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    • 81. 发明授权
    • Cooling arrangement for high performance electronic components
    • 高性能电子元件的冷却方案
    • US06421240B1
    • 2002-07-16
    • US09845367
    • 2001-04-30
    • Chandrakant D. Patel
    • Chandrakant D. Patel
    • H05K720
    • H05K7/20763
    • A cooling arrangement facilitates the cooler and quieter operation of an electronic system located within an enclosure, wherein the electronic system includes a plurality of circuit boards having a plurality of integrated circuit elements disposed within a lower portion of the enclosure. In one embodiment, the cooling arrangement includes a pump located within the enclosure that has a first and second coolant ports and a heat exchanger that is disposed within a top portion of the enclosure and is coupled to the first coolant port. The cooling arrangement also includes a thermally conductive member having a first surface and a second surface, the first surface being in thermal contact with at least one of the integrated circuit elements. A first cooling plate arrangement having a coolant channel with a first end coupled to the second coolant port and a second end coupled to the heat exchanger. A cold plate is included in the cooling arrangement that is in thermal contact with the second surface of the thermally conductive member.
    • 冷却装置有助于位于外壳内的电子系统的更冷和更安静的操作,其中电子系统包括多个电路板,其具有设置在外壳的下部内的多个集成电路元件。 在一个实施例中,冷却装置包括位于外壳内的泵,其具有第一和第二冷却剂端口以及设置在外壳的顶部内部并且联接到第一冷却剂端口的热交换器。 所述冷却装置还包括具有第一表面和第二表面的导热构件,所述第一表面与所述集成电路元件中的至少一个热接触。 具有冷却剂通道的第一冷却板装置,其具有联接到第二冷却剂端口的第一端和联接到热交换器的第二端。 在与导热构件的第二表面热接触的冷却装置中包括冷板。
    • 82. 发明授权
    • Heat dissipating chassis member
    • 散热底盘部件
    • US06418017B1
    • 2002-07-09
    • US09539724
    • 2000-03-30
    • Chandrakant D. PatelMarvin S. Keshner
    • Chandrakant D. PatelMarvin S. Keshner
    • H05K720
    • H05K7/20336G06F1/203G06F2200/201H01L23/427H01L2924/0002H01L2924/00
    • The invention provides a chassis member, which may be made of a cast material such as magnesium, aluminum, or plastic, for mechanically supporting a heat producing electronic device in which the chassis member has a base and a cavity integral to the chassis member. In a preferred embodiment, the cavity is in the form of a channel that is created by boring. The channel may be evacuated and has an evaporator section, a condenser section, and a working fluid confined therein by a seal. The channel receives heat from an electronic device in an evaporator section of the channel and dissipates heat from the condenser section of the channel. Different types of wicks may be employed. In one embodiment, a completely fabricated heat pipe is inserted into the integrated channel. In other embodiments, a cavity in the form of a heat dissipating channel matrix, serpentine shape, flat shape, or in other forms or shapes are provided.
    • 本发明提供了一种底盘构件,其可以由诸如镁,铝或塑料的铸造材料制成,用于机械地支撑其中底盘构件具有底座和与底座构件成一体的空腔的发热电子装置。 在优选实施例中,空腔是通过钻孔产生的通道的形式。 通道可以被抽真空并且具有通过密封限制在其中的蒸发器部分,冷凝器部分和工作流体。 通道从通道的蒸发器部分中的电子设备接收热量,并且从通道的冷凝器部分散发热量。 可以使用不同类型的灯芯。 在一个实施例中,将完全制造的热管插入集成通道中。 在其它实施例中,提供了散热通道矩阵,蛇形形状,扁平形状或其它形式或形状形式的空腔。
    • 87. 发明授权
    • Small form factor air jet cooling system
    • 小型空气喷射冷却系统
    • US07361081B2
    • 2008-04-22
    • US10898736
    • 2004-07-23
    • Abdlmonem H. BeitelmalChandrakant D. PatelCullen E. Bash
    • Abdlmonem H. BeitelmalChandrakant D. PatelCullen E. Bash
    • H05K5/02
    • H05K7/20727
    • An enclosure forms a plurality of tiers vertically stacked in a longitudinal dimension. Each tier is a 1U modular computer system having a computer chassis configured for mounting in the multi-tiered support, and computer components that need cooling within the computer chassis. A cooling system is formed by a plenum pressurized by a blower. The plenum defines a plurality of configurable orifices in the chassis, each directing pressurized air toward a component. The plenum includes adjustable valves to controllably limit airflow through the orifices, and a controller to control the air pressure within the plenum and the orifice flow rates through the valves.
    • 外壳形成在纵向尺寸上垂直堆叠的多个层。 每个层是1U模块化计算机系统,其具有配置成安装在多层支持中的计算机机箱以及需要在计算机机箱内进行冷却的计算机组件。 冷却系统由通过鼓风机加压的增压室形成。 气室在底盘中限定了多个可配置的孔,每个将加压空气朝向组件。 气室包括可调节的阀门,以可控地限制通过孔口的气流,以及控制器来控制气室内的空气压力和通过阀门的孔口流量。
    • 89. 发明授权
    • Two-fluid spray cooling system
    • 双流体喷雾冷却系统
    • US07284389B2
    • 2007-10-23
    • US11040403
    • 2005-01-21
    • Ratnesh SharmaCullen E. BashChandrakant D. Patel
    • Ratnesh SharmaCullen E. BashChandrakant D. Patel
    • F25D3/00
    • H01L23/4735H01L2224/16H01L2224/73253H01L2924/00011H01L2924/00014H01L2224/0401
    • A cooling system including a housing forming a cooling chamber containing the component submerged in a pool of alcohol, oil or glycerine, a sprayer configured to spray water at the component through the oil or glycerine, and a heat exchanger configured to cool the oil or glycerine. A control system receives heat-generation information from temperature sensors on water-impingement regions of the component, and controls the spraying in response to this information. A pump pumps the oil or glycerine from a lower portion of the cooling chamber to the heat exchanger. A sprayer inlet draws water from an upper portion of the cooling chamber, or from a lower portion of a reservoir connected to the heat exchanger. Oil or glycerine is passed from a portion of the heat exchanger reservoir back to the cooling chamber, and water passes from an upper portion of the reservoir to the sprayer. Alternatively, the oil or glycerine could be replaced with helium.
    • 一种冷却系统,包括形成包含浸没在醇,油或甘油池中的组分的冷却室的壳体,被配置为通过油或甘油喷射组分的水的喷雾器和被配置为冷却油或甘油的热交换器 。 控制系统从部件的水冲击区域的温度传感器接收发热信息,并根据该信息控制喷射。 泵将油或甘油从冷却室的下部泵送到热交换器。 喷雾器入口从冷却室的上部或从连接到热交换器的储存器的下部抽出水。 油或甘油从热交换器储存器的一部分返回到冷却室,并且水从贮存器的上部通过喷雾器。 或者,油或甘油可以用氦代替。