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    • 84. 发明授权
    • Method of manufacturing a semiconductor wafer
    • 制造半导体晶片的方法
    • US06893944B2
    • 2005-05-17
    • US10613616
    • 2003-07-03
    • Dong Ho LeeNoh Yeal Kwak
    • Dong Ho LeeNoh Yeal Kwak
    • H01L21/324H01L21/322
    • H01L21/3225
    • Disclosed is a method of manufacturing a semiconductor wafer. In the present invention, a nucleation site is formed in a region deep into the wafer through low-temperature annealing process, and oxygen or precipitation material, the metallic impurity, or the like is trapped in the nucleation site through rapid thermal annealing process. As a gettering effect is improved using the rapid thermal annealing process, the concentration of the impurity on the surface of the wafer can be lowered and the reliability of the device could be improved. Further, the annealing steps can be reduced than the prior art and the productivity of the device can thus be increased.
    • 公开了半导体晶片的制造方法。 在本发明中,通过低温退火工艺在晶片深处形成成核点,通过快速热退火处理将氧或析出物,金属杂质等捕获在成核部位。 由于使用快速热退火工艺提高了吸气效果,因此可以降低晶片表面上的杂质浓度,并且可以提高器件的可靠性。 此外,退火步骤可以比现有技术减少,因此可以提高装置的生产率。
    • 85. 发明授权
    • Method of manufacturing a semiconductor device
    • 制造半导体器件的方法
    • US06248619B1
    • 2001-06-19
    • US09325344
    • 1999-06-04
    • Dong Ho LeeSeung Woo Jin
    • Dong Ho LeeSeung Woo Jin
    • H01L218238
    • H01L21/823807H01L21/823892
    • The president invention discloses a method of manufacturing a semiconductor device, comprising the steps of: defining a cell region for an NMOS element and a peripheral circuit region for NMOS and PMOS elements on a semiconductor substrate; forming a sacrifice oxide film and an ion barrier oxide film on the entire structure after the defining process; performing ion injection process on the cell region and the peripheral circuit region, so that a low concentration impurity injection region therein is formed; removing the ion barrier oxide film formed on the cell region and the peripheral circuit region; performing ion injection process on selected regions of the cell region and the peripheral circuit region; injecting ions for adjusting a threshold voltage into selected regions of the cell region and the peripheral circuit region; performing ion injection process on the low concentration impurity regions of the cell region and the peripheral circuit region, so that R-well region and a P-well region are formed, respectively; removing the ion barrier oxide film on the peripheral circuit region; and performing ion injection process for adjusting the threshold voltage on the cell region and the peripheral circuit region.
    • 总裁发明公开了一种制造半导体器件的方法,包括以下步骤:在半导体衬底上限定用于NMOS元件的单元区域和用于NMOS和PMOS元件的外围电路区域; 在定义过程之后,在整个结构上形成牺牲氧化物膜和离子屏障氧化膜; 对单元区域和外围电路区域进行离子注入处理,从而形成低浓度杂质注入区域; 除去形成在电池区域和外围电路区域上的离子阻挡氧化膜; 对单元区域和外围电路区域的选定区域进行离子注入处理; 注入离子以将阈值电压调整到单元区域和外围电路区域的选定区域中; 对单元区域和外围电路区域的低浓度杂质区域进行离子注入处理,分别形成R阱区域和P阱区域; 除去外围电路区域上的离子阻挡氧化膜; 并进行用于调整单元区域和外围电路区域的阈值电压的离子注入处理。