24/32 , H01L21/4853 , H01L21/563 , H01L24/16 , H01L24/81 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/1146 , H01L2224/13099 , H01L2224/16225 , H01L2224/16235 , H01L2224/27013 , H01L2224/29111 , H01L2224/2919 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/81026 , H01L2224/81191 , H01L2224/8121 , H01L2224/814 , H01L2224/81815 , H01L2224/83051 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/0132 , H01L2924/0133 , H01L2924/014 , H01L2924/14 , H01L2924/15311 , H01L2924/1579 , H05K3/3436 , H05K3/3473 , H05K2201/10674 , H05K2203/043 , H05K2203/0475 , Y02P70/613 , H01L2924/00012 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A solder 14 is formed, by a plating method, on a connecting surface 21A and a side surface 21B in a connecting pad 21 of a wiring board 11 which is opposed to a metal bump 13 formed on an electrode pad 31 of a semiconductor chip 12, and subsequently, the solder 14 is molten to form an accumulated solder 15 taking a convex shape on the connecting surface 21A of the connecting pad 21 and the metal bump 13 is then mounted on the connecting surface 21A of the connecting pad 21 on which the accumulated solder is formed, and the accumulated solder 15 and the metal bump 13 are thus bonded to each other.
摘要翻译：在布线基板11的与半导体芯片12的电极焊盘31上形成的金属凸块13相对的连接焊盘21的连接面21A和侧面21B上，通过电镀法形成焊锡14 随后，焊料14熔化，形成在连接焊盘21的连接面21A上呈凸形的积聚焊料15，然后将金属凸块13安装在连接焊盘21的连接面21A上，形成积累的焊料，并且积累的焊料15和金属凸块13因此彼此结合。

82. 发明授权

US07884482B2 Flip-chip mounting substrate 有权
标题翻译：倒装芯片安装基板
公开(公告)号：US07884482B2
公开(公告)日：2011-02-08
申请号：US11957866
申请日：2007-12-17
申请人： Takashi Ozawa , Yasushi Araki , Masatoshi Nakamura , Seiji Sato
发明人： Takashi Ozawa , Yasushi Araki , Masatoshi Nakamura , Seiji Sato
IPC分类号： H01L23/48 , H01L23/52
CPC分类号： H05K1/111 , H01L23/49816 , H01L23/49838 , H01L2224/0554 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/05647 , H01L2224/10175 , H01L2224/814 , H01L2924/00014 , H05K3/3452 , H05K2201/09381 , H05K2201/0989 , H05K2201/09909 , H05K2201/10674 , Y02P70/611 , H01L2924/014 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： It is a flip-chip mounting substrate according to the invention has a wiring pattern in which bonding pads and predetermined parts of lead wires continuously extending from the bonding pads are exposed from an insulating layer or a solder resist. In the flip-chip mounting substrate, exposed parts of the wiring pattern are formed in to a plurality of different shapes. The exposed parts are formed so that the areas of the bonding pads are substantially equal to one another, and that the total areas of predetermined parts of the lead wires continuously extending from the bonding pads are substantially equal to one another.
摘要翻译：根据本发明的倒装芯片安装基板具有布线图案，其中从焊盘连续延伸的焊盘和引线的预定部分从绝缘层或阻焊剂露出。在倒装芯片安装基板中，布线图案的露出部分形成为多种不同的形状。露出的部分形成为使得接合焊盘的面积基本上彼此相等，并且从接合焊盘连续延伸的引线的预定部分的总面积基本相等。

