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81. 发明申请

US20190081705A1 MULTIMODE WAVEGUIDE 审中-公开
公开(公告)号：US20190081705A1
公开(公告)日：2019-03-14
申请号：US16179215
申请日：2018-11-02
申请人： Intel Corporation
发明人： Henning Braunisch , Adel A. Elsherbini , Georgios Dogiamis , Telesphor Kamgaing , Aleksandar Aleksov , Johanna M. Swan
IPC分类号： H04B10/2581 , G02B6/43 , H04B10/50
摘要： There is disclosed in one example a communication apparatus, including: a local data interface; a data encoder to encode a transmission into n millimeter to terahertz-band transmission components, wherein n≥2, each transmission component having an independent mode of each other transmission component; and a plurality of n launchers to launch the transmission components onto n closely-bundled waveguides, wherein the closely-bundled waveguides are not shielded from one another.

82. 发明申请

US20180316434A1 CHANNELIZATION FOR DISPERSION LIMITED WAVEGUIDE COMMUNICATION CHANNELS 审中-公开
公开(公告)号：US20180316434A1
公开(公告)日：2018-11-01
申请号：US15965637
申请日：2018-04-27
申请人： Intel Corporation
发明人： Georgios C. Dogiamis , Sasha N. Oster , Telesphor Kamgaing , Emanuel Cohen
IPC分类号： H04B10/2575
CPC分类号： H04B10/2575 , H04B10/2513
摘要： Embodiments of the present disclosure may relate to a transmitter to transmit a radio frequency (RF) signal to a receiver via a dielectric waveguide where the transmitter includes a plurality of mixers to generate modulated RF signals and a combiner to combine the modulated RF signals. Embodiments may also include a receiver to receive, from a dielectric waveguide, a RF signal where the receiver includes a splitter to split the RF signal into a plurality of signal paths, a plurality of filters, and a plurality of demodulators. Embodiments may also include a dielectric waveguide communication apparatus that may include the transmitter and the receiver. Other embodiments may be described and/or claimed.

83. 发明授权

US10083923B2 Platform with thermally stable wireless interconnects 有权
公开(公告)号：US10083923B2
公开(公告)日：2018-09-25
申请号：US14860614
申请日：2015-09-21
申请人： INTEL CORPORATION
发明人： Georgios C. Dogiamis , Sasha N. Oster , Telesphor Kamgaing , Adel A. Elsherbini , Brandon M. Rawlings , Feras Eid
IPC分类号： H01L23/58 , H01L23/66 , H01L23/498 , H01L23/367 , H01L23/00 , H01L25/065
CPC分类号： H01L23/66 , H01L23/367 , H01L23/3675 , H01L23/49827 , H01L23/49838 , H01L23/5383 , H01L24/13 , H01L24/16 , H01L24/73 , H01L25/0655 , H01L2223/6627 , H01L2223/6677 , H01L2224/12105 , H01L2224/131 , H01L2224/16227 , H01L2224/73253 , H01L2924/014 , H01L2924/1421 , H01L2924/1432 , H01L2924/1434 , H01L2924/15192 , H01L2924/15311 , H01L2924/15313 , H01L2924/15321 , H01L2924/16251 , H01L2924/163 , H01L2924/00014
摘要： Embodiments of the invention may include a packaged device that includes thermally stable radio frequency integrated circuits (RFICs). In one embodiment the packaged device may include an integrated circuit chip mounted to a package substrate. According to an embodiment, the package substrate may have conductive lines that communicatively couple the integrated circuit chip to one or more external components. One of the external components may be an RFIC module. The RFIC module may comprise an RFIC and an antenna. Additional embodiments may also include a packaged device that includes a plurality of cooling spots formed into the package substrate. In an embodiment the cooling spots may be formed proximate to interconnect lines the communicatively couple the integrated circuit chip to the RFIC.

