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    • 82. 发明申请
    • III-Nitride Device Grown on Edge-Dislocation Template
    • 边缘位错模板上生长的III型氮化物器件
    • US20090032828A1
    • 2009-02-05
    • US11833921
    • 2007-08-03
    • Linda T. RomanoPatrick N. Grillot
    • Linda T. RomanoPatrick N. Grillot
    • H01L33/00H01L21/20
    • H01L33/32H01L21/02378H01L21/0242H01L21/02458H01L21/02505H01L21/02507H01L21/02513H01L21/0254H01L33/12
    • A semiconductor light emitting device includes a wurtzite III-nitride semiconductor structure including a light emitting layer disposed between an n-type region and a p-type region. A template layer and a dislocation bending layer are grown before the light emitting layer. The template layer is grown such that at least 70% of the dislocations in the template layer are edge dislocations. At least some of the edge dislocations in the template layer continue into the dislocation bending layer. The dislocation bending layer is grown to have a different magnitude of strain than the template layer. The change in strain at the interface between the template layer and the dislocation bending layer causes at least some of the edge dislocations in the template layer to bend to a different orientation in the dislocation bending layer. Semiconductor material grown above the bent edge dislocations may exhibit reduced strain.
    • 半导体发光器件包括含有设置在n型区域和p型区域之间的发光层的纤锌矿III族氮化物半导体结构。 模板层和位错弯曲层在发光层之前生长。 生长模板层使得模板层中至少70%的位错是边缘位错。 模板层中的至少一些边缘位错继续进入位错弯曲层。 使位错弯曲层生长成具有与模板层不同的应变大小。 在模板层和位错弯曲层之间的界面处的应变变化导致模板层中的至少一些边缘位错在位错弯曲层中弯曲成不同的取向。 在弯曲边缘位错以上生长的半导体材料可能表现出减小的应变。
    • 87. 发明授权
    • Spring structure with stress-balancing layer
    • 弹簧结构应力平衡层
    • US06794737B2
    • 2004-09-21
    • US09976394
    • 2001-10-12
    • Linda T. RomanoDavid K. Fork
    • Linda T. RomanoDavid K. Fork
    • H01L2150
    • H05K3/4092G01R1/06727G01R3/00H01L2924/0002Y10T29/4913H01L2924/00
    • A stress-balancing layer formed over portions of a spring metal finger that remain attached to an underlying substrate to counter internal stresses inherently formed in the spring metal finger. The (e.g., positive) internal stress of the spring metal causes the claw (tip) of the spring metal finger to bend away from the substrate when an underlying release material is removed. The stress-balancing pad is formed on an anchor portion of the spring metal finger, and includes an opposite (e.g., negative) internal stress that counters the positive stress of the spring metal finger. A stress-balancing layer is either initially formed over the entire spring metal finger and then partially removed (etched) from the claw portion, or selectively deposited only on the anchor portion of the spring metal finger. An interposing etch stop layer is used when the same material composition is used to form both the spring metal and stress-balancing layers.
    • 应力平衡层形成在弹簧金属指的部分上,其保持附接到下面的基底以抵抗固有地形成在弹簧金属指中的内部应力。 弹簧金属的(例如正)内部应力导致弹簧金属指的爪(尖端)在移除下面的剥离材料时远离基底弯曲。 应力平衡垫形成在弹簧金属指的锚固部分上,并且包括抵抗弹簧金属指的正应力的相反(例如负的)内部应力。 最初在整个弹簧金属指上形成应力平衡层,然后部分地从爪部移除(蚀刻),或者仅选择性地沉积在弹簧金属指的锚定部分上。 当使用相同的材​​料组成来形成弹簧金属和应力平衡层时,使用插入式蚀刻停止层。
    • 88. 发明授权
    • Field emission display device
    • 场致发射显示装置
    • US06781159B2
    • 2004-08-24
    • US09998334
    • 2001-12-03
    • Linda T. RomanoDavid K. Biegelsen
    • Linda T. RomanoDavid K. Biegelsen
    • H01L3300
    • H01J1/3044H01J9/025
    • An improved nanotip structure and method for forming the nanotip structure and a display system using the improved nanotip structure is described. The described nanotip is formed from a semiconductor having a crystalline structure such as gallium nitride. The crystalline structure preferably forms dislocations oriented in the direction of the nanotips. One method of forming the nanotip structure uses the relatively slow etching rates that occur around the dislocations compared to the faster etch rates that occur in other parts of the semiconductor structure. The slower etching around dislocations enables the formation of relatively high aspect ratio nanotips in the dislocation area.
    • 描述了用于形成纳米尖端结构的改进的纳米尖端结构和方法以及使用改进的纳米尖端结构的显示系统。 所描述的纳米尖端由具有诸如氮化镓的晶体结构的半导体形成。 晶体结构优选地形成在纳米尖端方向上取向的位错。 与在半导体结构的其它部分中发生的更快的蚀刻速率相比,形成纳米尖端结构的一种方法使用在位错周围发生的相对慢的蚀刻速率。 在位错周围较慢的蚀刻使得能够在位错区域中形成相对高的纵横比的纳米尖端。