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    • 85. 发明专利
    • Method of forming recess on surface
    • 形成表面的方法
    • JP2012054612A
    • 2012-03-15
    • JP2011264596
    • 2011-12-02
    • Molecular Imprints Incモレキュラー・インプリンツ・インコーポレーテッド
    • SITORGATA V SRINIVASAN
    • H01L21/3065H01L21/461H01L21/4763H01L21/768
    • H01L21/0337H01L21/3086H01L21/76816H01L21/76817
    • PROBLEM TO BE SOLVED: To form micro-shape recesses on a surface of a substrate.SOLUTION: A pattern formation layer having a first feature with first dimension and shape is formed on a surface. A second feature having a second dimension different from the first dimension is formed by etching the pattern formation layer. The second feature is covered with an adaptation layer, and the apex of the second feature is exposed by removing an upper part of the adaptation layer. Thereafter, an inverted shape of the shape having a second dimension different from the first dimension is formed by removing the second feature by plasma etching, together with an oxygen-based chemical action in which an in-situ curing mask is generated through interaction with the adaptation layer. The inverted shape is transferred to the surface.
    • 要解决的问题:在基板的表面上形成微型凹部。 解决方案:具有第一尺寸和形状的第一特征的图案形成层形成在表面上。 通过蚀刻图案形成层来形成具有与第一尺寸不同的第二尺寸的第二特征。 第二个特征被适配层覆盖,并且通过去除适配层的上部来暴露第二特征的顶点。 此后,通过等离子体蚀刻除去第二特征,形成具有不同于第一尺寸的第二尺寸的形状的倒置形状,以及通过与其相互作用而产生原位固化掩模的氧基化学作用 适应层 倒置的形状被转移到表面。 版权所有(C)2012,JPO&INPIT