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81. 发明申请

US20100196219A1 EXHAUST EMISSION CONTROL DEVICE 有权
标题翻译：排气排放控制装置
公开(公告)号：US20100196219A1
公开(公告)日：2010-08-05
申请号：US12678941
申请日：2008-03-18
申请人： Hiroshi Endo , Noriyuki Takahashi
发明人： Hiroshi Endo , Noriyuki Takahashi
IPC分类号： B01D53/34
CPC分类号： F01N3/025 , B01D53/9431 , B01D53/9477 , B01D2251/2062 , B01D2257/406 , B01D2257/702 , B01D2258/012 , F01N3/0231 , F01N3/0821 , F01N3/106 , F01N3/2066 , F01N13/1805 , F01N13/1855 , F01N2450/24 , F01N2470/18 , F01N2470/22 , F01N2490/06 , F01N2610/02 , Y02T10/24
摘要： In an exhaust emission control device, a selective reduction catalyst 5 having a property capable of selectively reacting NOx with ammonia even in the presence of oxygen is incorporated as NOx reduction catalyst in an exhaust pipe 4 and a particulate filter 13 is arranged upstream of the catalyst. Arranged in front of the particulate filter 13 is a burner 14 for injection of fuel in moderate quantity for ignition and combustion. Interposed between the particulate filter 13 and the selective reduction catalyst 5 is an oxidation catalyst 15 which conducts oxidation treatment of unburned HC in the exhaust gas 3 and urges oxidation reaction of NO in the exhaust gas 3 into NO2.
摘要翻译：在废气排放控制装置中，作为NOx还原催化剂，在排气管4中并入具有即使在氧气存在下也能够使NOx与氨选择性反应的性质的选择还原催化剂5，并且将微粒过滤器13配置在催化剂的上游。在微粒过滤器13前面排列有用于点燃和燃烧的中等量燃料喷射燃烧器14。颗粒过滤器13和选择还原催化剂5之间的是氧化催化剂15，其对废气3中未燃烧的HC进行氧化处理，并促使废气3中的NO的氧化反应成为NO2。

82. 发明授权

US07728412B2 Semiconductor device having plurality of leads 失效
标题翻译：具有多个引线的半导体器件
公开(公告)号：US07728412B2
公开(公告)日：2010-06-01
申请号：US12014313
申请日：2008-01-15
申请人： Noriyuki Takahashi
发明人： Noriyuki Takahashi
IPC分类号： H01L23/495
CPC分类号： H01L23/49548 , H01L21/4842 , H01L21/566 , H01L23/3107 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/97 , H01L2224/32014 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48095 , H01L2224/48247 , H01L2224/48465 , H01L2224/49175 , H01L2224/73265 , H01L2224/92 , H01L2224/92247 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01057 , H01L2924/01079 , H01L2924/01082 , H01L2924/181 , H01L2224/83 , H01L2224/85 , H01L2924/00014 , H01L2924/00012 , H01L2924/00 , H01L2924/3512
摘要： A method of making a semiconductor device including a semiconductor chip having a plurality of pads, and a lead frame having a plurality of leads. Each of the plurality of leads has a mounting surface for mounting the semiconductor device, a wire connection surface having a thick portion, and a thin portion whose thickness is thinner than the thick portion. The length of each wire connection surface was furthermore formed shorter than the mounting surface, by arranging so that the thin portion of each lead dives below the semiconductor chip, securing the length of the mounting surface of each lead, a distance from the side face of the semiconductor chip to the side face of a molded body of the semiconductor device being shortened as much as possible, and the package size is brought close to chip size, with miniaturization of QFN.
摘要翻译：一种制造包括具有多个焊盘的半导体芯片的半导体器件的方法，以及具有多个引线的引线框架。多个引线中的每一个具有用于安装半导体器件的安装表面，具有厚壁部分的导线连接表面，以及厚度比厚壁部分薄的薄部分。此外，每个电线连接表面的长度进一步形成为比安装表面短，通过这样布置，使得每个引线的薄部分潜入到半导体芯片的下方，确保每个引线的安装表面的长度，尽可能地缩短半导体器件的成型体的侧面的半导体芯片，并且随着QFN的小型化，封装尺寸接近芯片尺寸。

