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81. 发明专利

JPH0645475A SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH0645475A
公开(公告)日：1994-02-18
申请号：JP22689191
申请日：1991-09-06
申请人： HITACHI LTD , HITACHI TOBU SEMICONDUCTOR LTD
发明人： SATO YUKIHIRO , YAMADA TOMIO
IPC分类号： H01L23/28 , H01L23/29
摘要： PURPOSE:To prevent a sealing resin from cracking by fastening screws when mounting a semiconductor device while keeping the bonding strength between the heat sink of a semiconductor device and the sealing resin. CONSTITUTION:A header portion 5 through which a semiconductor device 2 is mounted by screws is integrally coupled to a part of a heat sink 1. A U-shaped notch 6 which is filled with a sealing resin 4 is formed at the coupling portion. An engaging portion 71 for securing the sealing resin 4 is formed on the semiconductor device side of the U-shaped notch 6. The header side of the notch 6 serves as an escape face 73. Even if the header portion 5 is bent by fastening the screws to mount the semiconductor device, stress originating from this deformation does not concentrate on the sealing resin 4. The deformation of the header portion 5 is absorbed by the U-shaped notch 6 and does not affect the heat sink 1 on the semiconductor device side.

82. 发明专利

JPH0513476A SEMICONDUCTOR DEVICE AND MANUFACTURE THEREOF 失效
公开(公告)号：JPH0513476A
公开(公告)日：1993-01-22
申请号：JP18564291
申请日：1991-06-28
申请人： HITACHI LTD , HITACHI TOBU SEMICONDUCTOR LTD
发明人： YAMADA TOMIO , HOSHI AKIRO , KAGII HIDEMASA
IPC分类号： H01L21/52
摘要： PURPOSE:To prevent stress induced due to the thermal expansion coefficient difference between a pellet and a base from concentrating on a glass-sealed section. CONSTITUTION:A buffer material layer 14 formed of silver paste 15 whose main component is silver is formed as thick as 0.020mm or above on a base 11 of alumina ceramic, and a silicon pellet 22 is bonded onto the buffer material layer 14 with a gold-silicon eutectic layer 21. By this setup, a deformation difference between a base 11 and a pellet 22 caused by a thermal expansion coefficient difference between alumina ceramic and silicon at the change of temperature can be absorbed by the plastic deformation of the buffer material layer 14, so that stress induced in the base 22 due to a deformation difference can be restrained, and as a result a glass-sealed part 24 can be protected against separation and cracks.

83. 发明专利

JPH0483370A SEMICONDUCTOR DEVICE AND MANUFACTURE THEREOF 失效
公开(公告)号：JPH0483370A
公开(公告)日：1992-03-17
申请号：JP19704590
申请日：1990-07-25
申请人： HITACHI LTD
发明人： YAMADA TOMIO , YAMAZAKI KAZUO
IPC分类号： H01L23/02 , H01L23/50
摘要： PURPOSE:To prevent positional accuracy of a lead from decreasing by allowing a protrusion to protrude from a glass sealing part of at least one of a base and a cap toward the other opposed surface, and supporting a lead group in contact with the protrusion. CONSTITUTION:A group of inner parts 9a is bridged between both protrusions 16a and 16b to be mechanically secured in a unit lead frame 2 on a low melting point glass layer 15. Since the protrusions 16a, 16b have a mechanical strength, a group of leads 9 by the protrusions 16a, 16b is effectively supported from below. In this case, if a superposed part 20 is placed on a multistage lead frame 1 to apply a suitable load thereto, the group of the leads 8 is forcibly sunk when the glass 15 is melted. Thus, the group of the leads 9 is effectively brought into contact with the protrusions 16a, 16b. Therefore, the positional accuracy of the group 9 to a base 11 accurately coincides with a predetermined size by the protrusions 16a, 16b.