83. 发明授权

US07847417B2 Flip-chip mounting substrate and flip-chip mounting method 有权
标题翻译：倒装芯片安装基板和倒装芯片安装方法
公开(公告)号：US07847417B2
公开(公告)日：2010-12-07
申请号：US11613753
申请日：2006-12-20
申请人： Yasushi Araki , Seiji Sato , Masatoshi Nakamura , Takashi Ozawa
发明人： Yasushi Araki , Seiji Sato , Masatoshi Nakamura , Takashi Ozawa
IPC分类号： H01L23/02
CPC分类号： H05K3/3452 , H01L21/563 , H01L23/3171 , H01L23/49816 , H01L23/49838 , H01L24/02 , H01L24/11 , H01L24/13 , H01L24/81 , H01L2224/0401 , H01L2224/10175 , H01L2224/11 , H01L2224/1132 , H01L2224/13 , H01L2224/13099 , H01L2224/131 , H01L2224/16237 , H01L2224/81192 , H01L2224/81193 , H01L2224/81385 , H01L2224/81801 , H01L2224/81815 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01079 , H01L2924/014 , H05K2201/09381 , H05K2201/099 , H05K2201/10674 , H01L2924/00 , H01L2924/00014
摘要： A solder resist and a central pad to which a central Au bump provided on a semiconductor chip is flip-chip bonded are formed on a substrate main body. In a flip-chip mounting substrate where an underfill resin is provided after the semiconductor chip is mounted, a central opening portion for exposing the central pad is formed in the solder resist, and also, an edge portion forming the central opening portion of the solder resist is partially overlapped with the outer peripheral portion of the central pad.
摘要翻译：在衬底主体上形成阻焊剂和设置在半导体芯片上的中心Au凸块倒装芯片接合的中心焊盘。在安装半导体芯片之后设置底部填充树脂的倒装芯片安装基板中，在阻焊层中形成用于暴露中心焊盘的中心开口部分，并且还形成形成焊料的中心开口部分的边缘部分抗蚀剂部分地与中心焊盘的外周部分重叠。

84. 发明申请

US20100295174A1 WIRING SUBSTRATE AND SEMICONDUCTOR DEVICE 有权
标题翻译：接线基板和半导体器件
公开(公告)号：US20100295174A1
公开(公告)日：2010-11-25
申请号：US12782054
申请日：2010-05-18
申请人： Takashi Ozawa , Seiji Sato
发明人： Takashi Ozawa , Seiji Sato
IPC分类号： H01L23/485
CPC分类号： H01L24/17 , H01L21/563 , H01L23/49838 , H01L23/544 , H01L24/81 , H01L2223/54426 , H01L2223/54473 , H01L2224/1134 , H01L2224/13144 , H01L2224/16237 , H01L2224/81121 , H01L2224/81193 , H01L2224/81801 , H01L2224/83102 , H01L2224/92125 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01079 , H01L2924/00014 , H01L2224/13099
摘要： A wiring substrate includes: a semiconductor chip on which a plurality of bumps are mounted, and a plurality of connection pads which are joined to the bumps mounted on the semiconductor chip in a flip chip method, wherein the connection pads of a peripheral portion of the wiring substrate are formed in a non-solder mask defined structure, and the connection pads of a center portion of the wiring substrate are formed in a solder mask defined structure.
摘要翻译：布线基板包括：半导体芯片，其上安装有多个凸块;以及多个连接焊盘，其以倒装芯片方法接合到安装在半导体芯片上的凸块，其中，连接焊盘的周边部分布线基板形成为非阻焊掩模限定结构，并且布线基板的中心部分的连接焊盘形成为焊料掩模限定结构。

85. 发明授权

US07510605B2 Dye ink, ink jet recording method, ink sheet, color toner and color filter 有权
标题翻译：染料油墨，喷墨记录方法，油墨纸，彩色调色剂和滤色片
公开(公告)号：US07510605B2
公开(公告)日：2009-03-31
申请号：US10573117
申请日：2005-02-03
申请人： Toru Harada , Yoshiharu Yabuki , Takashi Ozawa , Keiichi Tateishi
发明人： Toru Harada , Yoshiharu Yabuki , Takashi Ozawa , Keiichi Tateishi
IPC分类号： C09D11/00 , C09D11/02 , C09B31/143
CPC分类号： B41M5/385 , B41M5/388 , C09B33/12 , C09B35/03 , C09B35/34 , C09D11/328 , G03G9/091 , G03G9/0914 , G03G9/0922
摘要： To provide a dye which has a good hue, which can form an image showing a high fastness under various using conditions and environmental conditions, and which is particularly suited for an ink, the dye is represents by formula (1):wherein R1 and R2 each independently represents a monovalent group, Z represents a nitrogen atom or a carbon atom to which a hydrogen atom or a monovalent group is bonded, and M represents a hydrogen atom or a cation, provided that the dye has two azo groups.
摘要翻译：为了提供具有良好色调的染料，其可以在各种使用条件和环境条件下形成显示高牢度的图像，并且特别适合于油墨，染料由式（1）表示：其中R1和R2 各自独立地表示一价基团，Z表示氮原子或氢原子或一价基团键合的碳原子，M表示氢原子或阳离子，条件是该染料具有两个偶氮基。

