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    • 81. 发明授权
    • Ethylene-alpha-olefin-polyene random copolymer rubber
    • 乙烯-α-烯烃 - 多烯无规共聚物橡胶
    • US4510303A
    • 1985-04-09
    • US492244
    • 1983-05-06
    • Hidekuni OdaSyuji MinamiHiroshi InoueAkira MatsudaYohzoh Yamamoto
    • Hidekuni OdaSyuji MinamiHiroshi InoueAkira MatsudaYohzoh Yamamoto
    • C08F210/00C08F4/00C08F4/60C08F210/16C08F210/18C08L23/16
    • C08F210/18
    • An ethylene-alpha-olefin-polyene random copolymer rubber comprising ethylene, an alpha-olefin having 3 to 10 carbon atoms and a polyene, wherein (A) a molar ratio of ethylene/alpha-olefin is 55/45 to 95/5, (B) the polyene is a mixture of 5-ethylidene-2-norbornene (ENB) and 5-vinyl-2-norbornene (VNB) in a molar ratio of ENB/VNB of 1/1 to 20/1, (C) an iodine value of the copolymer rubber is 2 to 40, (D) an intrinsic viscosity [.eta.] of the copolymer rubber is 1.0 to 6.0 dl/g measured in decalin at 135.degree. C., and (E) g.sub..eta. * defined by a ratio of the intrinsic viscosity [.eta.] to an intrinsic viscosity [.eta.]l of a linear ethylene-propylene random copolymer having an ethylene content of 70 mole % and the same weight-average molecular weight determined by a light-scattering method as that of the copolymer rubber is 0.2 to 0.9. Also a process for preparing this random copolymer rubber and vulcanizate derived from the same are also disclosed. This random copolymer rubber has an excellent extrudability and a fast cure rate and provides a vulcanizate having high tensile strength.
    • 包含乙烯,具有3-10个碳原子的α-烯烃和多烯的乙烯-α-烯烃 - 多烯无规共聚物橡胶,其中(A)乙烯/α-烯烃的摩尔比为55/45至95/5, (B)多烯是ENB / VNB摩尔比为1/1至20/1的5-亚乙基-2-降冰片烯(ENB)和5-乙烯基-2-降冰片烯(VNB)的混合物,(C) 共聚物橡胶的碘值为2〜40,(D)共聚物橡胶的特性粘度η在135℃萘烷中测定为1.0〜6.0dl / g,(E)gη 乙烯含量为70摩尔%的线性乙烯 - 丙烯无规共聚物的特性粘度η与特性粘度ηl的比值与通过光散射法测定的相同重均分子量 的共聚物橡胶为0.2〜0.9。 还公开了制备该无规共聚物橡胶和由其衍生的硫化橡胶的方法。 该无规共聚物橡胶具有优异的挤出性和快速固化速率,并提供具有高拉伸强度的硫化橡胶。
    • 82. 发明授权
    • Counter flow device for electroplating apparatus
    • 电镀设备逆流装置
    • US4500400A
    • 1985-02-19
    • US627394
    • 1984-07-03
    • Akira KomodaYasuhiro HirookaTakahisa YoshiharaAkira Matsuda
    • Akira KomodaYasuhiro HirookaTakahisa YoshiharaAkira Matsuda
    • C25D5/00C25D5/02C25D7/06C25D17/00
    • C25D5/02C25D7/0635
    • A counter flow device for a plating apparatus including a rotary drum with its substantially half part immersed in a plating solution in a plating bath, about which a metallic strip to be plated passes in synchronism with rotation of said rotary drum and anodes spaced apart by radial gaps from the strip for causing electric current to flow between the strip and the anodes. According to the invention the counter flow device comprises a bottom nozzle arranged at a bottom of the bath and directing in a direction substantially opposite to an entering direction of the strip thereat and a top nozzle having a nozzle opening whose tip end is immersed in the proximity of a surface of the plating solution at a location where the strip leaves the plating solution, thereby ensuring uniform counter flows over entire gaps between the metallic strip and anodes to remarkably increase critical current density in plating and advantageously realize uniform plating.
    • 一种用于电镀设备的逆流装置,其包括旋转滚筒,其基本上半部分浸入电镀液中的镀液中,待镀的金属带与旋转滚筒和径向间隔开的阳极同步地通过 来自带材的带隙使得电流在带材和阳极之间流动。 根据本发明,逆流装置包括底部喷嘴,该底部喷嘴布置在浴缸的底部并且沿着与其的进入方向基本相反的方向引导,顶部喷嘴具有喷嘴开口,其顶端浸没在接近 在剥离电镀液的位置上的电镀液的表面,从而确保在金属带和阳极之间的整个间隙均匀的逆流,显着提高电镀中的临界电流密度,有利地实现均匀电镀。
    • 90. 发明申请
    • Composite copper foil, method of production thereof and high frequency transmission circuit using said composite copper foil
    • 复合铜箔,其生产方法和使用所述复合铜箔的高频传输电路
    • US20060147742A1
    • 2006-07-06
    • US10543917
    • 2004-02-04
    • Akira MatsudaYuuji SuzukiAkitoshi Suzuki
    • Akira MatsudaYuuji SuzukiAkitoshi Suzuki
    • B32B3/00C21D1/70B21C37/00B32B15/01B32B15/20B23P9/00
    • H05K1/09C25D7/06H05K2201/0355Y10T428/12438Y10T428/12896Y10T428/12903Y10T428/1291Y10T428/12993Y10T428/24917
    • A composite copper foil excellent in conductivity and surface shape, having high strength and able to be used for applications such as high frequency transmission circuits and a method of production of the same are provided. A composite copper foil characterized by having a copper foil on at least one surface of which a copper and/or silver smoothing layer is provided. Further, producing this by processing an ingot having a copper alloy to a foil having a desired thickness by rolling, then forming on at least one surface of the processed copper alloy foil a smoothing layer by copper plating and/or silver plating. Alternatively, producing this by processing an ingot having a copper alloy to a foil having a thickness of an intermediate size by rolling, forming on at least one surface of the foil a smoothing layer by copper plating and/or silver plating, then rolling the result to a foil having a desired thickness or applying heat treatment or applying heat treatment and rolling to thereby make the thickness of at least the copper and/or silver plating layer at the surface of the foil 0.01 μm or more. Further, a high frequency transmission circuit characterized by being prepared using the above composite copper foil or the composite copper foil produced by the above method of production.
    • 提供了导电性和表面形状优异,强度高且能够用于高频传输电路等的应用的复合铜箔及其制造方法。 一种复合铜箔,其特征在于在至少一个表面上具有铜箔和/或银平滑层的铜箔。 此外,通过将具有铜合金的锭加工成具有期望厚度的箔通过轧制来制造,然后通过镀铜和/或镀银在加工的铜合金箔的至少一个表面上形成平滑层。 或者,通过将具有铜合金的锭加工成通过轧制具有中等尺寸的厚度的箔来制造,在箔的至少一个表面上通过镀铜和/或镀银形成平滑层,然后滚动结果 到具有所需厚度的箔或施加热处理或施加热处理和轧制,从而使得至少铜箔和/或银镀层在箔表面上的厚度为0.01μm以上。 此外,其特征在于,使用上述复合铜箔或通过上述制造方法制造的复合铜箔制备高频传输电路。