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    • 71. 发明授权
    • Formation of vertical devices by electroplating
    • 通过电镀形成垂直装置
    • US08247905B2
    • 2012-08-21
    • US12538782
    • 2009-08-10
    • Hariklia DeligianniQiang HuangJohn P. HummelLubomyr T. RomankiwMary B. Rothwell
    • Hariklia DeligianniQiang HuangJohn P. HummelLubomyr T. RomankiwMary B. Rothwell
    • H01L29/40
    • H01L21/76879H01L21/2885Y10S205/925
    • The present invention is related to a method for forming vertical conductive structures by electroplating. Specifically, a template structure is first formed, which includes a substrate, a discrete metal contact pad located on the substrate surface, an inter-level dielectric (ILD) layer over both the discrete metal contact pad and the substrate, and a metal via structure extending through the ILD layer onto the discrete metal contact pad. Next, a vertical via is formed in the template structure, which extends through the ILD layer onto the discrete metal contact pad. A vertical conductive structure is then formed in the vertical via by electroplating, which is conducted by applying an electroplating current to the discrete metal contact pad through the metal via structure. Preferably, the template structure comprises multiple discrete metal contact pads, multiple metal via structures, and multiple vertical vias for formation of multiple vertical conductive structures.
    • 本发明涉及通过电镀形成垂直导电结构的方法。 具体地,首先形成模板结构,其包括衬底,位于衬底表面上的离散金属接触焊盘,分立金属接触焊盘和衬底两者之间的级间电介质(ILD)层,以及金属通孔结构 延伸穿过ILD层到分立的金属接触垫上。 接下来,在模板结构中形成垂直通孔,其延伸穿过ILD层到分立的金属接触垫上。 然后通过电镀在垂直通孔中形成垂直导电结构,电镀通过通过金属通孔结构将电镀电流施加到离散的金属接触焊盘来进行。 优选地,模板结构包括多个分立的金属接触焊盘,多个金属通孔结构以及用于形成多个垂直导电结构的多个垂直通孔。
    • 80. 发明授权
    • Method for controlling chemical species concentration
    • 控制化学物质浓度的方法
    • US5352350A
    • 1994-10-04
    • US837468
    • 1992-02-14
    • Panayotis C. AndricacosJohn O. DukovicLubomyr T. Romankiw
    • Panayotis C. AndricacosJohn O. DukovicLubomyr T. Romankiw
    • C23C18/16C23F1/00C25D21/14G03F7/30G05D11/13G05D21/02C25D21/18C25D21/20
    • G03F7/3071C23C18/1617C23F1/00C25D21/14G05D11/139G05D21/02B01J2208/00628
    • A method is described for maintaining constant chemical composition in solutions used for wet chemical processing. All chemical species that are deliberately included in the bath are kept at constant concentration primarily by a method of compensating for their depletion or generation with a set of feed solutions that are formulated and dosed into the bath in accordance with an overall material balance. Further, all chemical species not deliberately included in the bath are kept at constant concentration primarily by keeping the aggregate volume of replenishing stocks in strict proportion to the process service performed by the bath (e.g. the charge passed in an electroplating cell). Finally, a time-based scheme completes the control of the concentration of all bath species by controlling any species (whether deliberately included in the bath or not) that is depleted or generated as the result of chemical reactions which occur independently and/or spontaneously with time. Maintaining all bath chemical species at constant concentration prevents bath aging and permits production of more uniform work pieces from the bath.
    • 描述了一种用于在用于湿化学处理的溶液中保持恒定化学成分的方法。 有意包含在浴中的所有化学物质主要通过补偿其消耗或产生的方法保持恒定浓度,所述方法通过根据整体物料平衡配制并投入浴中的一组进料溶液。 此外,不是故意包括在浴中的所有化学物质都保持恒定浓度,主要是通过保持补充料的总体积与由浴进行的处理服务(例如在电镀槽中通过的电荷)严格成比例。 最后,基于时间的方案通过控制任何物种(无论是故意包括在浴中)是否完全控制所有沐浴物种的浓度,由于化学反应的结果而耗尽或产生,这些化学反应独立地和/或自发地发生, 时间。 保持恒定浓度的所有浴化学物质可以防止沐浴老化,并允许从浴中生产更均匀的工件。