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81. 发明申请

US20110264514A1 BILLING METHOD AND SYSTEM THAT DETERMINES ADVERTISEMENT COSTS ACCORDING TO UNIT TIME 审中-公开
标题翻译：根据单位时间确定广告费用的计费方法和系统
公开(公告)号：US20110264514A1
公开(公告)日：2011-10-27
申请号：US13123502
申请日：2009-10-09
申请人： Ki Oh Kwon , Yuwon Kim , Won Sook Noh , Woongsup Shin , Woosung Lee , Min Seon Jeon , Seojin Han , Ha Nyung Chung
发明人： Ki Oh Kwon , Yuwon Kim , Won Sook Noh , Woongsup Shin , Woosung Lee , Min Seon Jeon , Seojin Han , Ha Nyung Chung
IPC分类号： G06Q30/00
CPC分类号： G06Q30/04 , G06Q30/02 , G06Q30/0242 , G06Q30/0246
摘要： A charging method and system for determining an advertising cost according to a unit time are provided. The charging method includes checking a performance index numerically indicating performance of an advertisement; checking a priority index of a next-priority advertisement to the advertisement; and determining an actual charge per unit time of the advertisement based on the performance index, the priority index, and a predetermined weight.
摘要翻译：提供了一种用于根据单位时间确定广告费用的计费方法和系统。所述收费方法包括检查数字表示广告的表现的性能指标; 检查广告的下一优先广告的优先级索引; 以及基于所述性能指标，所述优先级索引和预定权重来确定所述广告的每单位时间的实际费用。

82. 发明申请

US20110173079A1 BIDDING MANAGEMENT METHOD AND SYSTEM USING BIDDING ATTRIBUTE INFORMATION 审中-公开
标题翻译：投标管理方法和使用投标属性信息的系统
公开(公告)号：US20110173079A1
公开(公告)日：2011-07-14
申请号：US13001547
申请日：2009-06-30
申请人： Ki Oh Kwon , Jong Ho Park , Yoon Hyoung Noh , Young Ho Shin
发明人： Ki Oh Kwon , Jong Ho Park , Yoon Hyoung Noh , Young Ho Shin
IPC分类号： G06Q30/00
CPC分类号： G06Q30/08 , G06Q30/02 , G06Q30/0275
摘要： Provided is a bid management method and system using bid attribute information. The bid management method may include receiving a bid request including bid attribute information of an advertisement listing, determining a display rank of the advertisement listing using the bid attribute information, and calculating a final bid amount of the advertisement listing based on the display rank of the advertisement listing.
摘要翻译：提供了一种使用出价属性信息的出价管理方法和系统。投标管理方法可以包括接收包括广告列表的投标属性信息的投标请求，使用投标属性信息确定广告列表的显示排名，以及基于显示排名来计算广告列表的最终投标金额广告上市。

83. 发明申请

US20110116171A1 ELECTROACTIVE POLYMER ACTUATOR AND METHOD OF MANUFACTURING THE SAME 有权
标题翻译：电动聚合物致动器及其制造方法
公开(公告)号：US20110116171A1
公开(公告)日：2011-05-19
申请号：US12855785
申请日：2010-08-13
申请人： Jong-Oh KWON , Seung-Tae CHOI
发明人： Jong-Oh KWON , Seung-Tae CHOI
IPC分类号： H01L41/047 , H01L41/26 , G02B3/14
CPC分类号： H01L41/293 , G02B3/14 , H01L41/0474 , H01L41/083 , H01L41/0833 , H01L41/27 , Y10T29/42 , Y10T29/49165
摘要： A multilayer electroactive polymer actuator and a method of manufacturing the same. The multilayer electroactive polymer actuator is divided into an actuating area and a non-actuating area. A plurality of driving electrodes, each formed on a side of the respective polymer layer to correspond to the actuating area. A plurality of extension electrodes connected to the driving electrodes and a common electrode for vertically connecting the extension electrodes are formed to correspond to the non-actuating area. A via hole is formed through the plurality of non-actuating layers and has a diameter which increases in a stepwise manner upwards. The common electrode is formed in the via hole. The driving electrode includes an alloy of aluminum and copper. The extension electrode is formed of material having a small reactivity with respect to laser as compared to the reactivity of the polymer layer.
摘要翻译：一种多层电活性聚合物致动器及其制造方法。多层电活性聚合物致动器被分成致动区域和非致动区域。多个驱动电极，各自形成在相应聚合物层的一侧以对应于致动区域。连接到驱动电极的多个延伸电极和用于垂直连接延伸电极的公共电极形成为对应于非致动区域。穿过多个非致动层形成通孔，并且其直径以逐步的方式向上增加。公共电极形成在通孔中。驱动电极包括铝和铜的合金。与聚合物层的反应性相比，延伸电极由相对于激光的反应性小的材料形成。

