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    • 73. 发明申请
    • Method and apparatus for plasma processing
    • 等离子体处理方法和装置
    • US20050145340A1
    • 2005-07-07
    • US11067628
    • 2005-02-28
    • Tomohiro OkumuraIchiro Nakayama
    • Tomohiro OkumuraIchiro Nakayama
    • H01J37/32H01L21/306
    • H01J37/321
    • A plasma processing method includes controlling a pressure of an interior of a vacuum chamber to a specified pressure by exhausting the interior of the vacuum chamber while supplying gas into the interior of vacuum chamber. While the pressure of the interior of the vacuum chamber is being controlled, high-frequency power is supplied to one end of a first conductor which is opened at another end, and which is configured as a vortex. Also, grounding one end of a second conductor which is opened at another end and which is configured as a vortex. Finally, electromagnetic waves from the first conductor and the second conductor radiate into the vacuum chamber, generating plasma in the vacuum chamber and processing a substrate placed on the electrode within the vacuum chamber.
    • 等离子体处理方法包括通过在将真空室内的气体供给到真空室内部的同时排出真空室的内部来将真空室的内部压力控制到规定的压力。 在控制真空室内部的压力的同时,将高频功率供给到在另一端开放的第一导体的一端,并被配置为涡流。 另外,将第二导体的一端接地,该第二导体在另一端开放,并被构造为涡流。 最后,来自第一导体和第二导体的电磁波辐射到真空室中,在真空室中产生等离子体并处理放置在真空室内的电极上的衬底。