84. 发明授权

US09881990B2 Integrated inductor for integrated circuit devices 有权
公开(公告)号：US09881990B2
公开(公告)日：2018-01-30
申请号：US15169665
申请日：2016-05-31
申请人： INTEL CORPORATION
发明人： Andreas Duevel , Telesphor Kamgaing , Valluri R. Rao , Uwe Zillmann
IPC分类号： H01F5/00 , H01F27/06 , G09G5/00 , H01L49/02 , H01F7/08 , H01L23/48 , H01L23/522 , H01F17/00 , H01L21/768 , H01L27/06 , H01L27/08
CPC分类号： H01L28/10 , H01F17/0006 , H01F2017/002 , H01L21/76898 , H01L23/481 , H01L23/5227 , H01L27/0688 , H01L27/08 , H01L2224/4813 , H01L2924/0002 , H01L2924/00012
摘要： A three-dimensional inductor is formed in an integrated circuit die using conductive through-body-vias which pass through the body of the die and contact one or more metal interconnect layers on the front side of the die and terminate on the back side of the die. In another embodiment, the through-body-vias may pass through a dielectric material disposed in a plug in the body of the die. In yet another aspect, a transformer may be formed by coupling multiple inductors formed using through-body-vias. In still another aspect, a three-dimensional inductor may include conductors formed of stacks of on chip metallization layers and conductive through-layer-vias disposed in insulation layers between metallization layers. Other embodiments are described.

85. 发明申请

US20170179612A1 DISTRIBUTED ON-PACKAGE MILLIMETER-WAVE RADIO 审中-公开
公开(公告)号：US20170179612A1
公开(公告)日：2017-06-22
申请号：US15453327
申请日：2017-03-08
申请人： Intel Corporation
发明人： Telesphor Kamgaing , Adel Elsherbini
IPC分类号： H01Q21/22 , H01Q21/00
CPC分类号： H01Q21/22 , G06K19/077 , H01L24/20 , H01L24/82 , H01L2223/6677 , H01L2224/16227 , H01L2924/15153 , H01L2924/15321 , H01Q21/0025 , H01Q21/0087 , H01Q21/0093 , H01Q21/065 , H01Q23/00
摘要： Embodiments described herein generally relate to phased array antenna systems or packages and techniques of making and using the systems and packages. A phased array antenna package may include a distributed phased array antenna comprising (1) a plurality of antenna sub-arrays, which may each include a plurality of antennas, (2) a plurality of Radio Frequency Dies (RFDs), each of the RFDs located proximate and electrically coupled by a trace of a plurality of traces to a corresponding antenna sub-array of the plurality of antenna sub-arrays, and (3) wherein each trace of the plurality of traces configured to electrically couple an antenna of the plurality of antennas to the RFD located proximate the antenna, wherein each trace of the plurality of traces is configured to transmit millimeter wave (mm-wave) radio signals, and wherein the plurality of traces are each of a substantially uniform length.

86. 发明授权

US09543244B2 Hybrid package transmission line circuits 有权
标题翻译：混合封装传输线路电路
公开(公告)号：US09543244B2
公开(公告)日：2017-01-10
申请号：US14543838
申请日：2014-11-17
申请人： Intel Corporation
发明人： Chung Peng Jackson Kong , Chang-Tsung Fu , Telesphor Kamgaing , Chan Kim Lee , Ping Ping Ooi
IPC分类号： H01L23/522 , H01L23/52 , H01L23/498 , H01L23/528
CPC分类号： H01L23/5226 , H01L23/49822 , H01L23/49827 , H01L23/528 , H01L2224/16
摘要： “Hybrid” transmission line circuits employing multiple interconnect levels for the propagation, or return, of a single signal line across a package length are described. In package transmission line circuit embodiments, a signal line employs co-located traces in two different interconnect levels that are electrically coupled together. In further embodiments, a reference plane is provided above, below or co-planar with at least one of the co-locate traces. In embodiments, a balanced signal line pair includes first and second co-located traces in two adjacent interconnect levels as a propagation signal line and third and fourth co-located traces in the two adjacent interconnect levels as a return signal line with a ground plane co-planar with, and/or above and/or below the two adjacent interconnect levels.
摘要翻译：描述了采用多个互连级别以跨越封装长度传播或返回单条信号线的“混合”传输线路电路。在封装传输线路电路实施例中，信号线在电耦合在一起的两个不同的互连级别中使用共同定位的迹线。在另外的实施例中，参考平面被提供在至少一个共定位轨迹的上方，下方或共面上。在实施例中，平衡信号线对包括作为传播信号线的两个相邻互连级别中的第一和第二同位置迹线，以及在两个相邻互连级别中的第三和第四同位序列作为具有接地平面Co 平面，和/或上方和/或下方两个相邻互连层。