84. 发明申请

US20100311986A1 PREPARING METHOD OF METHOXYPOLYETHYLENEGLYCOL ETHYLMALEIMIDE 审中-公开
标题翻译：甲氧基乙烯基乙醚乙缩醛酰亚胺的制备方法
公开(公告)号：US20100311986A1
公开(公告)日：2010-12-09
申请号：US12669722
申请日：2008-03-18
申请人： Pyeong-Uk Park , Seong-Nyun Kim , Su-Chan Kim , Jung-Oh Kwon
发明人： Pyeong-Uk Park , Seong-Nyun Kim , Su-Chan Kim , Jung-Oh Kwon
IPC分类号： C07D207/40
CPC分类号： C08G65/33306 , C08G65/30 , C08G65/33337 , C08G2650/50
摘要： The present invention relates to a process for preparing methoxy polyethylene glycol ethylmaleimide (abbreviated to as “mPEG-ethylmaleimide”) and derivatives thereof with high purity. methoxypolyethyleneglycol ethylmaleimide therefrom.
摘要翻译：本发明涉及一种高纯度制备甲氧基聚乙二醇乙基马来酰亚胺（简称“mPEG-乙基马来酰亚胺”）及其衍生物的方法。甲氧基聚乙二醇乙基马来酰亚胺。

85. 发明申请

US20100267408A1 INTER-CELL INTERFERENCE COORDINATION METHOD AND APPARATUS FOR WIRELESS COMMUNICATION SYSTEM 有权
标题翻译：内部干扰协调方法和无线通信系统的设备
公开(公告)号：US20100267408A1
公开(公告)日：2010-10-21
申请号：US12763493
申请日：2010-04-20
申请人： Neung Hyung Lee , Sung Oh Kwon , Jong In Kim , Ho Sun Youm , Kyung Chun Lee
发明人： Neung Hyung Lee , Sung Oh Kwon , Jong In Kim , Ho Sun Youm , Kyung Chun Lee
IPC分类号： H04W72/04
CPC分类号： H04W72/0426 , H04W52/243 , H04W72/082
摘要： An inter-cell interference coordination method and apparatus is provided for mitigating inter-cell interference in a wireless communication system by using interference coordination information exchanged among neighbor base stations. The method includes receiving, at a serving base station, power control messages transmitted by neighbor base stations, receiving incoming interference coordination messages transmitted by neighbor base stations, each message including interference indicators of resource blocks, allocating the resource blocks with transmission power per resource block to user equipments served by the base station based on the power control and interference coordination messages, generating outgoing interference coordination messages for the respective neighbor base stations based on the resource block allocation result, and transmitting the interference coordination messages to the neighbor base stations, respectively.
摘要翻译：提供了一种小区间干扰协调方法和装置，用于通过使用在相邻基站之间交换的干扰协调信息来减轻无线通信系统中的小区间干扰。该方法包括在服务基站处接收由相邻基站发送的功率控制消息，接收由相邻基站发送的进入干扰协调消息，每个消息包括资源块的干扰指示符，每个资源块分配具有传输功率的资源块基于功率控制和干扰协调消息由基站服务的用户设备，基于资源块分配结果生成各相邻基站的出站干扰协调消息，并将干扰协调消息分别发送到邻近基站。

