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81. 发明专利

JPH02231578A METHOD AND DEVICE FOR DECIDING DESTATICIZATION EFFECT 失效
公开(公告)号：JPH02231578A
公开(公告)日：1990-09-13
申请号：JP5193789
申请日：1989-03-06
申请人： HITACHI LTD , HITACHI YONEZAWA DENSHI KK
发明人： YAMAGUCHI HITOSHI , KOMENO TOSHIAKI , TAKAHASHI TOSHIRO , KATAKURA YOSHINORI
IPC分类号： G01R29/24 , G01R31/00 , H05F3/04
摘要： PURPOSE:To obtain a stable decision result by charging a detection electrode, which is arranged in an ion atmosphere, electrostatically and then comparing the time up to when its potential drops to a predetermined potential. CONSTITUTION:When an inspection start is indicated through an external input 8, a timer part 6 closes a switch 2. Consequently, a DC voltage source 3 supplies a specific DC current to the detection electrode 1. At this time, the detection electrode 1, for example, is charged electrostatically for a time ts with a potential VM. The specific time ts is counted by the timer part 6 and then the switch 2 is opened to disconnect the electrode 1 from the DC voltage source 3 electrically. Then a surface electrometer 4 begins to measure the potential of the electrode 1 and the timer part 6 measures the time up to when the potential drops to the predetermined potential ts. Thus, the destaticization effect is decided according to the attenuation characteristics of the potential with time, so the stable decision result is obtained.

82. 发明专利

JPH0257304A PURE WATER FEEDING METHOD FOR SEMICONDUCTOR MANUFACTURING DEVICE 失效
公开(公告)号：JPH0257304A
公开(公告)日：1990-02-27
申请号：JP20842588
申请日：1988-08-24
申请人： HITACHI LTD , HITACHI YONEZAWA DENSHI KK
发明人： MATSUURA TAKAO
IPC分类号： B28D7/00 , H01L21/301 , H01L21/304 , H01L21/78
摘要： PURPOSE:To lower specific resistance of pure water stably by setting a piping of pure water meandering after a section where CO2 gas is injected by an injection mechanism and feeding the pure water passed through said piping. CONSTITUTION:When pure water is fed from an inlet 11 side of a piping 2, CO2 gas in a tank 3 is passed through a feeding pipe 8 by way of an injection mechanism 4 in order to set the given specific resistance value. CO2 gas flows in the piping 2 in the foaming shape together with pure water, and as the piping 2 meanders and the flow speed of respective sections on the cross section, the direction crossing the flow direction of respective sections, is different, a part of the flow of pure water makes vortex when the piping 2 flows in the bending sections, and CO2 gas is agitated. The piping 2 bends at a plurality of sections, and at every bending, CO2 gas is agitated and fed to a semiconductor manufacturing device through an outlet 12. In case the flow of pure water is varied, specific resistance sensing value of a specific resistance sensing sensor 10 is varied, and said value is compared with a desired value in a comparison section 9, and feeding volume of CO2 gas is set by operating the adjusting mechanism 7 according to the sensed value to maintain specific resistance almost constant.

83. 发明专利

JPH0251049A METHOD AND APPARATUS FOR INSPECTING ELECTRONIC COMPONENT 失效
公开(公告)号：JPH0251049A
公开(公告)日：1990-02-21
申请号：JP19991188
申请日：1988-08-12
申请人： HITACHI LTD , HITACHI YONEZAWA DENSHI KK
发明人： YOKOYAMA SHIYOUICHI
IPC分类号： G01N21/88 , G01N21/93 , H01L21/66
摘要： PURPOSE:To reduce inspection time automatically by a method wherein light is emitted inclined to the bottom surface a package and received to allow measurement of a deformation of a lead. CONSTITUTION:A roughly U-shaped sensor 7 is provided with a light emitting section 8 for laser light with a diameter thereof almost the same as a width of a lead and supported with a vertically movable block 3 as a light receiving section 9 stands lower than the light emitting section 8. Electronic components are moved all with a frame body 13 so that the sensor 7 is located at a position (hereafter called origin) upward outside a lead to be measured initially. Then, as the sensor 7 lowers through the block 3, components 23 are moved continuously. In this manner, positions specified by laser light are measured sequentially from the origins and are compared with a reference lead pitch data to calculate a pitch and an inclination of the lead. Since light is emitted and received with the title sensor laser can hit the lead to be measured only.

