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    • 83. 发明申请
    • PRESSURE SENSOR MODULE AND ELECTRONIC COMPONENT
    • 压力传感器模块和电子元件
    • US20120036936A1
    • 2012-02-16
    • US13281959
    • 2011-10-26
    • Satoshi YamamotoHirokazu Hashimoto
    • Satoshi YamamotoHirokazu Hashimoto
    • G01L7/08
    • G01L9/0054G01L19/0069G01L19/148H01L2224/05001H01L2224/16225H01L2924/07811H01L2924/00
    • A pressure sensor module includes a pressure sensor, a bump, and a laminated substrate. The pressure sensor includes a semiconductor substrate; a cavity; a pressure-sensitive element; and a conductive section. The cavity is disposed inside the semiconductor substrate such that a thin-plate region of the semiconductor substrate is provided and the thin-plate region being defined as a diaphragm. The pressure-sensitive element is arranged at the diaphragm. The conductive section is electrically connected to the pressure-sensitive element and disposed on the face of the semiconductor substrate at a region excluding the diaphragm. The bump is electrically connected to the conductive section. The laminated substrate includes a wiring base material electrically connected to the pressure sensor via the bump. The wiring base material is disposed inside the laminated substrate. A face of the wiring base material is electrically connected to the bump and has an exposed area from the laminated substrate.
    • 压力传感器模块包括压力传感器,凸块和层压基板。 压力传感器包括半导体衬底; 一个空腔 压敏元件; 和导电部分。 空腔设置在半导体衬底的内部,使得设置半导体衬底的薄板区域,并且将薄板区域定义为膜片。 压敏元件设置在隔膜上。 导电部分电连接到压敏元件并且设置在除了隔膜之外的区域的半导体衬底的表面上。 凸块电连接到导电部分。 层压基板包括经由凸块与压力传感器电连接的布线基材。 配线基材配置在层叠基板的内部。 布线基材的表面电连接到凸块并具有来自层叠基板的露出区域。
    • 86. 发明申请
    • METHOD FOR PRODUCING MOLDED ARTICLE
    • 生产模制品的方法
    • US20110104380A1
    • 2011-05-05
    • US12997194
    • 2009-06-09
    • Atsushi YusaTetsuya AnoSatoshi YamamotoToshiyuki Ogano
    • Atsushi YusaTetsuya AnoSatoshi YamamotoToshiyuki Ogano
    • B05D1/18B29C45/18
    • B29C45/1704B29C44/348B29C45/1642
    • The present invention provides a method for producing a molded article which enables dissolution of a desired amount of a subject material in a molten resin without any limitation by the solubility of a high-pressure carbon dioxide in the molten resin and which is therefore suitable for commercial production of molded articles. The present invention pertains to a method for producing a molded article by molding a molten resin, and this method is characterized by including steps of supplying a high-pressure carbon dioxide and a subject material dissolved therein, into the molten resin; kneading the molten resin into which the high-pressure carbon dioxide and the subject material have been supplied; and exhausting the high-pressure carbon dioxide from the kneaded molten resin.
