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    • 76. 发明授权
    • Method of modifying a workpiece following laser shock processing
    • 激光冲击加工后修改工件的方法
    • US07776165B1
    • 2010-08-17
    • US12201519
    • 2008-08-29
    • Jeff L. DulaneySteven M. TollerAllan H. Clauer
    • Jeff L. DulaneySteven M. TollerAllan H. Clauer
    • C21D1/09
    • C22F3/00C21D10/005C21D2261/00Y10T428/12493
    • A method of manufacturing a workpiece involves performing any one of various post-processing part modification steps on a workpiece that has been previously subjected to laser shock processing. In one step, material is removed from the compressive residual stress region of the processed workpiece. Alternately, the workpiece may be provided with oversized dimensions such that the removal process removes an amount of material sufficient to generate a processed workpiece having dimensions substantially conforming to design specifications. Alternately, the material removal process is adapted to establish a penetration depth for material removal that coincides with the depth at which the workpiece exhibits maximum compressive residual stress. Alternately, a first high-intensity laser shock processing treatment is performed on the workpiece, followed by the removal of material from the compressive residual stress region, and then a second low-intensity laser shock processing treatment is performed on the workpiece. Material may be removed from the compressive residual stress region through a workpiece surface different from the laser shock processed surface. Material may also be deposited onto the laser shock processed surface.
    • 制造工件的方法涉及对先前已进行了激光冲击加工的工件进行各种后处理零件修改工序中的任一种。 在一个步骤中,材料从加工的工件的压缩残余应力区域移除。 替代地,工件可以设置有尺寸过大的尺寸,使得去除工艺去除足以产生具有基本上符合设计规格的尺寸的加工工件的材料量。 替代地,材料去除过程适于建立与工件表现出最大压缩残余应力的深度一致的材料去除的穿透深度。 或者,对工件进行第一次高强度激光冲击加工处理,然后从压缩残余应力区域去除材料,然后对工件进行第二次低强度激光冲击加工处理。 材料可以通过不同于激光冲击处理表面的工件表面从压缩残余应力区域移除。 材料也可以沉积到激光冲击处理的表面上。
    • 77. 发明授权
    • Method of modifying a workpiece following laser shock processing
    • 激光冲击加工后修改工件的方法
    • US06852179B1
    • 2005-02-08
    • US09590866
    • 2000-06-09
    • Steven M. TollerAllan H. ClauerJeff L. Dulaney
    • Steven M. TollerAllan H. ClauerJeff L. Dulaney
    • C21D10/00C22F3/00
    • C22F3/00C21D10/005C21D2261/00Y10T428/12493
    • A method of manufacturing a workpiece involves performing any one of various post-processing part modification steps on a workpiece that has been previously subjected to laser shock processing. In one step, material is removed from the compressive residual stress region of the processed workpiece. Alternately, the workpiece may be provided with oversized dimensions such that the removal process removes an amount of material sufficient to generate a processed workpiece having dimensions substantially conforming to design specifications. Alternately, the material removal process is adapted to establish a penetration depth for material removal that coincides with the depth at which the workpiece exhibits maximum compressive residual stress. Alternately, a first high-intensity laser shock processing treatment is performed on the workpiece, followed by the removal of material from the compressive residual stress region, and then a second low-intensity laser shock processing treatment is performed on the workpiece. Material may be removed from the compressive residual stress region through a workpiece surface different from the laser shock processed surface. Material may also be deposited onto the laser shock processed surface.
    • 制造工件的方法涉及对先前已进行了激光冲击加工的工件进行各种后处理零件修改工序中的任一种。 在一个步骤中,材料从加工的工件的压缩残余应力区域移除。 替代地,工件可以设置有尺寸过大的尺寸,使得去除工艺去除足以产生具有基本上符合设计规格的尺寸的加工工件的材料量。 替代地,材料去除过程适于建立与工件表现出最大压缩残余应力的深度一致的材料去除的穿透深度。 或者,对工件进行第一次高强度激光冲击加工处理,然后从压缩残余应力区域去除材料,然后对工件进行第二次低强度激光冲击加工处理。 材料可以通过不同于激光冲击处理表面的工件表面从压缩残余应力区域移除。 材料也可以沉积到激光冲击处理的表面上。
    • 78. 发明申请
    • Laser peening method and apparatus using tailored laser beam spot sizes
    • 激光喷丸处理方法和设备采用定制的激光束斑点尺寸
    • US20040224179A1
    • 2004-11-11
    • US10434621
    • 2003-05-09
    • LSP Technologies, Inc.
    • David W. SokolAllan H. Clauer
    • B23K026/00B32B007/10
    • C21D10/005Y10T428/12458
    • A laser shock processing treatment enables a selectively adjustable and customized compressive residual stress distribution profile to be developed within a workpiece by tailoring the size and shape of the laser beam spots. One peening operation applies to the workpiece a first pattern having relatively large laser beam spots and then applies a second pattern having relatively small laser beam spots. The composite use of such small and large beam spots enables the stress distribution profile to be tailored to the part specifications. The large beam spots maximize the depth of compressive residual stress in the part, while the small beam spots optimize the surface compressive residual stresses of the part. The use of small spot beam patterns allows untreated or improperly processed areas to be laser peened.
    • 激光冲击加工处理使得能够通过调整激光束斑点的尺寸和形状来在工件内显现选择性可调节和定制的压缩残余应力分布轮廓。 一次喷丸操作适用于工件具有较大激光束斑点的第一图案,然后施加具有较小激光束斑点的第二图案。 复合地使用这种小的和大的光斑使得能够根据零件规格量身定制应力分布曲线。 大梁点最大化部件中压缩残余应力的深度,而小梁点优化部件的表面压缩残余应力。 使用小点光束图案可以对未经处理或未经处理的区域进行激光喷丸处理。
    • 79. 发明申请
    • Automated positioning of mobile laser peening head
    • 自动定位移动激光喷丸头
    • US20030217997A1
    • 2003-11-27
    • US10372523
    • 2003-02-21
    • LSP Technologies, Inc.
    • Allan H. ClauerJeff L. DulaneyDavid F. Lahrman
    • B23K026/00B23K026/03
    • G01N21/95B23K26/356B64F5/60C21D7/02
    • The present invention enables the processing head to locate itself precisely on the surface of the structure being processed, and to then reposition itself correctly for the next laser spot. Further, the present invention will complete processing a laser peened area, the area including a multiplicity of spots arranged in a specific pattern, and correctly laser peen each spot in the area under control of a controller including control linkages with the laser. The invention further provides an automated laser peening processing head encompassing spatial position sensing and locating means, as well as programmed spatial positioning, application of overlay materials, verification of proper overlay condition and positioning, and notification of the laser to pulse the surface of the structure.
    • 本发明使处理头能够精确地定位在正在处理的结构的表面上,并且随后重新定位它自己正确地为下一个激光点。 此外,本发明将完成处理激光喷丸区域,该区域包括以特定图案排列的多个斑点,以及在包括与激光器的控制连接的控制器的控制下的区域中的每个点的正确激光喷丸。 本发明还提供一种包括空间位置检测和定位装置的自动化激光喷丸处理头,以及编程的空间定位,覆盖材料的应用,适当覆盖条件和定位的验证,以及激光器通知结构的表面 。