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    • 83. 发明公开
    • VERFAHREN ZUM HERSTELLEN EINES LASERCHIPS
    • EP3192135A1
    • 2017-07-19
    • EP15760121.2
    • 2015-08-27
    • OSRAM Opto Semiconductors GmbH
    • GERHARD, SvenADLHOCH, ThomasVEIT, ThomasLELL, AlfredPFEIFFER, JoachimMUELLER, JensEICHLER, Christoph
    • H01S5/02H01S5/22
    • H01S5/0202H01S5/0203H01S5/22H01S5/2201
    • The invention relates to a method for producing a laser chip (140) comprising steps for providing a semiconductor wafer (100) having a top side (101) and a bottom side (102), wherein the semiconductor wafer has a plurality of integrated laser diode structures (141), which are arranged one after the other along a defined fracture direction (10), for creating a plurality of recesses (200) on the top side of the semiconductor wafer, which recesses are arranged one after the other along the fracture direction, wherein each recess has a front boundary surface (210) and a rear boundary surface (220) following one another in the fracture direction, wherein the rear boundary surface is tilted by an angle between 95° and 170° in relation to the top side of the semiconductor wafer in the case of at least one recess, and for fracturing the semiconductor wafer in the fracture direction at a fracture plane that is oriented perpendicularly to the top side of the semiconductor wafer and that extends through the recesses.
    • 本发明涉及一种用于制造激光芯片(140)的方法,其包括用于提供具有顶侧(101)和底侧(102)的半导体晶片(100)的步骤,其中所述半导体晶片具有多个集成激光二极管 (141),其沿着限定的断裂方向(10)一个接一个地布置,用于在所述半导体晶片的顶侧上形成多个凹部(200),所述凹部沿着所述断裂一个接一个地布置 其中每个凹部具有在断裂方向上彼此接连的前边界表面(210)和后边界表面(220),其中后边界表面相对于顶部倾斜95°与170°之间的角度 在半导体晶片的至少一个凹部的情况下,在断裂方向上在垂直于半导体晶片的顶面定向的断裂面处断裂半导体晶片, 穿过凹处。
    • 85. 发明公开
    • HALBLEITERLICHTQUELLE MIT EINER PRIMÄRSTRAHLUNGSQUELLE UND EINEM LUMINESZENZKONVERSIONSELEMENT
    • HALBLEITERLICHTQUELLE MIT EINERPRIMÄRSTRAHLUNGSQUELLEUND EINEM LUMINESZENZKONVERSIONSELEMENT
    • EP2198465A1
    • 2010-06-23
    • EP08801322.2
    • 2008-09-11
    • OSRAM Opto Semiconductors GmbH
    • OTT, HubertLELL, AlfredTAUTZ, SönkeSTRAUSS, UweBAUMANN, FrankPETERSEN, Kirstin
    • H01L33/00F21K7/00
    • F21K9/64F21V9/30F21Y2115/10H01L33/507H01L33/58H01L33/60
    • The invention relates to a semiconductor light source having a primary radiation source (1) that, in operation, emits electromagnetic primary radiation (5) in a first wavelength range and having a luminescence conversion module (2) into which primary radiation (5) emitted by the primary radiation source (1) is coupled. The luminescence conversion module (2) comprises a luminescence conversion element (6) that absorbs primary radiation (5) from the first wavelength range by means of a luminescent material and emits electromagnetic secondary radiation (15) in a second wavelength range. The luminescence conversion element (6) is disposed at a distance from the primary radiation source (1) on a cooling body (3). Said luminescence conversion element (6) comprises a reflector surface (7, 71, 72) that reflects back primary radiation (5) traveling into the luminescence conversion element (6) but not absorbed thereby and/or reflects secondary radiation (15) in the direction of a light decoupling surface (601) of the luminescence conversion element (6).
    • 提供一种半导体光源,所述半导体光源具有主辐射源(1),当所述半导体光源被操作时,所述主辐射源(1)在第一波长范围内发射电磁初级辐射(5),并且具有发光转换模块 ),其中馈送由主辐射源(1)发射的初级辐射(5)。 发光转换模块(2)包含发光转换元件(6),其通过发光材料从第一波长范围吸收主辐射(5)并在第二波长范围内发射电磁次级辐射(15)。 发光转换元件(6)布置在距离主辐射源(1)一定距离处的散热器(3)上。 它具有反射回到发光转换元件(6)的主要辐射(5)的反射器表面(7,71,72),其通过发光转换元件(6)并且不被其吸收和/或反射次级辐射 15)在发光转换元件(6)的光耦合表面(601)的方向上。