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    • 82. 发明申请
    • SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME
    • 半导体发光器件及其制造方法
    • US20070267643A1
    • 2007-11-22
    • US11747989
    • 2007-05-14
    • Mitsunori HARADAMasanori Sato
    • Mitsunori HARADAMasanori Sato
    • H01L33/00
    • H01L33/58H01L2924/0002H01L2924/00
    • A reliable semiconductor light-emitting device and a method for manufacturing the same can be provided in which peeling can be prevented in a phase boundary, and optical axis positional errors between the optical lens and a semiconductor light-emitting chip can be reduced or prevented. The semiconductor light-emitting device can include a base board having at least one chip, a reflector fixed on the base board so as to enclose the chip, and an encapsulating resin disposed in the reflector. An optical lens can include a concave-shaped cavity that has an inner corner surface having a plurality of convex portions thereon. The optical lens can be located adjacent the reflector by contacting the lens with a top surface of the reflector so as to enclose the reflector. A spacer that is disposed between the concave-shaped cavity and the reflector can ease a stress that is generated due to temperature changes.
    • 可以提供可靠的半导体发光器件及其制造方法,其中可以在相边界中防止剥离,并且可以减少或防止光学透镜和半导体发光芯片之间的光轴位置误差。 半导体发光装置可以包括具有至少一个芯片的基板,固定在基板上以包围芯片的反射器以及设置在反射器中的封装树脂。 光学透镜可以包括凹形腔,其具有在其上的多个凸部的内角面。 光学透镜可以通过使透镜与反射器的顶表面接触而邻近反射器,以便包围反射器。 设置在凹形腔和反射器之间的间隔件可以缓解由于温度变化而产生的应力。
    • 85. 发明申请
    • Electronic apparatus
    • 电子仪器
    • US20060077630A1
    • 2006-04-13
    • US11167672
    • 2005-06-27
    • Hiroyuki MinaguchiYasuyuki HoriiMasanori SatoTomohiro HamadaHidemi Itakura
    • Hiroyuki MinaguchiYasuyuki HoriiMasanori SatoTomohiro HamadaHidemi Itakura
    • G06F1/16
    • G06F1/1616G06F1/1656
    • A portable computer as an example of an electronic apparatus has a main unit, and a cover member placed on the upper surface of the main unit. The main unit has a housing. A component mounting part is formed on the upper surface of the housing. The component mounting part is covered with the cover member. The cover member has a sliding-type first cover, and a fitting-type second cover. The first cover is placed on a first area of the component mounting part. The first cover has a lock portion, which is slid in the width direction of the housing, and engages with the housing. The second cover is placed on a second area of the component mounting part not covered with the first cover. The second cover is fit to the housing from the upper side of the component mounting part.
    • 作为电子设备的示例的便携式计算机具有主单元和放置在主单元的上表面上的盖构件。 主机有一个外壳。 部件安装部分形成在壳体的上表面上。 部件安装部分被盖部件覆盖。 盖构件具有滑动型第一盖和配合型第二盖。 第一盖被放置在部件安装部分的第一区域上。 第一盖具有锁定部,该锁定部在壳体的宽度方向上滑动并与壳体接合。 第二盖被放置在未被第一盖覆盖的部件安装部分的第二区域上。 第二盖从部件安装部的上侧配合到壳体。
    • 86. 发明授权
    • Device for exposure of the peripheral area of a film circuit board
    • 用于曝光胶片电路板外围区域的装置
    • US06515295B1
    • 2003-02-04
    • US09886005
    • 2001-06-22
    • Masanori SatoSatoshi Murakami
    • Masanori SatoSatoshi Murakami
    • G01N2186
    • H05K3/0082G03F7/2026H05K1/0269H05K1/0393H05K3/0008H05K3/0097H05K2203/1545
    • A device for exposure of the peripheral area of a film circuit board in which the edge of the copper foil can be exactly determined and the position of the irradiation area can be controlled with high precision is obtained in that a resist (R) in the peripheral area of a conductive foil located on a film circuit board (TP) is irradiated with exposure light and is thus exposed, while the film circuit board (TP) in which there are perforation holes (PH) with a stipulated pitch to one another, is transported, in that an optical detector (4) is used as the sensor for determining the edge part of the conductive foil, in that the sensor light emitted onto the edge part of the conductive foil is received by a light receiving part (4b), in that the optical detector (4b) is subjected to motion control in the direction which orthogonally intersects the transport direction, such that the amount of light reception is constant and in that the area irradiated with the exposure light is moved by the same amount as the optical detector (4), and thus, the peripheral area is exposed. The length of the sensor light in the transport direction of the irradiation area on the film circuit board TP is determined by the pitch between the perforation holes multiplied by a natural number. In this way, the resist (R) of the peripheral area of the conductive foil can be exposed according to the edge position of the conductive foil.
    • 可以获得能够精确地确定铜箔的边缘并且可以高精度地控制照射区域的位置的薄膜电路板的外围区域的曝光装置,其中外围的抗蚀剂(R) 位于薄膜电路板(TP)上的导电箔的面积被照射曝光,因此露出,而具有规定间距的穿孔(PH)的薄膜电路板(TP)彼此之间是 因为光检测器(4)被用作用于确定导电箔的边缘部分的传感器,因为发射到导电箔的边缘部分上的传感器光由光接收部分(4b)接收, 由于光检测器(4b)在与传送方向正交的方向上进行运动控制,使得光的接收量恒定,并且用曝光光照射的面积移动 与光检测器(4)相同的量,因此外围区域被暴露。 膜电路板TP上的照射区域的传送方向上的传感器光的长度由穿孔之间的间距乘以自然数确定。 以这种方式,可以根据导电箔的边缘位置露出导电箔周边区域的抗蚀剂(R)。