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    • 85. 发明授权
    • Method for manufacturing semiconductor device
    • 制造半导体器件的方法
    • US07582526B2
    • 2009-09-01
    • US11445870
    • 2006-06-02
    • Yen-Hao ShihErh-Kun Lai
    • Yen-Hao ShihErh-Kun Lai
    • H01L21/336
    • H01L27/105H01L27/11546H01L27/11568H01L29/78
    • A method for manufacturing a plurality of memory devices and a plurality of high voltage devices on a substrate are provided. The substrate has a memory region and a high voltage region. The method comprises steps of forming a first dielectric layer on the substrate and then performing a thermal process so as to enlarge the thickness of the first dielectric layer in the high voltage region. A buried diffusion region is formed in the substrate in the memory region and a charge trapping layer and a blocking dielectric layer are formed over the substrate in the memory region. A patterned conductive layer is formed over the substrate so as to form gates the memory region and the high voltage region respectively and then a source/drain region is formed adjacent to the gates in the high voltage region in the substrate.
    • 提供了一种用于在基板上制造多个存储器件和多个高电压器件的方法。 衬底具有存储区和高电压区。 该方法包括以下步骤:在衬底上形成第一电介质层,然后进行热处理,以扩大高电压区域中的第一电介质层的厚度。 在存储区中的衬底中形成掩埋扩散区,并且在存储区中的衬底上形成电荷俘获层和阻挡电介质层。 在衬底上形成图案化的导电层,以分别形成存储区域和高电压区域的栅极,然后在衬底中的高电压区域中邻近栅极形成源极/漏极区域。
    • 88. 发明授权
    • Charge trapping memory device with two separated non-conductive charge trapping inserts and method for making the same
    • 具有两个分离的非导电电荷捕获插入物的电荷俘获存储器件及其制造方法
    • US07329914B2
    • 2008-02-12
    • US10884483
    • 2004-07-01
    • Yen-Hao Shih
    • Yen-Hao Shih
    • H01L29/76
    • H01L29/66833H01L21/28282H01L29/7923
    • A charge trapping memory device with two separated non-conductive charge trapping inserts is disclosed. The charge trapping memory device has a silicon substrate with two junctions. A gate oxide (GOX) is formed on top of the silicon substrate and between the two junctions. A polysilicon gate is defined over the GOX. A layer of bottom oxide (BOX) is grown on top of the silicon substrate and a conformal layer of top oxide (TOX) is grown along the bottom and the sidewalls of the polysilicon gate. Two charge trapping inserts are located beside the GOX and between the BOX and the TOX. The polysilicon gate needs to be at least partially over each of the two charge trapping inserts. The charge trapping inserts are made from a non-conductive charge trapping material. A method for fabricating such a device is also described.
    • 公开了具有两个分开的非导电电荷捕获插入物的电荷捕获存储器件。 电荷捕获存储器件具有带有两个结的硅衬底。 在硅衬底的顶部和两个结之间形成栅极氧化物(GOX)。 在GOX上定义了多晶硅栅极。 在硅衬底的顶部上生长一层底部氧化物(BOX),沿多晶硅栅极的底部和侧壁生长顶部氧化物(TOX)的共形层。 两个充电陷阱插件位于GOX旁边和BOX和TOX之间。 多晶硅栅极需要至少部分地在两个电荷捕获插入物中的每一个上。 电荷捕获插入物由非导电电荷捕获材料制成。 还描述了制造这种装置的方法。