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81. 发明公开

EP1053076A4 POLISHING APPARATUS AND POLISHING TABLE THEREFOR 审中-公开
标题翻译：研磨装置及THEREFOR研磨平台
公开(公告)号：EP1053076A4
公开(公告)日：2001-03-06
申请号：EP99901202
申请日：1999-02-01
申请人： EBARA CORP
发明人： KIMURA NORIO , ISHII YU
IPC分类号： B24B37/00 , B24B37/015 , B24B49/14 , H01L21/304
CPC分类号： B24B37/11 , B24B37/015

82. 发明公开

EP2199018A4 POLISHING DEVICE 审中-公开
标题翻译：磨光装置
公开(公告)号：EP2199018A4
公开(公告)日：2013-01-09
申请号：EP08791844
申请日：2008-07-23
申请人： EBARA CORP
发明人： KIMURA NORIO , ITO KENYA , TAKAHASHI TAMAMI , SEKI MASAYA
IPC分类号： B24B21/18 , B24B9/00 , B24B9/06 , B24B21/00
CPC分类号： B24B9/065

84. 发明公开

EP0992322A4 POLISHING DEVICE 审中-公开
标题翻译： SCHLEIFVORRICHTUNG
公开(公告)号：EP0992322A4
公开(公告)日：2006-09-27
申请号：EP99912102
申请日：1999-04-05
申请人： EBARA CORP
发明人： KIMURA NORIO , MARUYAMA TORU , KOJIMA SHUNICHIRO , KATSUOKA SEIJI , OHWADA SHIN
IPC分类号： B24B37/00 , B24B37/005 , B24B37/32 , B24B49/16 , B24B55/02 , H01L21/304
CPC分类号： B24B37/32 , B24B49/16
摘要： A polishing device for polishing an object to be polished such as a semiconductor wafer to a flat and mirror finish, comprising a turn table on the upper surface of which an abrasive cloth is pasted and a top ring (1), wherein a semiconductor wafer interposed between the turn table and the top ring (1) is pressed with a specified strength and is polished to a flat and mirror finish, the polishing device further comprising a vertically movable pressing ring (3) disposed around the top ring (1) having a recess to receive a semiconductor wafer and a pressing means (22) for pressing the pressing ring (3) to the abrasive cloth with a variable force, the pressing ring (3) being supported on the top ring (1) via a bearing (37).
摘要翻译： 1。一种研磨装置，其将半导体晶片等被研磨物研磨成平坦且镜面精加工，其特征在于，在上表面粘贴有研磨布的转台和顶环（1）中，在转台和顶环（1）之间以规定的强度压制并且抛光成平坦且镜面抛光，所述抛光装置还包括围绕顶环（1）设置的可垂直移动的压环（3），所述压环用于容纳半导体晶片的凹槽以及用于以可变力将压环（3）压到砂布上的压紧装置（22），压环（3）通过轴承（37）支撑在顶环（1）上，）。

85. 发明公开

EP0807492A3 Method for polishing workpieces and apparatus therefor 失效
标题翻译：用于抛光工件的方法和装置
公开(公告)号：EP0807492A3
公开(公告)日：1998-11-04
申请号：EP97108027
申请日：1997-05-16
申请人： EBARA CORP
发明人： SHIMIZU NOBURU , KIMURA NORIO
IPC分类号： B24B27/00 , B24B37/04 , B24B37/07 , B24B37/10 , B24B37/11
CPC分类号： B24B37/042 , B24B27/0023 , B24B37/07 , B24B37/10 , B24B37/11
摘要： A polishing method and a compact apparatus for the method are presented for efficient production of a polished workpiece for manufacturing high technology devices. The polishing method comprises a first and second steps for polishing a work surface. In the first polishing step, the work surface is pressed against an abrading surface of a first polishing tool which is being rotated. In the second step, the work surface is pressed against a rubbing surface of a second polishing tool which is being moved in a planar translation motion relatively to the work surface.

86. 发明公开

EP0812656A3 Dressing device for dressing a polishing pad in a lapping machine 失效
标题翻译： Abrichtvorrichtung zum Abrichten eines Polierkissen在einerLäppmaschine
公开(公告)号：EP0812656A3
公开(公告)日：1998-07-15
申请号：EP97116489
申请日：1993-09-22
申请人： EBARA CORP
发明人： HIROSE MASAYOSHI , ISHIKAWA SEIJI , KIMURA NORIO , KAWASHIMA KIYOTAKA , ISHII YOU
IPC分类号： B24B37/26 , B24B53/007 , B24B53/017 , B24B37/04
CPC分类号： B24B53/017 , B24B37/26
摘要： A turntable with an abrasive cloth mounted thereon and a top ring positioned above the turntable are independently rotatably provided. The top ring holds a workpiece to be polished and presses the workpiece against the abrasive cloth. The turntable and the top ring are rotated to polish the surface of the workpiece to a flat mirror finish on the abrasive cloth. A rotatable brush pressed against the abrasive cloth is rotated about an axis substantially perpendicularly to the plane of the abrasive cloth, and oscillated substantially radially between radially inner and outer positions over the abrasive cloth. A cleaning solution is sprayed from a nozzle onto the abrasive cloth. The turntable has a bank along an outer circumferential edge thereof for preventing a protective solution, which is supplied to the abrasive cloth to keep the abrasive cloth wet and prevent it, from flowing off the turntable when the turntable is stationary.
摘要翻译：具有安装在其上的研磨布的转盘和位于转台上方的顶环可独立地可旋转地设置。顶环保持要抛光的工件，并将工件压在研磨布上。转盘和顶环旋转以将工件的表面抛光到研磨布上的平整镜面。压在研磨布上的可旋转刷子围绕基本上垂直于研磨布平面的轴线旋转，并且在磨料布的径向内部和外部位置之间基本径向摆动。将清洁溶液从喷嘴喷射到研磨布上。转台沿其外圆周边缘具有一个堤，用于防止当转盘静止时供给磨料以保持磨料湿润并防止磨损的保护液从转盘流出。