84. 发明专利

JPH0236366A METHOD AND DEVICE FOR ELECTROSTATIC DETECTION 失效
公开(公告)号：JPH0236366A
公开(公告)日：1990-02-06
申请号：JP18564488
申请日：1988-07-27
申请人： HITACHI LTD , HITACHI YONEZAWA DENSHI KK
发明人： TAKAHASHI TOSHIRO
IPC分类号： G01R29/12 , G01R29/24 , H01L21/66 , H05F3/00
摘要： PURPOSE:To preclude abnormal output even when an unexpected voltage which is higher than specific is detected by detecting static electricity and outputting abnormality when the frequency of the detection of static electricity exceeding the specific voltage level exceeds a frequency within a specific time or within the specific number of times of detection. CONSTITUTION:The output of the sensor 1 which includes a detection electrode 2, a rotary sector 4, a motor 5, and a shift 6 is connected to the operational amplification part 7 including a counter 14. When a semiconductor device 21 as a body to be detected passes below the electrode 2 while the sector 4 is rotated by the motor 5 through the shaft 6, lines of electric force are generated intermittently between the device 21 and electrode 2 when the package 22 of the device 21 is charged electrostatically, and an AC signal is amplified and rectified by the amplification part 7 to obtain a DC voltage proportional to the charged voltage of the device 21. This voltage is held by a peak holding circuit 9 for a constant period, fetched to a comparator 13, and compared with a set voltage by a comparison voltage source 12, and when a voltage of >=100V is detected >=2 times in a period of 30 seconds wherein the preset signal of a rate generator 15 is generated, the device 21 is stopped urgently with the output of the counter 14.

85. 发明专利

JPS6481245A METHOD AND DEVICE FOR MANUFACTURING ELECTRONIC COMPONENT 失效
公开(公告)号：JPS6481245A
公开(公告)日：1989-03-27
申请号：JP23721987
申请日：1987-09-24
申请人： HITACHI LTD , HITACHI YONEZAWA DENSHI KK
发明人： TAKAHASHI KENICHI , TAKAHASHI NORIYUKI
IPC分类号： B65B5/00 , B65G47/57 , B65G65/42 , H01L21/68 , H05K13/02
摘要： PURPOSE:To reduce operation by eliminating manual operation, detecting endless belt which takes out magazines from a hopper holding a large number of magazines with certain directionality and the front/back of magazines and installing alignment mechanism for reversing the magazines if they are found to be in reverse. CONSTITUTION:A magazine 4 is randomly supplied to a hopper 2 in its longer direction. If the first endless belt 8 rotates, a nib 10 comes into contact with the magazine 4 and the magazine is ejected from the hopper 2 while an opening 6 is nearly in parallel to the endless belt 8. After that, the magazine 4 is conveyed on a table 13 by the second endless belt 14, which is suspended by an escape nib 17, and the magazines 4 are separated one by one and are conveyed in sequence. The conveyance of separated magazines 4 is suspended by an inversion lever 20. In this status, a lever 19 expands to allow front/back of the magazines 4 to be detected. When the surface of magazines 4 is detected to be back. The inversion lever 20 ascends, one side is lifted, and is inverted. In this manner, the magazines 4 are inverted and they are aligned and conveyed.

86. 发明专利

JPS6454741A BONDING METHOD AND DEVICE 失效
公开(公告)号：JPS6454741A
公开(公告)日：1989-03-02
申请号：JP21012287
申请日：1987-08-26
申请人： HITACHI LTD , HITACHI YONEZAWA DENSHI KK
发明人： YAMAGUCHI YOSHIHIKO , HASEGAWA TAKESHI
IPC分类号： H01L21/607 , H01L21/60
摘要： PURPOSE:To reduce the resonance of a lead frame, to improve the sliding efficiency of a wire on a joint surface and to prevent a mistake on joining by giving two kinds or more of vibrations to one of a body to be joined or another member. CONSTITUTION:When a bonding arm 1 is lowered and a wire projected from the tip of a capillary 8 is brought into contact with a body to be joined, a power supply 9 drives a piezoelectric element 2, a power supply 11 controls a piezoelectric element 3, the length and volume of the arm 1 are adjusted, vibrations of 40kHz are transmitted over the wire 13 through the capillary 8 efficiently, and the wire 13 is slid at 40kHz on the body to be joined. Likewise, vibrations of 40, 50 and 60kHz are applied at one interface. A bonding body is not resonated and the wire is joined in vibrations of 40 or 50kHz when the natural frequency of the bonding body is 60kHz, and no wire is peeled because the bonding body and the wire are resonated even when 60kHz is applied subsequently. According to the constitution, the bonding body and a body to be bonded can be joined when other frequency is applied even when the bonding body and the body to be bonded have resonance points, thus joining both bodies more positively than only the case of one kind of vibrations.