84. 发明专利

JPH0430453A SEMICONDUCTOR DEVICE AND MANUFACTURE THEREOF 失效
公开(公告)号：JPH0430453A
公开(公告)日：1992-02-03
申请号：JP13569290
申请日：1990-05-25
申请人： HITACHI LTD
发明人： YAMADA TOMIO , YAMAZAKI KAZUO
IPC分类号： H01L23/40 , H01L21/56 , H01L23/28
摘要： PURPOSE:To prevent a resin sealed package formed on a base from being separated off without lessening pins provided to it in number by a method wherein anchor pins are provided to the base as fixed so s to project the collars of the pins into the resin sealed package. CONSTITUTION:Anchor pins 23 are provided to a base 11 of a PGA.IC 47 as fixed so as to project the collars 24 of the pins 23 which are protuberant in a radial direction into a resin sealed package 29. The collars 24 of the anchor pins 23 are made to bite into a part of the package 29 through its figure. By this setup, the resin sealed package 29 is surely prevented from being separated from the base 11 by the anchor pins 23.

85. 发明专利

JPH02172267A LEAD FRAME 失效
公开(公告)号：JPH02172267A
公开(公告)日：1990-07-03
申请号：JP32581688
申请日：1988-12-26
申请人： HITACHI LTD
发明人： YAMADA TOMIO , SHIMIZU KAZUO
IPC分类号： H01L21/52 , H01L23/50
摘要： PURPOSE:To improve pellet fixing strength and assembling yield by providing a part of a tab with slits, and arranging recessed parts in a region except slits in the tab surface periphery. CONSTITUTION:Slits 2 are formed in a part of a tab 1. In a region except slits 2 in the upper surface periphery of the tab 1, recessed parts are formed. That is, slit edge parts are left and other parts 4 are thinly formed. The other parts 4 except the edge parts of the slits 2 of the tab 1 provided with the slits 2 are thinly formed in this manner, so that the edge parts of the slits 2 act as embankments. When, after Ag paste 6 is spread, an Si chip 7 is pressed down for pellet fixing and the Ag paste 6 is pushed out, the paste is blocked by the embankments and can be prevented from protruding in the slits 2. As a result, bonding can be performed with a normal amount of paste, and stable working is enabled. Thereby pellet fixing strength and assembling yield can be improved.

86. 发明专利

JPH01279081A RECEIVING CONTAINER 失效
公开(公告)号：JPH01279081A
公开(公告)日：1989-11-09
申请号：JP11009088
申请日：1988-05-06
申请人： HITACHI LTD
发明人： YAMADA TOMIO
IPC分类号： B65D21/02 , B65D85/38 , B65D85/86
摘要： PURPOSE:To prevent all-directional movement of articles to be received in receptacles, by forming, on the upper side of the receptacle, a positioning part which restricts a lateral displacement of the articles and forming, on the under side of the recess, a downward projecting part which restricts a vertical displacement of the articles received in the upper receptacle. CONSTITUTION:A CLCC/IC chip 1 is received in a recess 12 of a receptacle 10 such that outer lead wires 3 of the chips is directed upward, and a package 2 for the chip is aligned with a positioning part 13 which serves to restrict a lateral displacement of the chip 1. After all recesses 12 receive the IC chips 1, a body 11 of the receptacle 10 is overlaid with a body 11 of another receptacle 10, upon which a male section 16 formed on an outer periphery of the lower body 11 is engaged with a female section 17 correspondingly formed on an outer periphery of the upper body 11. When the receptacles are stacked with proper positioning, a downward projecting portion 15 formed on the underside of the upper receptacle 10 is located in the proximity of the package 2 of the IC chip 1 which is received into the recess 12 of the lower receptacle 10, whereby the IC chip 1 is prevented from vertical displacement.

87. 发明专利

JPS63208258A MANUFACTURE OF ELECTRONIC DEVICE 失效
公开(公告)号：JPS63208258A
公开(公告)日：1988-08-29
申请号：JP4026987
申请日：1987-02-25
申请人： HITACHI LTD
发明人： OKADA SUMIO , YAMADA TOMIO , SHIMIZU KAZUO , HOSHI AKIRO
IPC分类号： H01L23/50
摘要： PURPOSE:To enhance reliability in connection, appearance and performance after surface mounting, by cutting the tips of outer leads from an outer frame before solder plating in a lead frame, and depositing a solder plated film on the entire surface mounting part of each outer lead. CONSTITUTION:Outer leads 5 are separated from an outer frame 7 before solder plating. A solder plated film is formed on the entire mounting part of each outer lead 5 in a solder plating step. Since the solder plating is applied on the entire surface mounting part of each outer lead 5, the solder material is sucked up to the mounting part of each outer lead 5 and uniformly attached to the entire body. Therefore decrease in reliability of connection and appearance after mounting can be suppressed.

