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    • 84. 发明授权
    • Method of fabricating a thermoelectric module
    • 制造热电模块的方法
    • US5950067A
    • 1999-09-07
    • US973095
    • 1998-03-19
    • Nobuteru MaegawaHiroaki OkadaMichimasa TsuzakiYuri SakaiKatsuyoshi ShimodaTeruaki KomatsuShinya MuraseHiroyuki InoueMasayuki Sagawa
    • Nobuteru MaegawaHiroaki OkadaMichimasa TsuzakiYuri SakaiKatsuyoshi ShimodaTeruaki KomatsuShinya MuraseHiroyuki InoueMasayuki Sagawa
    • H01L35/32H01L35/34H01L21/324
    • H01L35/32H01L35/325H01L35/34Y10S257/93
    • A method of fabricating a thermoelectric module in which a plurality of thermoelectric chips are arranged in a matrix between first and second dielectric substrates and electrically connected in series so as to heat one of the substrates and cool the other substrate. Elongated thermoelectric bars of P-type and N-type to be cut into the chips are employed together with a first conductive plate having a plurality of first contacts arranged in a matrix pattern. Adjacent first contacts spaced along the row are interconnected by horizontal bridges. The method of the present invention comprises the steps of integrating the first conductive plate to the first substrate to support the first conductive plate thereby; placing a plurality of the bars of the P-type and N-type on the first contacts along the rows in such a manner that the P-type bars alternate with the N-type bars in a spaced relation along the column; bonding each bar on its one face to the first contacts; cutting each bar into the chips and cutting the horizontal bridges simultaneously to allocate the chips on the individual first contacts; placing a plurality of second contacts of a second substrate onto the chips to form a series electric circuit of the chips in combination with the first contacts, and bonding the second substrate supporting the second contacts to the first substrate.
    • PCT No.PCT / JP97 / 01797 Sec。 371日期:1998年3月19日 102(e)1998年3月19日PCT PCT 1997年6月3日PCT公布。 公开号WO97 / 45882 日期1997年12月4日一种制造热电模块的方法,其中多个热电芯片以矩阵形式布置在第一和第二电介质基板之间并串联电连接以加热其中一个基板并冷却另一个基板。 将要切割成芯片的P型和N型的细长热电棒与具有以矩阵图案排列的多个第一触头的第一导电板一起使用。 沿着行间隔的相邻的第一接触件通过水平桥互连。 本发明的方法包括以下步骤:将第一导电板与第一基板集成,从而支撑第一导电板; 沿着行将P型和N型的多个条放置在第一触点上,使得P型条以与柱相隔的关系与N型条交替; 将其一个面上的每个条连接到第一触点; 将每个棒切割成芯片并同时切割水平桥,以将芯片分配在单独的第一触点上; 将第二基板的多个第二触点放置在芯片上以与第一触点组合形成芯片的串联电路,以及将支撑第二触点的第二基板接合到第一基板。
    • 86. 发明授权
    • Recording apparatus having a movable cleaner blade
    • 具有可移动清洁器刮板的记录装置
    • US5875382A
    • 1999-02-23
    • US633641
    • 1996-04-17
    • Hiroyuki Inoue
    • Hiroyuki Inoue
    • G03G15/01G03G15/16G03G21/00
    • G03G15/161G03G2215/1657
    • To provide a reasonable and economical recording apparatus wherein an inevitable fluctuation of an intermediate transfer drum or the like does not adversely influence other elements. A recording apparatus wherein a toner image on a photosensitive drum (11) is primarily transferred to an intermediate transfer drum (21) and the toner image on the intermediate transfer drum (21) is secondarily transferred to a recording medium (100), characterized in that the apparatus comprises an intermediate transfer drum shifting device (40, 70) for shifting the intermediate transfer drum (21), during the primary transfer, into a first state wherein the intermediate transfer drum (21) is brought into press-contact with the photosensitive drum (11), and, during the secondary transfer, into a second state wherein the intermediate transfer drum (21) is brought into press-contact with the recording medium (100) but not brought into press-contact with the photosensitive drum (11).
    • 为了提供一种合理且经济的记录装置,其中中间转印鼓等的不可避免的波动不会对其它元件产生不利影响。 一种记录装置,其中将感光鼓(11)上的调色剂图像主要转印到中间转印鼓(21)上,并将中间转印鼓(21)上的调色剂图像二次转印到记录介质(100)上,其特征在于 该设备包括用于在一次转印期间使中间转印鼓(21)移动的中间转印鼓移位装置(40,70)进入第一状态,其中中间转印鼓(21)与 感光鼓(11),并且在二次转印期间进入第二状态,其中中间转印鼓(21)与记录介质(100)压接,但不与感光鼓压接 11)。