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    • 82. 发明申请
    • Low leakage heterojunction vertical transistors and high performance devices thereof
    • 低漏极异质结垂直晶体管及其高性能器件
    • US20070148939A1
    • 2007-06-28
    • US11317285
    • 2005-12-22
    • Jack ChuQiqing Ouyang
    • Jack ChuQiqing Ouyang
    • H01L21/3205
    • H01L21/823885H01L21/823807H01L29/045H01L29/161H01L29/165H01L29/778H01L29/7781H01L29/7782H01L29/7789H01L29/7828H01L29/7848H01L29/78642
    • A method for forming and the structure of a vertical channel of a field effect transistor, a field effect transistor and CMOS circuitry are described incorporating a drain, body and source region on a sidewall of a vertical single crystal semiconductor structure wherein a hetero-junction is formed between the source and body of the transistor, wherein the source region and channel are independently lattice strained with respect the body region and wherein the drain region contains a carbon doped region to prevent the diffusion of dopants (i.e., B and P) into the body. The invention reduces the problem of short channel effects such as drain induced barrier lowering and the leakage current from the source to drain regions via the hetero-junction and while independently permitting lattice strain in the channel region for increased mobility via choice of the semiconductor materials. The problem of scalability of the gate length below 100 nm is overcome by the heterojunction between the source and body regions.
    • 描述了一种用于形成场效应晶体管,场效应晶体管和CMOS电路的垂直沟道结构的方法,其在垂直单晶半导体结构的侧壁上结合有漏极,主体和源极区域,其中异质结为 形成在晶体管的源极和主体之间,其中源极区域和沟道独立地相对于体区域进行晶格应变,并且其中漏极区域包含碳掺杂区域以防止掺杂剂(即,B和P)扩散到 身体。 本发明减少了短沟道效应的问题,例如漏极引起的栅极降低和从源极到漏极区域的漏电流经由异质结,并且同时独立地允许沟道区域中的晶格应变,以通过选择半导体材料增加迁移率。 栅极长度低于100nm的可扩展性的问题通过源极和体区之间的异质结来克服。
    • 89. 发明申请
    • Structure for and method of fabricating a high-speed CMOS-compatible Ge-on-insulator photodetector
    • 制造高速CMOS兼容的绝缘体上的光电探测器的结构和方法
    • US20050184354A1
    • 2005-08-25
    • US10785894
    • 2004-02-24
    • Jack ChuGabriel DehlingerAlfred GrillSteven KoesterQiging OuyangJeremy Schaub
    • Jack ChuGabriel DehlingerAlfred GrillSteven KoesterQiging OuyangJeremy Schaub
    • H01L31/101H01L31/075
    • H01L31/101
    • The invention addresses the problem of creating a high-speed, high-efficiency photodetector that is compatible with Si CMOS technology. The structure consists of a Ge absorbing layer on a thin SOI substrate, and utilizes isolation regions, alternating n- and p-type contacts, and low-resistance surface electrodes. The device achieves high bandwidth by utilizing a buried insulating layer to isolate carriers generated in the underlying substrate, high quantum efficiency over a broad spectrum by utilizing a Ge absorbing layer, low voltage operation by utilizing thin a absorbing layer and narrow electrode spacings, and compatibility with CMOS devices by virtue of its planar structure and use of a group IV absorbing material. The method for fabricating the photodetector uses direct growth of Ge on thin SOI or an epitaxial oxide, and subsequent thermal annealing to achieve a high-quality absorbing layer. This method limits the amount of Si available for interdiffusion, thereby allowing the Ge layer to be annealed without causing substantial dilution of the Ge layer by the underlying Si.
    • 本发明解决了与Si CMOS技术兼容的高速高效光电探测器的问题。 该结构由薄的SOI衬底上的Ge吸收层组成,并且使用隔离区,交替的n型和p型接触以及低电阻表面电极。 该器件通过利用掩埋绝缘层来隔离衬底中产生的载流子,通过利用Ge吸收层在宽谱上具有高量子效率,通过利用薄的吸收层和窄电极间隔的低电压操作以及兼容性来实现高带宽 通过其平面结构和使用IV族吸收材料的CMOS器件。 用于制造光电检测器的方法使用在薄SOI或外延氧化物上的Ge的直接生长,以及随后的热退火以实现高质量的吸收层。 该方法限制可用于相互扩散的Si的量,从而允许Ge层退火,而不会导致Ge层被下面的Si大量稀释。