88. 发明专利

JPS62281436A ELECTRONIC DEVICE 失效
公开(公告)号：JPS62281436A
公开(公告)日：1987-12-07
申请号：JP12340086
申请日：1986-05-30
申请人： HITACHI LTD , HITACHI TOKYO ELECTRONICS
发明人： YAMADA TOMIO , OURA TOSHIYUKI
IPC分类号： H01L21/60
摘要： PURPOSE:To inhibit the need for changing a layout of integrated circuit by arranging conductors for junction at an outer portion of pellet and connecting a part of circuits at the pellet as well as a part of leads to the above conductors respectively. CONSTITUTION:Conductors 9 and 10 for junction are arranged at an outer portion of pellet 4 and a part of circuits at the pellet 4 and a part of leads 6 are electrically connected to these conductors 9 and 10 respectively. For instance, a first and second conductors 9 and 10 for junction are arranged respectively on an upper face of ceramic base 1 at portions which turn out to be sealed parts 11 of void spaces located at both fringe parts where inner leads are not arranged and are formed by the use of group silver-palladium alloy according to a thick film formation technology and the like such as a screen process printing. And then, power circuits for pellet 4 are connected to outer leads 7b for power source through the first conductor 9 for junction as well as inner leads 6b, while gland circuits for pellet 4 are connected to the outer leads 7d for gland through the second conductor 10 for junction as well as the inner leads 6d.

89. 发明专利

JPS62276863A ELECTRONIC DEVICE 失效
公开(公告)号：JPS62276863A
公开(公告)日：1987-12-01
申请号：JP11922686
申请日：1986-05-26
申请人： HITACHI LTD
发明人： YAMADA TOMIO , YOSHIZAWA TOSHINORI
IPC分类号： H01L23/48 , H01L23/31 , H01L23/492
摘要： PURPOSE:To prevent a pellet from being damaged, by forming recessed and projecting parts on the periphery of a header inside a resin-sealed package. CONSTITUTION:A transistor 1 is formed of a resin-sealed package 9 which is unitedly molded so that the part except the bottom plane of the header 2, inner leads 3, a pellet 5, and bonding wires 6 are non-hermetically sealed. Recessed and projecting parts 8 on a collar part 7 formed on the upper periphery of the header 2 are completely buried inside the package 9. Resin in the package 9 is prevented from moving because of its sticking to the collar part 7 and the recessed and projecting part 8, and its causing mechanical restriction. Stress of the resin applied to the pellet 5 is thus detered or suppressed, and therefere the pellet 5 can be prevented from being damaged.

90. 发明专利

JPS6245156A HRMETIC SEALED ELECTRONIC DEVICE 失效
公开(公告)号：JPS6245156A
公开(公告)日：1987-02-27
申请号：JP18412085
申请日：1985-08-23
申请人： HITACHI LTD
发明人： YAMADA TOMIO
IPC分类号： H01L23/50 , H01L23/495
摘要： PURPOSE:To use the back of an IC chip as GND and realize size reduction of the IC by a method wherein a lead frame which has tab-hanging leads is employed as the lead frame of a ceramic package and the IC chip is stuck to that tab so as to be electrically continuous. CONSTITUTION:An IC chip 1 is stuck on a tab 2 woth heat-resistant conductive paste 3. Leads 4a and 4b are connected to the circuit pattern formed on a printed circuit substrate. Bonding wires 5a and 5b are connected to the inner leads 4a and 4b. Ceramic packages 6 and 7, which the molding bodies, and a lead frame 10 are joined with low melting point glass 8 and 9, which is molding material, and the IC chip 1 is molded. The lead frame 10, in which the tab 2 is hanged by tab-hanging leads 20 made of gold and nickel alloy, is employed to stick the IC chip 1 on the tab 2 and connect the IC chip 1 to GND through a GND lead 4c connected to the tab-hanging lead 20. With this constitution, electrical floating of the IC chip 1 can be avoided.

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