    • 本发明提供了一种能够将所需量的主题材料溶解在熔融树脂中的模塑制品的方法,而不受高压二氧化碳在熔融树脂中的溶解度的限制,因此适用于商业 模制品的生产。 本发明涉及一种通过模制熔融树脂来生产模制品的方法,该方法的特征在于包括将溶解在其中的高压二氧化碳和被摄体材料供给到熔融树脂中的步骤; 捏合已经供应高压二氧化碳和主体材料的熔融树脂; 并从捏合的熔融树脂中排出高压二氧化碳。
    • 87. 发明申请
    • PROCESS FOR PRODUCING COMPOSITE MATERIAL COMPRISING RESIN MOLDED PRODUCT
    • 用于生产包含树脂模制产品的复合材料的方法
    • US20110020550A1
    • 2011-01-27
    • US12921912
    • 2009-03-12
    • Hironori OtaAtsushi YusaSatoshi Yamamoto
    • Hironori OtaAtsushi YusaSatoshi Yamamoto
    • C23C18/28C23C18/54C23C18/31
    • C23C18/30C08J7/06C23C18/1651C23C18/1653C23C18/1682C23C18/1685C23C18/2073C23C18/31
    • The present invention provides a method for allowing a metal complex to stably penetrate into a polymer and immobilizing the metal complex in the polymer by a low temperature treatment, in a batch processing for a plating pre-treatment wherein the metal complex is allowed to penetrate into the polymer with the use of high-pressure carbon dioxide. In particular, the present invention provides a method for producing a composite material containing a resin molded product, characterized in that a reducing agent is brought into contact with the resin molded product so as to allow the reducing agent to penetrate into the resin molded product, and in that high-pressure carbon dioxide having an organic metal complex dissolved therein is brought into contact with the resin molded product into which said reducing agent has penetrated, so as to immobilize the organic metal complex in the resin molded product by the reducing agent.
    • 本发明提供一种允许金属络合物稳定地渗透到聚合物中并通过低温处理将金属络合物固定在聚合物中的方法,其中允许金属络合物渗入的电镀预处理的间歇式处理 该聚合物使用高压二氧化碳。 特别地,本发明提供一种含有树脂成型体的复合材料的制造方法,其特征在于,与所述树脂成形体接触还原剂,使所述还原剂渗透到所述树脂成形体中, 并且将其中溶解有有机金属配合物的高压二氧化碳与所述还原剂渗入的树脂成型体接触,从而通过还原剂将有机金属配合物固定在树脂成型体中。
    • 90. 发明申请
    • PROCESS FOR PRODUCING PHOTORESIST PATTERN
    • 生产光电子图案的工艺
    • US20100273112A1
    • 2010-10-28
    • US12763357
    • 2010-04-20
    • Mitsuhiro HataSatoshi YamamotoYusuke Fuji
    • Mitsuhiro HataSatoshi YamamotoYusuke Fuji
    • G03F7/20
    • G03F7/40G03F7/0035G03F7/0045G03F7/0046G03F7/0397G03F7/091
    • The present invention provides a process for producing a photoresist pattern comprising the following steps (A) to (D): (A) a step of forming the first photoresist film on a substrate using the first photoresist composition comprising a resin comprising a structural unit having an acid-labile group in its side chain and being itself insoluble or poorly soluble in an alkali aqueous solution but becoming soluble in an alkali aqueous solution by the action of an acid, an acid generator, and a cross-linking agent, exposing the first photoresist film to radiation followed by developing the exposed first photoresist film to obtain the first photoresist pattern, (B) a step of baking the obtained first photoresist pattern at 190 to 250° C. for 10 to 60 seconds, (C) a step of forming the second photoresist film on the substrate on which the first photoresist pattern has been formed using the second photoresist composition, exposing the second photoresist film to radiation, and (D) a step of developing the exposed second photoresist film to obtain the second photoresist pattern.
    • 本发明提供一种制造光致抗蚀剂图案的方法,包括以下步骤(A)至(D):(A)使用包含树脂的第一光致抗蚀剂组合物在基板上形成第一光致抗蚀剂膜的步骤,所述树脂包括具有 其侧链酸性不稳定基团本身不溶于或难溶于碱水溶液,但通过酸,酸发生剂和交联剂的作用变得可溶于碱性水溶液中,使第一 将曝光的第一光致抗蚀剂膜显影以获得第一光致抗蚀剂图案,(B)在190至250℃下烘烤获得的第一光致抗蚀剂图案10至60秒的步骤,(C)步骤 在所述基板上形成所述第二光致抗蚀剂膜,使用所述第二光致抗蚀剂组合物在其上形成所述第一光致抗蚀剂图案,将所述第二光致抗蚀剂膜暴露于辐射,以及(D) 旋转曝光的第二光致抗蚀剂膜以获得第二光致抗蚀剂图案。