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    • 83. 发明申请
    • PROGRAMMING NON-VOLATILE STORAGE ELEMENT USING CURRENT FROM OTHER ELEMENT
    • 使用其他元素的电流编程非易失性存储元件
    • US20110235405A1
    • 2011-09-29
    • US13154832
    • 2011-06-07
    • Roy E. Scheuerlein
    • Roy E. Scheuerlein
    • G11C11/00
    • G11C13/0007G11C13/0069G11C2013/0078G11C2213/32G11C2213/34G11C2213/71G11C2213/72
    • A non-volatile storage apparatus includes a set of Y lines, a common X line, multiple storage elements each of which is connected to the common X line, and control circuitry in communication with the common X line and the set of Y lines. The multiple data storage elements are capable of being in a first state or a second state. The control circuitry provides control signals to the common X line and the set of Y lines to change a first data storage element of the multiple data storage elements from the first state to the second state by passing a current into the first data storage element from a different Y line through a different storage element. The control circuitry provides control signals to the common X line and the set of Y lines to sequentially change additional data storage elements of the multiple data storage elements from the first state to the second state by passing currents into the additional data storage elements from data storage elements of the multiple data storage elements that were previously changed to the second state and their associated different Y lines.
    • 非易失性存储装置包括一组Y线,公共X线,多个存储元件,每个存储元件连接到公共X线,以及与公共X线和Y线组通信的控制电路。 多个数据存储元件能够处于第一状态或第二状态。 控制电路向公共X线和Y线组提供控制信号,以将多个数据存储元件的第一数据存储元件从第一状态改变到第二状态,通过将电流从第一数据存储元件 不同的Y线通过不同的存储元件。 控制电路向公共X线路和Y线组提供控制信号,以通过将电流从数据存储器传递到附加数据存储元件中来顺序地将多个数据存储元件的附加数据存储元件从第一状态改变到第二状态 先前更改为第二状态的多个数据存储元素的元素及其相关的不同Y行。
    • 87. 发明授权
    • Method for fabricating high density pillar structures by double patterning using positive photoresist
    • 通过使用正性光致抗蚀剂的双重图案制造高密度柱结构的方法
    • US07935553B2
    • 2011-05-03
    • US12777046
    • 2010-05-10
    • Roy E. ScheuerleinSteven Radigan
    • Roy E. ScheuerleinSteven Radigan
    • H01L21/00
    • H01L27/1021H01L27/101H01L27/2409H01L27/2463H01L45/04H01L45/06H01L45/085H01L45/14H01L45/146H01L45/147H01L45/149H01L45/16
    • A method of making a semiconductor device includes forming a first photoresist layer over an underlying layer, patterning the first photoresist layer into a first photoresist pattern, wherein the first photoresist pattern comprises a plurality of spaced apart first photoresist features located over the underlying layer, and etching the underlying layer using the first photoresist pattern as a mask to form a plurality of first spaced apart features. The method further includes removing the first photoresist pattern, forming a second photoresist layer over the plurality of first spaced apart features, and patterning the second photoresist layer into a second photoresist pattern, wherein the second photoresist pattern comprises a plurality of second photoresist features covering edge portions of the plurality of first spaced apart features. The method also includes etching exposed portions of the plurality of first spaced apart features using the second photoresist pattern as a mask, such that a plurality of spaced apart edge portions of the plurality of first spaced apart features remain, and removing the second photoresist pattern.
    • 制造半导体器件的方法包括在下层上形成第一光致抗蚀剂层,将第一光致抗蚀剂层图案化为第一光致抗蚀剂图案,其中第一光致抗蚀剂图案包括位于下层之上的多个间隔开的第一光致抗蚀剂特征,以及 使用第一光致抗蚀剂图案作为掩模蚀刻下层,以形成多个第一间隔的特征。 该方法还包括去除第一光致抗蚀剂图案,在多个第一间隔开的特征上形成第二光致抗蚀剂层,以及将第二光致抗蚀剂层图案化为第二光致抗蚀剂图案,其中第二光致抗蚀剂图案包括覆盖边缘 多个第一间隔开的特征部分。 该方法还包括使用第二光致抗蚀剂图案作为掩模蚀刻多个第一间隔开的特征的暴露部分,使得多个第一间隔开的特征中的多个间隔开的边缘部分保留,并且去除第二光致抗蚀剂图案。