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    • 81. 发明申请
    • FORMATION OF VERTICAL DEVICES BY ELECTROPLATING
    • 通过电镀形成垂直装置
    • US20080166874A1
    • 2008-07-10
    • US11620497
    • 2007-01-05
    • Hariklia DeligianniQiang HuangJohn P. HummelLubomyr T. RomankiwMary B. Rothwell
    • Hariklia DeligianniQiang HuangJohn P. HummelLubomyr T. RomankiwMary B. Rothwell
    • H01L21/44
    • H01L21/76879H01L21/2885Y10S205/925
    • The present invention is related to a method for forming vertical conductive structures by electroplating. Specifically, a template structure is first formed, which includes a substrate, a discrete metal contact pad located on the substrate surface, an inter-level dielectric (ILD) layer over both the discrete metal contact pad and the substrate, and a metal via structure extending through the ILD layer onto the discrete metal contact pad. Next, a vertical via is formed in the template structure, which extends through the ILD layer onto the discrete metal contact pad. A vertical conductive structure is then formed in the vertical via by electroplating, which is conducted by applying an electroplating current to the discrete metal contact pad through the metal via structure. Preferably, the template structure comprises multiple discrete metal contact pads, multiple metal via structures, and multiple vertical vias for formation of multiple vertical conductive structures.
    • 本发明涉及通过电镀形成垂直导电结构的方法。 具体地,首先形成模板结构,其包括衬底,位于衬底表面上的离散金属接触焊盘,分立金属接触焊盘和衬底两者之间的级间电介质(ILD)层,以及金属通孔结构 延伸穿过ILD层到分立的金属接触垫上。 接下来,在模板结构中形成垂直通孔,其延伸穿过ILD层到分立的金属接触垫上。 然后通过电镀在垂直通孔中形成垂直导电结构,电镀通过通过金属通孔结构将电镀电流施加到离散的金属接触焊盘来进行。 优选地,模板结构包括多个分立的金属接触焊盘,多个金属通孔结构以及用于形成多个垂直导电结构的多个垂直通孔。
    • 90. 发明授权
    • Document exploit detection using baseline comparison
    • 使用基准比较的文档利用检测
    • US09239922B1
    • 2016-01-19
    • US13794400
    • 2013-03-11
    • Xuewen ZhuXinfeng LiuXuebin ChenQiang Huang
    • Xuewen ZhuXinfeng LiuXuebin ChenQiang Huang
    • G06F21/56G06F21/55
    • G06F21/56G06F21/55G06F21/564
    • An application document known to include malware (such as a document exploit) is opened and executed by its corresponding software application. Behaviors of this document (such as registry, file system, network and process) are monitored and recorded using internal software drivers and hook modules. A behavior report is generated and a baseline pattern is created including a number of regular expressions. A suspicious document of the same type as the monitored document is opened and executed by the same corresponding software application. Behaviors are monitored in the same way and a behavior report is generated. This behavior report is compared to the baseline pattern and a determination is made as to whether a document exploit is present. Known benign documents may also be opened, monitored and their behavior recorded, resulting in creation of a known benign pattern for the corresponding software application.
    • 已知包括恶意软件(例如文档漏洞)的应用程序文档由相应的软件应用程序打开并执行。 使用内部软件驱动程序和挂钩模块监视和记录本文档的行为(如注册表,文件系统,网络和进程)。 生成行为报告,并创建一个基准模式,其中包含许多正则表达式。 与受监控文档相同类型的可疑文档由相同的相应软件应用程序打开和执行。 以相同的方式监视行为,并生成行为报告。 将该行为报告与基线模式进行比较,并确定文档漏洞是否存在。 已知的良性文件也可能被打开,监视并记录其行为,导致为相应的软件应用程序创建已知的良性模式。