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    • 81. 发明申请
    • Reproducing device and reproducing method
    • 再现装置和再现方法
    • US20060245734A1
    • 2006-11-02
    • US11407050
    • 2006-04-20
    • Hiroshi AmanoMasahiro NoboriShoji Shirakawa
    • Hiroshi AmanoMasahiro NoboriShoji Shirakawa
    • H04N7/00
    • H04N5/765H04N5/775H04N5/781H04N5/85H04N9/8205
    • The present invention allows a reproducing device that can be used in various device environmental conditions to execute adequate output operation according to a device environmental condition. When reproducing a content signal of audio and video, a reproducing device determines a device environmental condition as the coupling state of the reproducing device and surroundings of the reproducing device. Subsequently, the reproducing device implements control according to output part information and control information that are set with being associated with the device environmental condition. Based on the output part information, either or both of a main-body output unit and an external output unit are controlled as a part for outputting audio or video. In addition, control corresponding to the registered control information is executed inside the device, or details of the control are indicated to a coupled external device.
    • 本发明允许可以在各种设备环境条件下使用的再现装置根据设备环境条件执行足够的输出操作。 当再现音频和视频的内容信号时,再现装置将设备环境条件确定为再现设备的耦合状态和再现设备的周围环境。 随后,再现装置根据与设备环境条件相关联的设置的输出部分信息和控制信息实现控制。 基于输出部分信息,将主体输出单元和外部输出单元中的一个或两个作为输出音频或视频的一部分进行控制。 此外,在设备内部执行对应于登记的控制信息的控制,或者将控制的细节指示给耦合的外部设备。
    • 89. 发明授权
    • Semiconductor substrate and method for making the same
    • 半导体衬底及其制造方法
    • US06537513B1
    • 2003-03-25
    • US09562978
    • 2000-04-27
    • Hiroshi AmanoTetsuya TakeuchiIsamu Akasaki
    • Hiroshi AmanoTetsuya TakeuchiIsamu Akasaki
    • C01B3326
    • H01L33/007H01L21/0237H01L21/02458H01L21/02502H01L21/02513H01L21/0254H01L21/0262H01L29/205
    • A substrate for fabricating semiconductor devices based on Group III semiconductors and the method for making the same. A substrate according to the present invention includes a base substrate, a first buffer layer, and a first single crystal layer. The first buffer layer includes a Group III material deposited on the base substrate at a temperature below that at which the Group III material crystallizes. The Group III material is crystallized by heating the buffer layer to a temperature above that at which the Group III material crystallizes to form a single crystal after the Group III material has been deposited. The first single crystal layer includes a Group III-V semiconducting material deposited on the first buffer layer at a temperature above that at which the Group III semiconducting material crystallizes. In one embodiment of the present invention, a second buffer layer and a second single crystal layer are deposited on the first single crystal layer. The second buffer layer includes a Group III material deposited on the first single crystal layer at a temperature below that at which the Group III material crystallizes. The Group III material is then crystallized by heating the buffer layer to a temperature above that at which the Group III material crystallizes to form a single crystal. The second single crystal layer includes a Group III-V semiconducting material deposited on the second buffer layer at a temperature above that at which the Group III semiconducting material crystallizes.
    • 一种用于制造基于III族半导体的半导体器件的衬底及其制造方法。 根据本发明的基板包括基底,第一缓冲层和第一单晶层。 第一缓冲层包括在低于III族材料结晶温度的温度下沉积在基底基材上的III族材料。 第III组材料通过将缓冲层加热至高于第III族材料结晶后形成单晶的温度而结晶,此后III族材料已沉积。 第一单晶层包括在高于III族半导体材料结晶温度的温度下沉积在第一缓冲层上的III-V族半导体材料。 在本发明的一个实施例中,在第一单晶层上沉积第二缓冲层和第二单晶层。 第二缓冲层包括沉积在第一单晶层上的III族材料,其温度低于III族材料结晶的温度。 然后通过将缓冲层加热到高于III族材料结晶以形成单晶的温度,使第III族材料结晶。 第二单晶层包括在高于III族半导体材料结晶的温度的第二缓冲层上沉积的III-V族半导体材料。