86. 发明申请

US20080293922A1 BETA-AMYLOID BINDING FACTORS AND INHIBITORS THEREOF 有权
标题翻译： β-淀粉样蛋白结合因子及其抑制因子
公开(公告)号：US20080293922A1
公开(公告)日：2008-11-27
申请号：US11548397
申请日：2006-10-11
申请人： Chi-Bom CHAE , Yong Song Gho , Seung-Pil Yang , Dong-Goo Bae , Byung Oh Kwon , Sewook Hwang
发明人： Chi-Bom CHAE , Yong Song Gho , Seung-Pil Yang , Dong-Goo Bae , Byung Oh Kwon , Sewook Hwang
IPC分类号： C07K14/475
CPC分类号： C07K14/52 , A61K38/00
摘要： The present invention relates to a VEGF polypeptide that binds to Aβ. The present invention also relates to a compound that sequesters Aβ. And conversely, the invention relates to a compound that sequesters VEGF. Thus, the present invention also relates to a method of screening for a compound that inhibits the binding of VEGF to Aβ, and thus relates to prevention and treatment of Alzheimer's Disease.
摘要翻译：本发明涉及与Aβ结合的VEGF多肽。本发明还涉及螯合Abeta的化合物。相反，本发明涉及螯合VEGF的化合物。因此，本发明还涉及筛选抑制VEGF与Aβ结合的化合物的方法，因此涉及预防和治疗阿尔茨海默病。

87. 发明授权

US07449366B2 Wafer level packaging cap and fabrication method thereof 有权
标题翻译：晶圆级封装盖及其制造方法
公开(公告)号：US07449366B2
公开(公告)日：2008-11-11
申请号：US11365838
申请日：2006-03-02
申请人： Moon-chul Lee , Jong-oh Kwon , Woon-bae Kim , Ji-hyuk Lim , Suk-jin Ham , Jun-sik Hwang , Chang-youl Moon
发明人： Moon-chul Lee , Jong-oh Kwon , Woon-bae Kim , Ji-hyuk Lim , Suk-jin Ham , Jun-sik Hwang , Chang-youl Moon
IPC分类号： H01L21/00
CPC分类号： B81C1/00301 , B81B2207/095 , H01L21/4817 , H01L21/50 , H01L2924/16235
摘要： A wafer level packaging cap for covering a device wafer with a device thereon and a fabrication method thereof are provided. The method includes operations of forming a plurality of connection grooves on a wafer, forming a seed layer on the connection grooves, forming connection parts by filling the connection grooves with a metal material, forming cap pads on a top surface of the wafer to be electrically connected to the connection parts, bonding a supporting film with the top surface of the wafer on which the cap pads are formed, forming a cavity on a bottom surface of the wafer to expose the connection parts through the cavity, and forming metal lines on the bottom surface of the wafer to be electrically connected to the connection parts.
摘要翻译：提供了一种用于在其上覆盖器件晶片的晶片级封装盖及其制造方法。该方法包括在晶片上形成多个连接槽的操作，在连接槽上形成种子层，通过用金属材料填充连接槽来形成连接部分，在晶片的顶表面上形成电极盖连接到连接部分，将支撑膜与其上形成有盖垫的晶片的顶表面接合，在晶片的底表面上形成空腔，以通过空腔露出连接部分，并在其上形成金属线晶片的底表面电连接到连接部分。