83. 发明申请

US20090291529A1 METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE 有权
标题翻译：制造半导体器件的方法
公开(公告)号：US20090291529A1
公开(公告)日：2009-11-26
申请号：US12534183
申请日：2009-08-03
申请人： TADASHI MUNAKATA , Shingo Oosaka , Mitsuru Kinoshita , Yoshihiko Yamaguchi , Noriyuki Takahashi
发明人： TADASHI MUNAKATA , Shingo Oosaka , Mitsuru Kinoshita , Yoshihiko Yamaguchi , Noriyuki Takahashi
IPC分类号： H01L21/78 , H01L21/50
CPC分类号： H01L21/78 , H01L21/02076 , H01L21/561 , H01L21/565 , H01L21/67092 , H01L21/67126 , H01L21/67333 , H01L21/6838 , H01L23/3128 , H01L24/73 , H01L24/97 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48225 , H01L2224/48227 , H01L2224/48465 , H01L2224/73265 , H01L2224/97 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01009 , H01L2924/01033 , H01L2924/01039 , H01L2924/01057 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/15183 , H01L2924/15311 , H01L2924/181 , H01L2924/3025 , H01L2224/85 , H01L2924/00014 , H01L2224/83 , H01L2924/00012 , H01L2924/00
摘要： A semiconductor device manufacturing method comprising the steps of providing a matrix substrate having a main surface with plural device areas formed thereon, fixing plural semiconductor chips to the plural device areas respectively, then sealing the plural semiconductor chips all together with resin to form a block sealing member, dividing the block sealing member and the matrix substrate for each of the device areas by dicing, thereafter rubbing a surface of each of the diced sealing member portions with a brush, then storing semiconductor devices formed by the dicing once into pockets respectively of a tray, and conveying the semiconductor devices each individually from the tray. Since the substrate dividing work after block molding is performed by dicing while vacuum-chucking the surface of the block sealing member, the substrate division can be done without imposing any stress on an external terminal mounting surface of the matrix substrate.
摘要翻译：一种半导体器件制造方法，包括以下步骤：提供具有形成在其上的多个器件区域的主表面的矩阵衬底，将多个半导体芯片分别固定到多个器件区域，然后将多个半导体芯片与树脂一起密封以形成块密封通过切割将每个设备区域的块状密封构件和矩阵基板分开，然后用刷子擦拭每个切割的密封构件部分的表面，然后将通过切割形成的半导体器件分别存储到一个托盘，并且分别从托盘传送半导体器件。由于在模块密封部件的表面进行真空夹紧的同时通过切割进行块模塑后的基板分割作业，所以可以在不对矩阵基板的外部端子安装面施加任何应力的情况下进行基板分割。

84. 发明授权

US07323366B2 Manufacturing method of a semiconductor device 有权
标题翻译：半导体器件的制造方法
公开(公告)号：US07323366B2
公开(公告)日：2008-01-29
申请号：US11222959
申请日：2005-09-12
申请人： Noriyuki Takahashi
发明人： Noriyuki Takahashi
IPC分类号： H01L21/00
CPC分类号： H01L23/49548 , H01L21/4842 , H01L21/566 , H01L23/3107 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/97 , H01L2224/32014 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48095 , H01L2224/48247 , H01L2224/48465 , H01L2224/49175 , H01L2224/73265 , H01L2224/92 , H01L2224/92247 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01057 , H01L2924/01079 , H01L2924/01082 , H01L2924/181 , H01L2224/83 , H01L2224/85 , H01L2924/00014 , H01L2924/00012 , H01L2924/00 , H01L2924/3512
摘要： A method of making a semiconductor device including a semiconductor chip having a plurality of pads, and a lead frame having a plurality of leads. Each of the plurality of leads has a mounting surface for mounting the semiconductor device, a wire connection surface having a thick portion, and a thin portion whose thickness is thinner than the thick portion. The length of each wire connection surface was furthermore formed shorter than the mounting surface, by arranging so that the thin portion of each lead dives below the semiconductor chip, securing the length of the mounting surface of each lead, a distance from the side face of the semiconductor chip to the side face of a molded body of the semiconductor device being shortened as much as possible, and the package size is brought close to chip size, with miniaturization of QFN.
摘要翻译：一种制造包括具有多个焊盘的半导体芯片的半导体器件的方法，以及具有多个引线的引线框架。多个引线中的每一个具有用于安装半导体器件的安装表面，具有厚壁部分的电线连接表面，以及厚度比厚壁部分薄的薄部分。此外，每个电线连接表面的长度进一步形成为比安装表面短，通过这样布置，使得每个引线的薄部分潜入到半导体芯片的下方，确保每个引线的安装表面的长度，尽可能地缩短半导体器件的成型体的侧面的半导体芯片，并且随着QFN的小型化，封装尺寸接近芯片尺寸。