87. 发明专利

JPS6451644A SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPS6451644A
公开(公告)日：1989-02-27
申请号：JP20814187
申请日：1987-08-24
申请人： HITACHI LTD , HITACHI YONEZAWA DENSHI KK
发明人： WATABE SHINICHI
IPC分类号： H05K1/18 , H01L23/50
摘要： PURPOSE:To load other electronic parts to the lower section of a package on mounting to a printed mounting board for a semiconductor substrate, and to enable high density packaging by bringing the height of the stand-off of the semiconductor device to the thickness or more of the package. CONSTITUTION:The height 4 of stand-off is made larger than the thickness of a package 2, and space only in the height section of stand-off height 4 is formed in the lower section of the package 2 for a semiconductor device 1 on mounting to a printed board 6. Accordingly, small electronic parts 7 housed into the space can be loaded to the lower section of the package 2 for the semiconductor device 1.

88. 发明专利

JPS6427904A METHOD AND APPARATUS FOR DICING 失效
公开(公告)号：JPS6427904A
公开(公告)日：1989-01-30
申请号：JP18338887
申请日：1987-07-24
申请人： HITACHI LTD , HITACHI YONEZAWA DENSHI KK
发明人： TSUCHIDA KIYOSHI , ABE YOSHIO
IPC分类号： B28D5/00 , H01L21/301 , H01L21/78
摘要： PURPOSE:To reduce scattering of cutting scraps falling with washing water and to reduce adhesion of the cut scraps on a wafer, by facing a cut groove forming face of the wafer downward and carrying out dicing by rotating a rotating blade from the bottom of the wafer. CONSTITUTION:A wafer 2 is held under such a condition that the cut groove forming face is faced downward, and dicing is carried out under such a condition that a rotating blade 4 is rotated and washing water is sprayed from a nozzle 7 around the part of the wafer 2 where the cut groove should be formed. Cut scraps produced by dicing are scattered in the opposite direction to the forwarding direction of the rotating blade 4 by the flow of the washing water 8 and the centrifugal force of the rotating blade 4. The cut scraps fall down due to the dead weight but do not fall down on the wafer 2 because the wafer 2 is positioned above the rotating blade 4. Even if the cut scraps with water drops of the washing water adhere on the main surface of the wafer 2, the cut scraps fall down by the dead weight owing to vibration of dicing and so on, and remaining of the cut scraps on the main surface of the wafer 2 is thereby reduced.

89. 发明专利

JPS6413733A METHOD AND APPARATUS FOR MANUFACTURING SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPS6413733A
公开(公告)日：1989-01-18
申请号：JP16874687
申请日：1987-07-08
申请人： HITACHI LTD , HITACHI YONEZAWA DENSHI KK
发明人： YAMAGUCHI YOSHIHIKO
IPC分类号： H01L21/50
摘要： PURPOSE:To reduce any damage on a substance to be carried by expanding a resilient body with gas or liquid for thereby softly clamping the substance utilizing resilient force of the resilient body and the same force of the gas or liquid contained in the gas or liquid. CONSTITUTION:With a lead frame 13 being supplied into a guide rail 12, air is fed into through an air passage 4 to expand a rubber material 5. The rubber material 5 so expanded clamps the lead frame 13 vertically with use of rubber resilient force and that of air within the rubber material. The lead frame 13 clamped in such conditions is carried in a direction to be carried by moving a block 2 by rotation of a cam 9 via a bearing 8. Upon the rotation of the cam 9 being stopped and the movement of, the block 2 being stopped, air supply through the air passage 4 is stopped, allowing the rubber material 5 to return to the original conditions.

90. 发明专利

JPS641267A LEAD FRAME 失效
公开(公告)号：JPS641267A
公开(公告)日：1989-01-05
申请号：JP15548687
申请日：1987-06-24
申请人： HITACHI LTD , HITACHI YONEZAWA DENSHI KK
发明人： KIMURA HIDEAKI
IPC分类号： H01L23/50
摘要： PURPOSE:To reduce the deformation of a lead and to decrease a malfunction, such as a wire short-circuit by forming a section formed thinner than other lead over its longitudinal direction at the outer frame of a lead frame. CONSTITUTION:A lead frame in which part of the outer frame 2 of a lead frame 1 is thinned is prepared. (This thinned recess 9 is treated by etching or the like). Then, a pellet 10 is bonded (placed) by Ag paste on a tab 3. Then, a wire 11 is bonded by thermal press-bonding or the like. Even if a force F as shown in the drawing is applied in this state, since the recess 9 is formed thinner than the other section, the recess 9 is deformed due to its weak strength. If the force F is absorbed by the deformation of the recess 9, the deformation of inner leads 6 can be reduced. Thus, the deformation of the wire 11 upon deformation of the inner leads can be decreased.

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