86. 发明申请

US20080188040A1 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE 有权
标题翻译：制造半导体器件的方法
公开(公告)号：US20080188040A1
公开(公告)日：2008-08-07
申请号：US12021664
申请日：2008-01-29
申请人： Takashi Ozawa , Seiji Sato , Masao Nakazawa , Mitsuyoshi Imai , Masatoshi Nakamura , Kei Imafuji
发明人： Takashi Ozawa , Seiji Sato , Masao Nakazawa , Mitsuyoshi Imai , Masatoshi Nakamura , Kei Imafuji
IPC分类号： H01L21/60
CPC分类号： H01L24/32 , H01L21/4853 , H01L21/563 , H01L24/16 , H01L24/81 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/1146 , H01L2224/13099 , H01L2224/16225 , H01L2224/16235 , H01L2224/27013 , H01L2224/29111 , H01L2224/2919 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/81026 , H01L2224/81191 , H01L2224/8121 , H01L2224/814 , H01L2224/81815 , H01L2224/83051 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/0132 , H01L2924/0133 , H01L2924/014 , H01L2924/14 , H01L2924/15311 , H01L2924/1579 , H05K3/3436 , H05K3/3473 , H05K2201/10674 , H05K2203/043 , H05K2203/0475 , Y02P70/613 , H01L2924/00012 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A solder 14 is formed, by a plating method, on a connecting surface 21A and a side surface 21B in a connecting pad 21 of a wiring board 11 which is opposed to a metal bump 13 formed on an electrode pad 31 of a semiconductor chip 12, and subsequently, the solder 14 is molten to form an accumulated solder 15 taking a convex shape on the connecting surface 21A of the connecting pad 21 and the metal bump 13 is then mounted on the connecting surface 21A of the connecting pad 21 on which the accumulated solder is formed, and the accumulated solder 15 and the metal bump 13 are thus bonded to each other.
摘要翻译：在布线基板11的与半导体芯片12的电极焊盘31上形成的金属凸块13相对的连接焊盘21的连接面21A和侧面21B上，通过电镀法形成焊锡14 随后，焊料14熔化，形成在连接焊盘21的连接面21A上呈凸形的积聚焊料15，然后将金属凸块13安装在连接焊盘21的连接面21A上，形成积累的焊料，并且积累的焊料15和金属凸块13因此彼此结合。

87. 发明授权

US07370953B2 Inkjet recording ink 有权
标题翻译：喷墨记录油墨
公开(公告)号：US07370953B2
公开(公告)日：2008-05-13
申请号：US10771464
申请日：2004-02-05
申请人： Takashi Ozawa , Naotaka Wachi
发明人： Takashi Ozawa , Naotaka Wachi
IPC分类号： C09D11/00
CPC分类号： C09D11/328 , C09D11/40
摘要： An inkjet recording ink includes at least one yellow-azo dye having specific properties or a specific structure dissolved and/or dispersed in an aqueous medium and containing a water-miscible organic solvent having a specific solubility with respect to dye.
摘要翻译：喷墨记录油墨包括至少一种具有特定性质或特定结构的黄色偶氮染料，其溶解和/或分散在水性介质中并且含有相对于染料具有特定溶解度的水混溶性有机溶剂。