85. 发明授权

US07313596B2 Multicast data communication method, multicast data communication system, repeater, repeating method, and medium for storing repeating programs 有权
标题翻译：组播数据通信方式，组播数据通信系统，中继器，重复方法和存储重复程序的介质
公开(公告)号：US07313596B2
公开(公告)日：2007-12-25
申请号：US10117369
申请日：2002-04-05
申请人： Seiichiro Tani , Toshiaki Miyazaki , Noriyuki Takahashi , Takahiro Murooka , Shinya Ishihara , Takeru Inoue
发明人： Seiichiro Tani , Toshiaki Miyazaki , Noriyuki Takahashi , Takahiro Murooka , Shinya Ishihara , Takeru Inoue
IPC分类号： G06F15/16 , G06F15/173 , H04L12/28
CPC分类号： H04L12/185 , H04L12/1854
摘要： A multicast data communication system is provided that has high security, and prevents problems such as an attack by a malicious user creating a great number of meaningless tables at nodes in the network. Clients regularly transmit request packets toward a server; a node receives the request packet, and subsequently receives a delivery-table-creation packet or a delivery packet from the server; if the node has no delivery table corresponding to the server, the node creates the delivery table, registers the addresses of the clients, and their request packet arrival times, and regularly transmits the request packet toward the server; when the node has received a delivery packet from the server, the node duplicates and delivers the delivery packet only to those clients whose request packet arrival times, registered in the delivery table, are within a fixed period from the arrival of the delivery packet.
摘要翻译：提供了具有高安全性的组播数据通信系统，并且防止诸如恶意用户的攻击在网络中的节点处创建大量无意义表的问题。客户端定期向服务器发送请求数据包; 节点接收请求分组，随后从服务器接收传送表创建分组或传送分组; 如果节点没有与服务器对应的传送表，则节点创建传送表，注册客户端的地址及其请求包到达时间，并定期向服务器发送请求包; 当节点已经从服务器接收到传送分组时，节点将传送分组复制并传送到那些登记在传送表中的请求分组到达时间在从传送分组到达的固定时间段内的那些客户端。

86. 发明申请

US20050046023A1 Semiconductor device 有权
标题翻译：半导体器件
公开(公告)号：US20050046023A1
公开(公告)日：2005-03-03
申请号：US10927106
申请日：2004-08-27
申请人： Noriyuki Takahashi , Masahiro Ichitani , Rumiko Ichitani
发明人： Noriyuki Takahashi , Masahiro Ichitani , Rumiko Ichitani
IPC分类号： H01L23/12 , H01L23/02 , H01L23/498 , H01L23/48
CPC分类号： H01L23/49838 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2224/45144 , H01L2224/48227 , H01L2224/49175 , H01L2924/00014 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/15311 , H01L2924/181 , H01L2924/00 , H01L2224/05599 , H01L2924/00012
摘要： A semiconductor device comprises: a package substrate having a plurality of bonding electrodes arranged in a peripheral region of a main surface thereof and wirings connected to the respective bonding electrodes and electrolessly plated; a semiconductor chip mounted on the package substrate; a plurality of wires connecting pads of the semiconductor chip and the bonding electrodes; a sealing body for sealing the semiconductor chip and the wires with resin; and a plurality of solder balls arranged on the package substrate. The wirings are formed only at the inner side of the plurality of bonding electrodes on the main surface of the package substrate, and no solder resist film is formed at the outer side of the plurality of bonding electrodes. With this arrangement, the region outside the bonding electrodes can be minimized and the semiconductor device can be downsized without changing the size of the chip mounted thereon.
摘要翻译：一种半导体器件，包括：封装基板，其具有布置在其主表面的周边区域中的多个接合电极和连接到各个接合电极并无电镀的布线; 安装在所述封装基板上的半导体芯片; 连接半导体芯片的焊盘和接合电极的多根导线; 用于用树脂密封半导体芯片和电线的密封体; 以及布置在所述封装衬底上的多个焊球。布线仅形成在封装基板的主表面上的多个接合电极的内侧，并且在多个接合电极的外侧不形成阻焊膜。通过这种布置，可以最小化接合电极外部的区域，并且可以在不改变安装在其上的芯片的尺寸的情况下小型化半导体器件。

