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    • 85. 发明授权
    • Image sensing apparatus and its control method
    • 图像传感装置及其控制方法
    • US07505074B2
    • 2009-03-17
    • US10831326
    • 2004-04-26
    • Hiroaki YoshinoYoshinobu Sato
    • Hiroaki YoshinoYoshinobu Sato
    • H04N5/222G09G5/00
    • H04N5/23293
    • In an initial stage where an image obtained by image sensing is displayed, image data in a resolution depending on an image display area of display unit is displayed, thereby a high response can be maintained with respect to a request to display a next image or the like. Further, if a request with an enlargement ratio higher than that in the initial stage has been made, a display image is generated based on image data in a high resolution, thereby a user's request for enlarged display or the like can be fulfilled. When an image (JPEG file) stored in a recording medium is to be displayed, low resolution image data in 640×480 pixel size equivalent to the resolution of the display unit and high resolution image data in an original high resolution indicated with the image file are generated. In the initial stage, the low resolution image data is displayed. If an enlargement request has been made, partial image data cut out from the high resolution image data is resized and is displayed.
    • 在通过图像感测获得的图像被显示的初始阶段中,显示根据显示单元的图像显示区域的分辨率的图像数据,从而可以相对于显示下一个图像的请求而保持高响应,或者 喜欢。 此外,如果已经做出了具有高于初始阶段的放大率的请求,则基于高分辨率的图像数据生成显示图像,从而可以满足用户对放大显示等的请求。 当要显示存储在记录介质中的图像(JPEG文件)时,生成与显示单元的分辨率相当的640×480像素尺寸的低分辨率图像数据和以图像文件指示的原始高分辨率的高分辨率图像数据 。 在初始阶段,显示低分辨率图像数据。 如果已经进行放大请求,则从高分辨率图像数据切出的部分图像数据被调整大小并被显示。
    • 86. 发明授权
    • Semiconductor device and method for manufacturing the same
    • 半导体装置及其制造方法
    • US07408234B2
    • 2008-08-05
    • US11159134
    • 2005-06-23
    • Hisao IchijoHiroyoshi OguraYoshinobu SatoTeruhisa Ikuta
    • Hisao IchijoHiroyoshi OguraYoshinobu SatoTeruhisa Ikuta
    • H01L31/113
    • H01L29/0847H01L29/1045H01L29/1083H01L29/66659H01L29/7835H01L29/78624
    • An object of the present invention is to provide a semiconductor device that is able to realize a low on-resistance maintaining a high drain-to-source breakdown voltage, and a method for manufacturing thereof, the present invention including: a supporting substrate; a semiconductor layer having a P− type active region that is formed on the supporting substrate, interposing a buried oxide film between the semiconductor layer and the supporting substrate; and a gate electrode that is formed on the semiconductor layer, interposing a gate oxide film and a part of a LOCOS film between the gate electrode and the semiconductor layer, wherein the P− type active region has: an N+ type source region; a P type body region; a P+ type back gate contact region; an N type drain offset region; an N+ type drain contact region; and an N type drain buffer region that is formed in a limited region between the N type drain offset region and the P type body region, and the N type drain buffer region is in contact with a source side end of the LOCOS film and is shallower than the N type drain offset region.
    • 本发明的目的是提供一种能够实现低导通电阻并保持高的漏极 - 源极击穿电压的半导体器件及其制造方法,本发明包括:支撑衬底; 形成在所述支撑基板上的具有P-SUP型有源区的半导体层,在所述半导体层和所述支撑基板之间插入掩埋氧化膜; 以及形成在所述半导体层上的栅电极,在所述栅电极和所述半导体层之间插入栅极氧化膜和LOCOS膜的一部分,其中所述P +型有源区具有: 类型源区域; P型体区; 一个P + +型背栅接触区; N型漏极偏移区域; 一个N + +型漏极接触区域; 以及形成在N型漏极偏移区域和P型体区域之间的有限区域中的N型漏极缓冲区域,并且N型漏极缓冲区域与LOCOS膜的源极侧端部接触并且较浅 比N型漏极偏移区域。
    • 89. 发明授权
    • Lateral semiconductor device and method for producing the same
    • 侧面半导体器件及其制造方法
    • US07238987B2
    • 2007-07-03
    • US11242084
    • 2005-10-04
    • Teruhisa IkutaHiroyoshi OguraYoshinobu SatoHisao Ichijo
    • Teruhisa IkutaHiroyoshi OguraYoshinobu SatoHisao Ichijo
    • H01L29/76H01L21/84
    • H01L29/0847H01L29/0878H01L29/1045H01L29/1083H01L29/1095H01L29/42368H01L29/66681H01L29/7824H01L29/7835
    • A high withstand voltage lateral semiconductor device capable of improving its on-state breakdown voltage and safe operation area (SOA) without lowering its current capabilities, and structured so as to be easy to produce. The lateral semiconductor device comprises a second conductivity type second semiconductor region formed in a semiconductor layer so as to be adjacent to or away from a first semiconductor region, a second conductivity type source region, a second conductivity type drain region, and a gate electrode formed on a gate insulating film formed between an end of the source region on the surface of the semiconductor layer and an end of the second semiconductor region, wherein the first semiconductor region is extended from under the source region to partly under the gate electrode, the concentration distribution of a first conductivity type impurity increases in the region ranging from the surface of the semiconductor layer to the embedded insulating film and has a peak under the source region, and the impurity concentration in the semiconductor layer ranging from directly under the first semiconductor region to the embedded insulating film is lower than the surface concentration in the first semiconductor region.
    • 高耐压横向半导体器件能够在不降低其电流能力的情况下改善其导通电压和安全工作区域(SOA),并且结构化以便于生产。 横向半导体器件包括形成在半导体层中以与第一半导体区相邻或离开的第二导电类型的第二半导体区,第二导电类型源极区,第二导电类型漏极区和形成的栅电极 在形成在所述半导体层的表面上的所述源极区域的端部与所述第二半导体区域的端部之间的栅极绝缘膜上,其中,所述第一半导体区域从所述源极区域的下部延伸到所述栅极电极的下方, 在从半导体层的表面到嵌入绝缘膜的范围内的第一导电型杂质的分布增加,并且在源极区域具有峰值,并且半导体层中的杂质浓度范围从第一半导体区域的正下方到 嵌入式绝缘膜低于第一绝缘膜中的表面浓度 半导体区域。