88. 发明申请

US20070208785A1 Information processing system, information processing method and information processing program 失效
标题翻译：信息处理系统，信息处理方法和信息处理程序
公开(公告)号：US20070208785A1
公开(公告)日：2007-09-06
申请号：US11518460
申请日：2006-09-11
申请人： Naoki Hayashi , Hiroyuki Hotta , Minoru Koshimizu , Yoshitsugu Hirose , Tsutomu Ishii , Shigehiko Sasaki , Masahiro Sato , Takashi Ozawa
发明人： Naoki Hayashi , Hiroyuki Hotta , Minoru Koshimizu , Yoshitsugu Hirose , Tsutomu Ishii , Shigehiko Sasaki , Masahiro Sato , Takashi Ozawa
IPC分类号： G06F17/30
CPC分类号： G11B27/11 , G06Q10/10 , Y10S707/99954
摘要： An information processing system for management of various pieces of information, the information processing system includes: a plurality of display record media, each having a unique identifier; an information selection section that selects information to be displayed; an information rewrite section that rewritably writes the information; a manipulation detection section that detects a selective manipulation of a user on the display record medium; a history storage section that records a history of the information and a history of the manipulations in association with a unique identifier of the display record medium, respectively; a manipulation history determination section for a user to determine any manipulation history out of a list of the histories of the manipulations; and an information search section that searches for at least one of a history of the information, a history of other manipulations and a unique identifier of the display record medium.
摘要翻译：一种用于管理各种信息的信息处理系统，所述信息处理系统包括：多个显示记录介质，每个具有唯一标识符; 信息选择部，选择要显示的信息; 信息重写部分，可重写地写入信息; 操作检测部，其检测所述显示记录介质上的用户的选择性操作; 历史存储部分，其分别与所述显示记录介质的唯一标识符相关联地记录所述信息的历史和所述操作的历史; 操作历史确定部分，用于用户从所述操作的历史列表中确定任何操纵历史; 以及信息搜索部，其搜索信息的历史，其他操作的历史和显示记录介质的唯一标识符中的至少一个。

89. 发明申请

US20060156345A1 Digital television apparatus 审中-公开
标题翻译：数字电视机
公开(公告)号：US20060156345A1
公开(公告)日：2006-07-13
申请号：US11312767
申请日：2005-12-21
申请人： Takashi Ozawa
发明人： Takashi Ozawa
IPC分类号： H04N5/445 , G06F3/00 , G06F13/00
CPC分类号： H04N21/4532 , H04N5/44543 , H04N7/163 , H04N21/4821 , H04N21/485
摘要： This invention provides a digital television apparatus adapted to exclude channels of broadcast programs, in which the viewer has no interest, from an EPG display and improve EPG usability by providing short scroll capability through the EPG. The digital television apparatus includes a display device, an operating unit by which operating signals for various commands are input, a preset information storage in which channel skip information for channels is set, and an EPG information processing unit which, when the operating unit is operated to display an EPG, on the basis of an operating signal from the operation unit, selects channels which are set not to be skipped in the preset information storage and causes the display unit to display the EPG for the selected channels. The apparatus displays an EPG for only channels set not to be skipped on the display device.
摘要翻译：本发明提供了一种数字电视设备，其适于从EPG显示器中排除观众不感兴趣的广播节目的频道，并通过提供通过EPG的短滚动功能来改善EPG的可用性。数字电视装置包括显示装置，通过其输入各种命令的操作信号的操作单元，设置有通道的信道跳过信息的预设信息存储单元，以及操作单元被操作时的EPG信息处理单元为了显示EPG，基于来自操作单元的操作信号，选择在预设信息存储器中设置为不被跳过的频道，并使显示单元显示所选频道的EPG。该装置仅在显示装置上显示不被跳过的通道的EPG。

90. 发明申请

US20060007756A1 Semiconductor memory device and control method for semiconductor memory device 有权
公开(公告)号：US20060007756A1
公开(公告)日：2006-01-12
申请号：US11008274
申请日：2004-12-10
申请人： Takashi Ozawa
发明人： Takashi Ozawa
IPC分类号： G11C7/06
CPC分类号： G11C17/12 , G11C7/06 , G11C8/16 , G11C2207/065
摘要： Provided is a semiconductor memory device using a single-bit line method that determines read operation timing in accordance with operation of a replica bit line. Further provided is a control method for the semiconductor memory device. Even when a transistor property fluctuation has occurred, the semiconductor memory device and the control method are capable of preventing, for example, increases in access time and circuit size and concurrently capable of reducing the occurrence probability of data readout error. The gate lengths of replica memory cell transistors are set as being values greater than the gate length of memory cell transistors. Thereby, a distribution center of a current drive capability distribution of the replica memory cell transistors is set lower than a distribution center of a current drive capability distribution of the memory cell transistors. Consequently, an occurrence probability of a delay in a voltage-fall start time on a regular data line can be reduced to be lower in comparison to a transmission timing of a latch control signal.

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