87. 发明授权

US06645794B2 Method of manufacturing a semiconductor device by monolithically forming a sealing resin for sealing a chip and a reinforcing frame by transfer molding 失效
标题翻译：通过单片地形成用于通过传递模塑密封芯片和加强框架的密封树脂来制造半导体器件的方法
公开(公告)号：US06645794B2
公开(公告)日：2003-11-11
申请号：US10302848
申请日：2002-11-25
申请人： Noriyuki Takahashi , Seiichi Ichihara , Chuichi Miyazaki
发明人： Noriyuki Takahashi , Seiichi Ichihara , Chuichi Miyazaki
IPC分类号： H01L2144
CPC分类号： H01L21/4846 , H01L21/565 , H01L23/3107 , H01L23/3128 , H01L23/49816 , H01L23/4985 , H01L25/105 , H01L2224/16 , H01L2224/73253 , H01L2225/1029 , H01L2225/1058 , H01L2225/1076 , H01L2924/01079 , H01L2924/1433 , H01L2924/15311 , H01L2924/3511
摘要： In a semiconductor device manufacturing method in which a package including a semiconductor chip is mounted on a wiring board via tape ball grid array (TBGA), a tape base material having a device hole and a plurality of leads is provided with one end of the leads extended inside the device hole and a part of the other end of the leads forming lands for connecting bump electrodes. The semiconductor chip is arranged in the device hole of the tape base material to electrically connect the semiconductor chip and the one end of the leads. A sealing resin and reinforcing frame surrounding the periphery of the sealing resin are monolithically formed by transfer molding. The tape base material is fixed in an area between the semiconductor chip and the reinforcing frame by a lower mold and a projection of an upper mold.
摘要翻译：在通过带状球栅阵列（TBGA）将包含半导体芯片的封装安装在布线板上的半导体器件制造方法中，具有器件孔和多个引线的带基材料设置有引线的一端延伸到器件孔内部，并延伸到用于连接突起电极的引线形成焊盘的另一端的一部分。半导体芯片布置在带基材的器件孔中，以将半导体芯片和引线的一端电连接。围绕密封树脂的周边的密封树脂和增强框架通过传递模塑而整体地形成。带状基材通过下模和上模的突起固定在半导体芯片和加强框架之间的区域中。

88. 发明授权

US06408575B1 Horizontal axis type wind turbine and method of construction thereof 失效
标题翻译：水平轴式风力发电机及其构造方法
公开(公告)号：US06408575B1
公开(公告)日：2002-06-25
申请号：US09537512
申请日：2000-03-29
申请人： Shigeo Yoshida , Yuji Kawakita , Yasuhiro Koshioka , Toru Nagao , Noriyuki Takahashi
发明人： Shigeo Yoshida , Yuji Kawakita , Yasuhiro Koshioka , Toru Nagao , Noriyuki Takahashi
IPC分类号： E04H1234
CPC分类号： E04H12/34 , F03D13/10 , F03D13/20 , F05B2230/601 , F05B2240/14 , F05B2240/916 , Y02E10/726 , Y02E10/728 , Y02P70/523
摘要： A tower comprises a base tower member fixed on a base in the ground, a lower tower member hingedly connected at a lower end thereof with an upper end of the base tower member through a hinge and swinging between a lying position and a standing position, a first stage connecting tower member connected at a lower end thereof with an upper end of the lower tower member, a second stage connecting tower member connected at a lower end thereof with an upper end of the first stage connecting tower member, and a third stage connecting tower member connected at a lower end thereof with an upper end of the second stage connecting tower member. Thus formed tower is raised swingingly around the hinge from the lying position to the standing position. A nacelle includes a tower penetrating hole through which the tower vertically penetrates and is formed by a plurality of nacelle sections divisible around the tower penetrating hole. After the tower is built, a plurality of nacelle sections are collected around the tower and are connected with each other while the nacelle is penetrated by the tower. Then, the nacelle is lifted up along the tower in that state and fixed to the top end of the tower.
摘要翻译：塔架包括固定在地面上的基座上的基座塔架构件，下部塔架构件，其下部端部通过铰链铰接并与基座塔架构件的上端连接，并且在平躺位置和竖立位置之间摆动，第一级连接塔构件的下端与下塔构件的上端连接，第二级连接塔构件，其下端与第一级连接塔构件的上端连接，第三级连接塔构件塔架构件的下端连接有第二级连接塔构件的上端。这样形成的塔架从铰链处从摆放位置摆动地摆放到竖立位置。机舱包括塔穿透孔，塔架垂直穿过该塔穿透孔，并且由围绕塔穿透孔可分开的多个机舱部分形成。塔架建成后，在塔架周围收集多个机舱部分，并在机舱穿过塔架时相互连接。然后，在该状态下，机舱沿着塔架升起并固定在塔顶端。

