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    • 82. 发明申请
    • Driving apparatus in printing press
    • 印刷机中的驱动装置
    • US20050016396A1
    • 2005-01-27
    • US10898090
    • 2004-07-23
    • Koichi TobeHideaki Watanabe
    • Koichi TobeHideaki Watanabe
    • B41F33/00B41F31/15B41F31/30F16D11/14B41F5/00
    • B41F31/15B41F13/008B41P2213/256F16D11/14
    • A driving apparatus in a printing press includes a plate cylinder driven by a printing press motor, an inking device drive-coupled to the plate cylinder, and a driving connecting/disconnecting mechanism. The mechanism connects and disconnects transmission of driving from the plate cylinder to the inking device, and includes first and second gears which are engageable with each other, supported rotatably, and constantly drive-coupled to one and the remaining one, respectively, of the plate cylinder and inking device. The second gear has a second engaging portion engageable with a plurality of first engaging portions of the first gear which have the same shape and are equidistantly arranged in a rotational direction of the first gear. When the first and second engaging portions engage, the plate cylinder and inking device are drive-coupled; when they are disengaged, they are disconnected. The number of first engaging portions is set on the basis of a value related to the first gear, so that when the plate cylinder reaches a phase identical to that where the first and second engaging portions disengage, the first and second engaging portions can engage regardless of a driving connection ratio of one of the plate cylinder and inking device to the first gear.
    • 印刷机中的驱动装置包括由印刷机电动机驱动的印版滚筒,驱动联接到印版滚筒的着墨装置和驱动连接/断开机构。 该机构连接和断开驱动从印版滚筒向着墨装置的传输,并且包括可彼此接合的第一和第二齿轮,可旋转地支撑并且分别恒定地驱动耦合到板的一个和剩余的一个 气缸和上墨装置。 第二齿轮具有可与第一齿轮的多个第一接合部接合的第二接合部,该第一接合部具有与第一齿轮的旋转方向相同的形状并且等距设置。 当第一和第二接合部分接合时,印版滚筒和上墨装置被驱动耦合; 当它们被分离时,它们被断开。 基于与第一齿轮相关的值设定第一接合部的数量,使得当印版滚筒达到与第一和第二接合部分脱离的相位相同的相位时,第一和第二接合部分可以接合 一个印版滚筒和上墨装置的一个驱动连接比与第一档。
    • 88. 发明授权
    • Process for preserving solder paste
    • 保存焊膏的工艺
    • US5778638A
    • 1998-07-14
    • US797969
    • 1997-02-12
    • Hideaki WatanabeTakayuki Watanabe
    • Hideaki WatanabeTakayuki Watanabe
    • B65D81/26H05K3/34B65B31/02B65B31/04
    • B65D81/268H05K3/3484
    • There is disclosed a process for preserving solder paste which comprises housing solder paste in a vessel which is substantially free from oxygen and moisture and is imparted with gas barrier properties. The process is preferably carried out by housing the solder paste together with an oxygen absorbent not requiring moisture for absorbing oxygen (e.g. unsaturated fatty acid compound and chain hydrocarbon polymer having unsaturated groups) and optionally a dehumidifying agent and/or an acidic gas absorbent in the above vessel and subsequently hermetically sealing said vessel. The process makes it possible to prevent the deterioration of the solder paste such as viscosity change of the solder and the formation of solder balls which affect the printability and solder reflowability, to preserve the solder paste at room temperature and to remarkably prolong its service term.
    • 公开了一种保存焊膏的方法,其包括在基本上不含氧和水分的容器中容纳焊膏,并赋予阻气性。 该方法优选通过将焊膏与不需要水分吸收氧气的氧吸收剂(例如不饱和脂肪酸化合物和具有不饱和基团的链烃聚合物)和任选的除湿剂和/或酸性气体吸收剂 然后气密地密封所述容器。 该过程使得可以防止焊料的劣化,例如焊料的粘度变化和影响可印刷性和焊料回流性的焊球的形成,从而将焊膏保持在室温下并显着延长其使用期限。