87. 发明授权

US09419339B2 Package structures including discrete antennas assembled on a device 有权
公开(公告)号：US09419339B2
公开(公告)日：2016-08-16
申请号：US14918508
申请日：2015-10-20
申请人： Intel Corporation
发明人： Telesphor Kamgaing , Valluri R. Rao , Ofir Degani
IPC分类号： H04Q1/38 , H01Q9/04 , H01P11/00 , H01Q1/38 , H01Q1/22 , H01Q1/52 , H01Q21/00
CPC分类号： H01Q9/045 , H01L2224/16225 , H01L2924/15311 , H01P11/00 , H01Q1/2283 , H01Q1/38 , H01Q1/526 , H01Q21/0006 , Y10T29/49018
摘要： Methods of forming a microelectronic packaging structure and associated structures formed thereby are described. Those methods and structures may include forming a package structure comprising a discrete antenna disposed on a back side of a device, wherein the discrete antenna comprises an antenna substrate, a through antenna substrate via vertically disposed through the antenna substrate. A through device substrate via that is vertically disposed within the device is coupled with the through antenna substrate via, and a package substrate is coupled with an active side of the device.

88. 发明授权

US09318952B2 Series and parallel hybrid switched capacitor networks for IC power delivery 有权
标题翻译：串联和并联混合开关电容网络用于IC功率输送
公开(公告)号：US09318952B2
公开(公告)日：2016-04-19
申请号：US14180166
申请日：2014-02-13
申请人： Intel Corporation
发明人： Bradley S. Oraw , Telesphor Kamgaing
IPC分类号： H02M3/07 , H02J1/10 , H02M1/00 , H02J9/00
CPC分类号： H02M3/07 , H02J1/102 , H02J9/005 , H02M2001/008 , Y10T307/406
摘要： Series switches for power delivery. A regulator operated as a current source is arranged in parallel with a switched capacitor divider. A switched capacitor divider is configured in series with a plurality of linear regulators with each regulating one of a plurality of voltage outputs from the switched capacitor divider. In another embodiment, a series switch bridge has a first pair of switches connected in series with a second pair of switches across a voltage input, each switch within a pair of switches is switched in-phase with the other while the first pair of switches is switched out of phase with the second pair of switches. A balancing capacitor is coupled across one switch in both the first and second pair to be in parallel when either of the pair of switches is closed to reduce a charge imbalance between the switches.
摘要翻译：串联交换机供电。作为电流源工作的调节器与开关电容分压器并联布置。开关电容器分配器与多个线性调节器串联配置，每个线性调节器调节来自开关电容器分压器的多个电压输出中的一个。在另一个实施例中，串联开关桥具有跨越电压输入与第二对开关串联连接的第一对开关，一对开关内的每个开关与另一个开关同相切换，而第一对开关为与第二对开关切换异相。平衡电容器耦合在第一对和第二对中的一个开关上，以在两对开关中的任一个闭合时并联，以减少开关之间的电荷不平衡。

89. 发明公开

US20240312869A1 MICROFLUIDIC COOLING IN INTEGRATED CIRCUIT DEVICE 审中-公开
公开(公告)号：US20240312869A1
公开(公告)日：2024-09-19
申请号：US18183505
申请日：2023-03-14
申请人： Intel Corporation
发明人： Tongyan Zhai , Telesphor Kamgaing , Min Suet Lim
IPC分类号： H01L23/473 , H01L23/00 , H01L23/528
CPC分类号： H01L23/473 , H01L23/528 , H01L24/32 , H01L24/16 , H01L2224/16225 , H01L2224/32225
摘要： Described herein are integrated circuit devices that include semiconductor devices near the center of the device, rather than towards the top or bottom of the device. In this arrangement, heat can become trapped inside the device. A microfluidic cooling layer is formed near a top or front the device, e.g., over the semiconductor devices and any front side interconnect structures, to transfer heat away from the semiconductor devices.

90. 发明授权

US12007170B2 Thermal management in integrated circuit packages 有权
公开(公告)号：US12007170B2
公开(公告)日：2024-06-11
申请号：US16533235
申请日：2019-08-06
申请人： Intel Corporation
发明人： Feras Eid , Telesphor Kamgaing , Georgios Dogiamis , Aleksandar Aleksov , Johanna M. Swan
IPC分类号： F28D15/04 , H01L23/367 , H01L23/38 , H01L23/427
CPC分类号： F28D15/046 , H01L23/3672 , H01L23/3675 , H01L23/38 , H01L23/427
摘要： Disclosed herein are structures and assemblies that may be used for thermal management in integrated circuit (IC) packages.

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