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    • 81. 发明申请
    • PHASE CHANGE MEMORY PROGRAMMING METHOD WITHOUT RESET OVER-WRITE
    • 相位改变记忆编程方法,无复位写入
    • US20100002499A1
    • 2010-01-07
    • US12166934
    • 2008-07-02
    • Matthew J. BreitwischChung H. Lam
    • Matthew J. BreitwischChung H. Lam
    • G11C11/00G11C7/00
    • G11C13/0069G11C13/0004G11C13/0064G11C2013/0076G11C2013/0078G11C2013/0092
    • A method for programming a phase change memory device that avoids RESET overwrite. The method partially comprised of applying a reset write current pulse through the phase change memory element such that the reset write current pulse produces a voltage drop across the phase change memory element less than a reset threshold voltage and greater than a set threshold voltage. The reset write current pulse writing a RESET state to the phase change memory cell. The method additionally comprised of applying a set write current pulse through the phase change memory element such that the set write current pulse produces a voltage drop across the phase change memory element that is equal to or greater than the reset threshold voltage. The set write current pulse writing a SET state to the phase change memory cell.
    • 一种编程避免RESET重写的相变存储器件的方法。 所述方法部分地包括通过将所述复位写入电流脉冲施加到所述相变存储元件,使得所述复位写入电流脉冲在所述相变存储元件上产生小于复位阈值电压并大于设定阈值电压的电压降。 复位写入电流脉冲将RESET状态写入相变存储单元。 该方法还包括通过相变存储元件施加设置的写入电流脉冲,使得所设置的写入电流脉冲在相变存储器元件上产生等于或大于复位阈值电压的电压降。 该设定的写入电流脉冲将SET状态写入相变存储单元。
    • 85. 发明申请
    • SELF-CONVERGING BOTTOM ELECTRODE RING
    • 自适应底部电极环
    • US20090212272A1
    • 2009-08-27
    • US12036372
    • 2008-02-25
    • Matthew J. BreitwischChung H. LamHsiang-Lan Lung
    • Matthew J. BreitwischChung H. LamHsiang-Lan Lung
    • H01L21/06H01L47/00
    • H01L45/06H01L45/1233H01L45/126H01L45/144H01L45/1675H01L45/1683Y10S438/90
    • A method and memory cell including self-converged bottom electrode ring. The method includes forming a step spacer, a top insulating layer, an intermediate insulating layer, and a bottom insulating layer above a substrate. The method includes forming a step spacer within the top insulating layer and the intermediate insulating layer. The step spacer size is easily controlled. The method also includes forming a passage in the bottom insulating layer with the step spacer as a mask. The method includes forming bottom electrode ring within the passage comprising a cup-shaped outer conductive layer within the passage and forming an inner insulating layer within the cup-shaped outer conductive layer. The method including forming a phase change layer above the bottom electrode ring and a top electrode above the bottom electrode ring.
    • 一种包括自会聚底电极环的方法和存储单元。 该方法包括在衬底上形成台阶间隔物,顶部绝缘层,中间绝缘层和底部绝缘层。 该方法包括在顶部绝缘层和中间绝缘层内形成台阶间隔物。 台阶垫片尺寸易于控制。 该方法还包括在步骤间隔物作为掩模的底部绝缘层中形成通道。 所述方法包括在所述通道内形成底部电极环,所述通道包括所述通道内的杯形外部导电层,并且在所述杯形外部导电层内形成内部绝缘层。 该方法包括在底部电极环上方形成相变层和在底部电极环上方形成顶部电极。
    • 90. 发明授权
    • Phase change memory cell with electrode
    • 带电极的相变存储单元
    • US07485487B1
    • 2009-02-03
    • US11970207
    • 2008-01-07
    • Matthew J. BreitwischRoger W. CheekEric A. JosephChung H. LamAlejandro G. Schrott
    • Matthew J. BreitwischRoger W. CheekEric A. JosephChung H. LamAlejandro G. Schrott
    • H01L21/00
    • H01L45/06H01L45/1233H01L45/144H01L45/1683H01L45/1691
    • The present invention in one embodiment provides a method of forming a memory device including providing a first dielectric layer including at least one via containing a metal stud; providing a second dielectric layer atop the first dielectric layer; recessing the metal stud to expose a sidewall of the via; etching the sidewall of the via in the first dielectric layer with a isotropic etch step to produce an undercut region extending beneath a portion of the second dielectric layer; forming a conformal insulating layer on at least the portion of the second dielectric layer overlying the undercut region to provide a keyhole; etching the conformal insulating layer with an anisotropic etch to provide a collar that exposes the metal stud; forming a barrier metal within the collar in contact with the metal stud; and forming a phase change material in contact with the barrier metal.
    • 本发明在一个实施例中提供了一种形成存储器件的方法,该存储器件包括:提供包括至少一个通孔的第一介电层,所述通孔包含金属螺柱; 在所述第一电介质层的顶部提供第二电介质层; 使金属螺柱凹陷以暴露通孔的侧壁; 用各向同性蚀刻步骤蚀刻第一介电层中的通孔的侧壁,以产生在第二介电层的一部分下方延伸的底切区域; 在覆盖所述底切区域的所述第二介电层的至少一部分上形成保形绝缘层以提供锁眼; 用各向异性蚀刻蚀刻保形绝缘层以提供露出金属螺柱的套环; 在所述套环内形成与所述金属螺栓接触的阻挡金属; 并形成与阻挡金属接触的相变材料。