会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 83. 发明申请
    • Methods of fabricating magnetic write heads with side and trailing shield structures
    • 制造具有侧面和后面屏蔽结构的磁性写入头的方法
    • US20060000794A1
    • 2006-01-05
    • US10881278
    • 2004-06-30
    • Quang Le
    • Quang Le
    • B44C1/22C03C15/00
    • G11B5/1278G11B5/112G11B5/3116G11B5/3146G11B5/315Y10T29/49043Y10T29/49044Y10T29/49046Y10T29/49052
    • One illustrative method of fabricating magnetic write heads includes the acts of forming a pole tip structure at least partially over a magnetic shaping layer; forming non-magnetic materials around and over the pole tip structure; etching side shield voids within the non-magnetic materials adjacent the pole tip structure while leaving non-magnetic materials around the pole tip structure; electroplating side shield materials within the side shield voids; and forming, over the non-magnetic materials above the pole tip structure, trailing shield materials which connect with the side shield materials adjacent the pole tip structure. Preferably, the non-magnetic materials are etched with use of a reactive ion etching (RIE) process. For etching the side shield voids and electroplating the side shield materials, the method may include the additional acts of forming a stop layer over the non-magnetic materials; forming a resist layer over the stop layer; patterning side shield openings through the resist layer; etching the side shield voids in the non-magnetic materials with the patterned resist layer in place; removing the patterned resist layer; electroplating the side shield materials over the non-magnetic materials and within the side shield voids; and performing a chemical-mechanical polishing (CMP) until the stop layer is reached.
    • 一种制造磁性写入头的说明性方法包括至少部分地在磁性成形层上形成极尖结构的动作; 在极尖结构周围形成非磁性材料; 在邻近极尖结构的非磁性材料内蚀刻侧屏蔽空隙,同时在磁极端结构周围留下非磁性材料; 电镀侧屏蔽材料在侧屏蔽空隙内; 并且在磁极末端结构上方的非磁性材料上形成与屏蔽材料相邻的靠近极端结构的后屏蔽材料。 优选地,使用反应离子蚀刻(RIE)工艺来蚀刻非磁性材料。 为了蚀刻侧屏蔽空隙并对侧屏蔽材料进行电镀,该方法可以包括在非磁性材料上形成停止层的附加动作; 在阻挡层上形成抗蚀剂层; 图案化侧屏蔽开口穿过抗蚀剂层; 在图案化的抗蚀剂层就位的情况下蚀刻非磁性材料中的侧屏蔽空隙; 去除图案化的抗蚀剂层; 将侧屏蔽材料电镀在非磁性材料上并在侧屏蔽空隙内; 并进行化学机械抛光(CMP)直到达到停止层。
    • 84. 发明申请
    • Methods for fabricating read sensor for magnetic heads with reduced read track width
    • 用于制造磁头读取传感器的方法,读取磁道宽度减小
    • US20050277299A1
    • 2005-12-15
    • US10856679
    • 2004-05-28
    • Quang LeSue Zhang
    • Quang LeSue Zhang
    • G11B5/31H01L21/311H01L21/314
    • C23C16/44G11B5/3163G11B5/3169H01L21/3146
    • The fabrication of the read head sensor components where chemical mechanical polishing (CMP) stop layer is deposited above the sensor layers, a first reactive ion etch (RIE) layer and a second RIE layer are deposited, where the second RIE layer is etchable with a different ion species than the first RIE layer. A stencil layer is then deposited and patterned to create an etching stencil having the desired magnetic read track width of the sensor. An RIE step is then conducted in which the second RIE layer is etched. An RIE step for the first RIE layer is then conducted with a different ion species. Thereafter, the sensor layers are milled where the remaining portions of the first and second RIE layers act as a milling mask. A CMP assisted liftoff step is then conducted in which the remaining portions of the ion milling mask are removed.
    • 沉积化学机械抛光(CMP)停止层沉积在传感器层上方,第一反应离子蚀刻(RIE)层和第二RIE层的读取头传感器部件的制造,其中第二RIE层可以用 不同的离子种类比第一个RIE层。 然后沉积和图案化模板层以产生具有传感器的期望磁读取磁道宽度的蚀刻模版。 然后进行RIE步骤,其中蚀刻第二RIE层。 然后用不同的离子种类进行第一RIE层的RIE步骤。 此后,将第一和第二RIE层的剩余部分用作铣削掩模的传感器层进行研磨。 然后进行CMP辅助剥离步骤,其中除去离子铣削掩模的剩余部分。