88. 发明授权

US07374972B2 Micro-package, multi-stack micro-package, and manufacturing method therefor 有权
标题翻译：微封装，多堆微型封装及其制造方法
公开(公告)号：US07374972B2
公开(公告)日：2008-05-20
申请号：US11782404
申请日：2007-07-24
申请人： Jong-oh Kwon , Woon-bae Kim , In-sang Song , Ji-hyuk Lim , Suk-jin Ham , Byung-gil Jeong
发明人： Jong-oh Kwon , Woon-bae Kim , In-sang Song , Ji-hyuk Lim , Suk-jin Ham , Byung-gil Jeong
IPC分类号： H01L21/44 , H01L21/48 , H01L21/50
CPC分类号： H01L23/053 , B81C1/00269 , H01L23/055 , H01L23/10 , H01L23/147 , H01L23/49816 , H01L23/564 , H01L24/02 , H01L24/11 , H01L24/16 , H01L24/48 , H01L24/83 , H01L24/94 , H01L24/97 , H01L25/0657 , H01L25/105 , H01L2224/0401 , H01L2224/04042 , H01L2224/0557 , H01L2224/11831 , H01L2224/13025 , H01L2224/13099 , H01L2224/16 , H01L2224/2518 , H01L2224/274 , H01L2224/2929 , H01L2224/293 , H01L2224/48463 , H01L2224/83851 , H01L2224/9202 , H01L2225/06524 , H01L2225/06527 , H01L2225/06541 , H01L2225/06551 , H01L2225/06586 , H01L2225/1035 , H01L2924/00011 , H01L2924/00014 , H01L2924/0002 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/1433 , H01L2924/30105 , H01L2224/29075 , H01L2224/05552 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A micro package, a multi-stack micro package, and a manufacture method therefor are provided. A micro package according to the present invention includes a device substrate for mounting a devices, being a circuit module; a protection cap for protecting the device; bonding substances which, formed by patterning on predetermined areas on the device substrate, bond the device substrate and the protection cap; layers formed on a portion of the device substrate and a portion of the protection cap and exterior sides of the bonding substances; vias which are formed by etching away another portion of the protection cap, and electrically connected to an upper surface of the device substrate through the bonding substances; under barrier metals (UBMs) formed on the vias; and solder bumpers, being connection terminals for an external signal, formed on the UBMs. As stated above, the present invention has advantages of guaranteeing the hermetical sealing since the above layers prevent moisture absorption from outside at the same time of lowering possibility of damages to the device inside the package since the processing temperature drops below 150° upon wafer bonding due to the use of the polymer substance as a bonding substance.
摘要翻译：提供微型封装，多堆叠微型封装及其制造方法。根据本发明的微型封装包括用于安装器件的器件基板，作为电路模块; 保护装置的保护帽; 通过在器件基板上的预定区域上图案化而形成的结合物质将器件基板和保护盖接合; 形成在器件基板的一部分上的层和粘合物质的保护盖的一部分和外侧; 通过蚀刻掉保护盖的另一部分并且通过接合物质电连接到器件基板的上表面而形成的通孔; 在通孔上形成的阻挡金属（UBM）; 以及形成在UBM上的作为外部信号的连接端子的焊料保险杠。如上所述，本发明具有保证气密密封的优点，因为上述层防止从外部吸湿，同时降低了对包装内部装置的损坏的可能性，因为处理温度在晶片接合后下降到150°以下涉及使用聚合物物质作为结合物质。

