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    • 72. 发明授权
    • Method for producing a biosensor
    • 生物传感器的制造方法
    • US08580571B2
    • 2013-11-12
    • US11710433
    • 2007-02-26
    • Taisei NishimiKoichi Kawamura
    • Taisei NishimiKoichi Kawamura
    • G01N33/487B05D5/00
    • G01N33/54393
    • Thus, the present invention provides a method for producing a biosensor comprising a substrate coated with a hydrophilic polymer, which comprises allowing a compound generating a reactive group as a result of external stimulus to bind to the surface of a substrate, and then giving external stimulus in a state where a hydrophilic polymer capable of forming a covalent bond with said reactive group is allowed to come into contact with the substrate, so that said hydrophilic polymer is allowed to bind to the substrate surface via a covalent bond with said reactive group.
    • 因此,本发明提供一种生物传感器的制造方法,其包括涂布有亲水性聚合物的基材,其包括使作为外部刺激的结果产生反应性基团的化合物结合到基材的表面,然后进行外部刺激 在能够与所述反应性基团形成共价键的亲水性聚合物与基材接触的状态下,使得所述亲水性聚合物通过与所述反应性基团的共价键与基材表面结合。
    • 73. 发明授权
    • Metallic pattern forming method, metallic pattern obtained thereby, printed wiring board using the same, and TFT wiring board using the same
    • 金属图案形成方法,由此获得的金属图案,使用该金属图案的印刷线路板以及使用该图案的TFT布线板
    • US08187664B2
    • 2012-05-29
    • US11815609
    • 2006-02-08
    • Kazuhiko MatsumotoKoichi KawamuraTakeyoshi Kano
    • Kazuhiko MatsumotoKoichi KawamuraTakeyoshi Kano
    • B05D5/12
    • C23C18/1608C23C18/1653C23C18/2086C23C18/30H05K3/182H05K3/387H05K2203/0545
    • The invention provides a method of forming a metallic pattern including: (a) forming, in a pattern form on a substrate, a polymer layer which contains a polymer that has a functional group that interacts with an electroless plating catalyst or a precursor thereof; (b) imparting the electroless plating catalyst or precursor thereof onto the polymer layer; and (c) forming a metallic film in the pattern form by subjecting the substrate having the polymer layer to electroless plating using an electroless plating solution, wherein the substrate is treated using a solution comprising a surface charge modifier or 1×10−10 to 1×10−4 mmol/l of a plating catalyst poison before or during the (c) forming of the metallic film. The invention further provides a metallic pattern obtained thereby. Furthermore, the invention provides a printed wiring board and a TFT wiring board, each of which uses the metallic pattern as a conductive layer.
    • 本发明提供一种形成金属图案的方法,包括:(a)以图案形式在基底上形成聚合物层,该聚合物层含有具有与化学镀催化剂或其前体相互作用的官能团的聚合物; (b)将化学镀催化剂或其前体赋予聚合物层; 和(c)通过使用具有聚合物层的基板进行化学镀以形成金属膜,使用化学镀溶液进行无电镀,其中使用包含表面电荷调节剂的溶液或1×10 -10至1 在(c)形成金属膜之前或期间,电镀催化剂毒素为×10-4mmol / l。 本发明还提供了由此获得的金属图案。 此外,本发明提供一种印刷线路板和TFT布线板,其中每个都使用金属图案作为导电层。