87. 发明专利

DE60141186D1 未知
公开(公告)号：DE60141186D1
公开(公告)日：2010-03-11
申请号：DE60141186
申请日：2001-05-28
申请人： EBARA CORP
发明人： MISHIMA KOJI , KUNISAWA JUNJI , MAKINO NATSUKI , KIMURA NORIO , INOUE HIROAKI , NAKAMURA KENJI , MATSUMOTO MORIJI , NANJO TAKAHIRO , ODAGAKI MITSUKO
IPC分类号： H01L21/00 , H01L21/677 , H01L21/68
摘要： A substrate processing apparatus fills a metal such as copper or the like in fine interconnection patterns or trenches defined in a semiconductor substrate. The substrate processing apparatus has a loading/unloading unit for placing a substrate cassette to load and unload a substrate, a substrate treating unit for treating a substrate, and a transfer robot for transferring a substrate between the loading/unloading unit and the substrate treating unit. The loading/unloading unit, the substrate treating unit, and the transfer robot are installed in a single facility. The loading/unloading unit has a rotary table which is horizontally rotatable for positioning the substrate cassette in a position to detect the substrate cassette placed in the loading/unloading unit and to remove the substrate from the substrate cassette with the transfer robot.

88. 发明专利

DE69839066D1 未知
公开(公告)号：DE69839066D1
公开(公告)日：2008-03-20
申请号：DE69839066
申请日：1998-09-17
申请人： EBARA CORP
发明人： HONGO AKIHISA , OGURE NAOAKI , INOUE HIROAKI , KIMURA NORIO , KURIYAMA FUMIO , TSUJIMURA MANABU , SUZUKI KENICHI , CHONO ATSUSHI
IPC分类号： H01L21/00 , C25D7/12 , H01L21/288 , H01L21/768
摘要： A substrate plating apparatus forms an interconnection layer on an interconnection region composed of a fine groove and/or a fine hole defined in a substrate. The substrate plating apparatus includes a plating unit for forming a plated layer on a surface of the substrate including the interconnection region, a chemical mechanical polishing unit for chemically mechanically polishing the substrate to remove the plated layer from the surface of the substrate leaving a portion of the plated layer in the interconnection region, a cleaning unit for cleaning the substrate after the plated layer is formed or the substrate is chemically mechanically polished, a drying unit for drying the substrate after the substrate is cleaned, and a substrate transfer unit for transferring the substrate to and from each of the first plating unit, the first chemical mechanical polishing unit, the cleaning unit, and the drying unit. The first plating unit, the first chemical mechanical polishing unit, the cleaning unit, the drying unit, and the substrate transfer unit being combined into a single unitary arrangement.

89. 发明专利

DE60021149T2 未知
公开(公告)号：DE60021149T2
公开(公告)日：2006-04-27
申请号：DE60021149
申请日：2000-04-10
申请人： EBARA CORP
发明人： KIMURA NORIO , SHIRAKASHI MITSUHIKO , TOKUSHIGE KATSUHIKO , ASAMI MASAO , MIYASHITA NAOTO , KODERA MASAKO , MATSUI YOSHITAKA , NADAHARA SOICHI , TOMITA HIROSHI
IPC分类号： H01L21/304 , B24B37/34 , H01L21/302
摘要： A polishing apparatus is used for chemical mechanical polishing a copper (Cu) layer formed on a substrate such as a semiconductor wafer (20) and then cleaning the polished substrate. A polishing apparatus comprises a polishing section having a turntable (9) with a polishing surface and a top ring (13) for holding a substrate and pressing the substrate against the polishing surface to polish a surface having semiconductor device thereon, and a cleaning section (7) for cleaning the substrate which has been polished. The cleaning section has an electrolyzed water supply device (25) for supplying electrolyzed water to the substrate to clean the polished surface of the substrate while supplying electrolyzed water to the substrate.

90. 发明专利

DE60020760D1 未知
公开(公告)号：DE60020760D1
公开(公告)日：2005-07-21
申请号：DE60020760
申请日：2000-03-13
申请人： EBARA CORP
发明人： SATOH ICHIJU , KIMURA NORIO
IPC分类号： B24B21/00 , B24B21/18 , B24B31/00 , B24B53/017 , H01L21/304 , B24B37/04
摘要： A dressing apparatus that dresses the polishing surface of a turntable while controlling the orientation of a dresser body with electromagnetic forces, thereby allowing an increase in the degree of flatness of the polishing surface of the turntable. A polishing apparatus having the dressing apparatus is also provided. A dressing apparatus for dressing a polishing surface on a turntable that comes in sliding contact with an object to be polished includes a dresser body which dresses the polishing surface by contacting it. A pressing device presses the dresser body against the polishing surface of the turntable. An orientation controller controls the orientation of the dresser body by utilizing electromagnetic forces.

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