89. 发明申请

US20070264757A1 MICRO-PACKAGE, MULTI-STACK MICRO-PACKAGE, AND MANUFACTURING METHOD THEREFOR 有权
标题翻译：微型封装，多层微封装及其制造方法
公开(公告)号：US20070264757A1
公开(公告)日：2007-11-15
申请号：US11782404
申请日：2007-07-24
申请人： Jong-oh KWON , Woon-Bae Kim , In-sang Song , Ji-hyuk Lim , Suk-jin Ham , Byung-gil Jeong
发明人： Jong-oh KWON , Woon-Bae Kim , In-sang Song , Ji-hyuk Lim , Suk-jin Ham , Byung-gil Jeong
IPC分类号： H01L21/00
CPC分类号： H01L23/053 , B81C1/00269 , H01L23/055 , H01L23/10 , H01L23/147 , H01L23/49816 , H01L23/564 , H01L24/02 , H01L24/11 , H01L24/16 , H01L24/48 , H01L24/83 , H01L24/94 , H01L24/97 , H01L25/0657 , H01L25/105 , H01L2224/0401 , H01L2224/04042 , H01L2224/0557 , H01L2224/11831 , H01L2224/13025 , H01L2224/13099 , H01L2224/16 , H01L2224/2518 , H01L2224/274 , H01L2224/2929 , H01L2224/293 , H01L2224/48463 , H01L2224/83851 , H01L2224/9202 , H01L2225/06524 , H01L2225/06527 , H01L2225/06541 , H01L2225/06551 , H01L2225/06586 , H01L2225/1035 , H01L2924/00011 , H01L2924/00014 , H01L2924/0002 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/1433 , H01L2924/30105 , H01L2224/29075 , H01L2224/05552 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A micro package, a multi-stack micro package, and a manufacture method therefor are provided. A micro package according to the present invention includes a device substrate for mounting a devices, being a circuit module; a protection cap for protecting the device; bonding substances which, formed by patterning on predetermined areas on the device substrate, bond the device substrate and the protection cap; layers formed on a portion of the device substrate and a portion of the protection cap and exterior sides of the bonding substances; vias which are formed by etching away another portion of the protection cap, and electrically connected to an upper surface of the device substrate through the bonding substances; under barrier metals (UBMs) formed on the vias; and solder bumpers, being connection terminals for an external signal, formed on the UBMs. As stated above, the present invention has advantages of guaranteeing the hermetical sealing since the above layers prevent moisture absorption from outside at the same time of lowering possibility of damages to the device inside the package since the processing temperature drops below 150° upon wafer bonding due to the use of the polymer substance as a bonding substance.
摘要翻译：提供微型封装，多堆叠微型封装及其制造方法。根据本发明的微型封装包括用于安装器件的器件基板，作为电路模块; 保护装置的保护帽; 通过在器件基板上的预定区域上图案化而形成的结合物质将器件基板和保护盖接合; 形成在器件基板的一部分上的层和粘合物质的保护盖的一部分和外侧; 通过蚀刻掉保护盖的另一部分并且通过接合物质电连接到器件基板的上表面而形成的通孔; 在通孔上形成的阻挡金属（UBM）; 以及形成在UBM上的作为外部信号的连接端子的焊料保险杠。如上所述，本发明具有保证气密密封的优点，因为上述层防止从外部吸湿，同时降低了对包装内部装置的损坏的可能性，因为处理温度在晶片接合后下降到150°以下涉及使用聚合物物质作为结合物质。

90. 发明申请

US20070117047A1 Printing plate, method of manufacturing of printing plate and liquid crystal display device using the same 有权
标题翻译：印版，印版的制造方法和使用其的液晶显示装置
公开(公告)号：US20070117047A1
公开(公告)日：2007-05-24
申请号：US11410963
申请日：2006-04-25
申请人： Oh Kwon , Seung Nam
发明人： Oh Kwon , Seung Nam
IPC分类号： G03F7/00
CPC分类号： B41N1/06 , B41C1/02 , B41N1/00
摘要： A printing plate to form a precise pattern, a method for manufacturing the printing plate, and a method for fabricating an LCD device using the printing plate in which the printing plate includes a substrate having at least one trench and sidewall elements formed at an inner perimeter of the at least one trench.
摘要翻译：形成精确图案的印版，印版的制造方法以及使用印版制造LCD装置的方法，其中印版包括具有至少一个沟槽的基板和形成在内周边的侧壁元件的至少一个沟槽。

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