89. 发明授权

US6101532A Electronic conference system 失效
标题翻译：电子会议系统
公开(公告)号：US6101532A
公开(公告)日：2000-08-08
申请号：US106353
申请日：1998-06-29
申请人： Takashi Horibe , Tetsuji Ohno , Noriyuki Takahashi , Takahiro Tanida
发明人： Takashi Horibe , Tetsuji Ohno , Noriyuki Takahashi , Takahiro Tanida
IPC分类号： G06F3/14 , G06F3/048 , G06F13/00 , G06F15/16 , G06F17/21 , G06F17/27 , G06F17/30 , H04L12/18 , H04N7/15
CPC分类号： H04L12/1827 , G06F3/1454 , H04L12/586 , H04L51/16 , H04N7/15
摘要： Only important portions in all of messages are extracted in the halfway or after the end of a discussion and are allowed to be referred to the user. The time for discussion is reduced, thereby smoothly proceeding a conference. An electronic conference system is constructed in an electronic conference system server in a manner such that a plurality of user clients are connected to the electronic conference system server through a network (not shown). The electronic conference system is made up of a message database, a message relation extracting unit, a message type setting unit, a message input and display unit, and an electronic conference summarizing system. The electronic conference summarizing system is constructed by a discussion path specifying unit, a message merging unit, a duplication message deleting unit, and a message summary file. All of the conclusions derived from a subject and its discussion tree are extracted, unnecessary portions such as quotations or the like are deleted, and the correspondence of questions and answers is arranged and is formed as a summary.
摘要翻译：所有消息中的重要部分仅在讨论结束的一半或结束后提取，并被允许被引用给用户。讨论的时间减少，从而顺利进行会议。电子会议系统以电子会议系统服务器的方式构成，使得多个用户客户端通过网络（未示出）连接到电子会议系统服务器。电子会议系统由消息数据库，消息关系提取单元，消息类型设置单元，消息输入和显示单元以及电子会议总结系统组成。电子会议总结系统由讨论路径指定单元，消息合并单元，复制消息删除单元和消息摘要文件构成。提取从主题及其讨论树得到的所有结论，删除诸如引用等的不必要的部分，并且排列问题和答案的对应关系并作为总结形成。

90. 发明授权

US5046495A High frequency heat therapy system 失效
标题翻译：高频热疗系统
公开(公告)号：US5046495A
公开(公告)日：1991-09-10
申请号：US332925
申请日：1989-04-04
申请人： Noriyuki Takahashi , Jun Shimoyama , Eiji Kasai , Akitoshi Miki
发明人： Noriyuki Takahashi , Jun Shimoyama , Eiji Kasai , Akitoshi Miki
IPC分类号： A61N1/40
CPC分类号： A61N1/403
摘要： A high frequency heat therapy system, comprising: an applicator equipped with an electrode and a bolus bag; a high frequency generator unit for generating high frequency electric current that is to be applied to the electrode; a therapeutic table for adjustably supporting a patient; an applicator support unit for adjustably applying the applicator to the patient; a therapeutic data input unit for specifying therapeutic data including those related to positioning of the therapeutic table and the applicator support unit; a therapeutic data storage unit for storing therapeutic data including the data on positioning of the therapeutic table and the applicator; a drive control unit for drivingly controlling the therapeutic table and the applicator support unit according to the data on positioning of the therapeutic table and the applicator stored in the storage unit; and a central control unit for transmitting data stored in the therapeutic data storage unit and, if any, the therapeutic data specified by the therapeutic data input mean to the drive control unit. A high level of reproducibility can be achieved and the contributions of various therapeutic data can be evaluated in a rational way.
摘要翻译：一种高频热疗系统，包括：装有电极和推注袋的涂抹器; 用于产生要施加到电极的高频电流的高频发生器单元; 用于可调节地支撑患者的治疗台; 施加器支撑单元，用于可调节地将施用器施加到患者身上; 治疗数据输入单元，用于指定治疗数据，其包括与治疗台和施用器支撑单元的定位相关的治疗数据; 治疗数据存储单元，用于存储包括治疗台和敷贴器的定位数据的治疗数据; 驱动控制单元，用于根据存储在存储单元中的治疗台和施用器的定位数据，驱动地控制治疗台和敷料器支撑单元; 以及中央控制单元，用于将存储在治疗数据存储单元中的数据以及（如果有的话）传送给治疗数据输入装置指定的治疗数据到驱动控制单元。可以实现高水平的再现性，并且可以以合理的方式评估各种治疗数据的贡献。

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